• Journal of the Korean Society of Clothing and Textiles
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• v.23 no.7
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• pp.987-997
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• 1999

The purpose of this study was finding out the appropriate cleaning method for buried fabrics from old tombs focusing on the conservation of textiles. Cleaning effects and physical properties change depending on cleaning method have been analysed, The following results were obtained from this study : 1. Wet cleaning showed better effect on the cleaning of fabrics compared to solvent cleaning which meant more water-soluble soils existed than oily soils. 2. All the cleaning methods used did not cause any distorsion or shrinkage to the fabrics because fabrics had been stabilized for a long time 3. Addition of detergent to cleaning system decreased the friction of fiber during cleaning rocess so that the damage of fabrics could be minimized., 4. Ironing is an undesirable process because heat remarkably weakened fibers.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.114-118
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• 2009

PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

• Journal of the Korean Society of Costume
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• v.54 no.1
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• pp.1-10
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• 2004

The purpose of this study was to compare the efficiency of four different cleaning method of silk and to fabrics, which were excavated from the sixteenth century tombs. The four cleaning methods were hand washing in water and hand washing in solvent, washing in ultrasonic cleaner, and using of ultrasonic gun after washing in ultrasonic cleaner. The following is the result of the experiment: ㆍBoth silk and jute fabrics shrank the most after hand-wash in water. This cleaning method decreased their thickness the most but changed their strength the least. However, the color of the fabric changed the most after had-wash in water. This washing method might discolor the dyed fabric, so one must check the condition of the fabric thoroughly before washing it. ㆍThe weight and the thickness of the fabric changed little after ultrasonic cleaning. This cleaning method, therefore. is less efficient than hand-water-wash. The use of ultrasonic gun after ultrasonic wash for partial cleansing enhanced the efficiency a little. Nevertheless, this method left stain around the area where the gun was used, and the injected water could damage the fabric. ㆍThe excavated fabric became softer in the cleaning process as the dirt was washed away. In both cases of silk and jute fabrics cleaning, solvent made the fabric softer than water. Washed in solvent, the fabric did not swell. But water penetrated to the fiber during the cleaning process and made the fabric swell. When the water evaporates, the swollen fiber structure collapses and the fabric become stiff. Ultrasonic wash did not cause much change in the flexibility of the fabric, for this method does not remove the dirt as effectively as the other method.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.295-298
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• 2015

Ozone micro-bubble cleaning system was designed, and made to develop a unique technique to clean wafers by using ozone micro-bubbles. The ozone micro-bubble cleaning system consisted of loading, cleaning, rinsing, drying and un-loading zones, respectively. In case of the cleaning the silicon wafers of a solar cell, more than 99 % of cleaning efficiency was obtained by dipping the wafers at 10 ppm of ozone for 10 minutes. Both of long cleaning time and high ozone concentration in the wet-solution with ozone micro-bubbles reduced cleaning efficiency because of the re-sorption of debris. The cleaning technique by ozone micro-bubbles can be also applied to various wafers for an ingot and LED as an eco-friendly method.

• Laser Solutions
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• v.12 no.4
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• pp.17-25
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• 2009

The surface cleaning method based on the laser-induced breakdown (LIB) of gas and subsequent plasma and shock wave generation can remove small particles from solid surfaces. In the laser shock cleaning (LSC) process, a high-power laser pulse induces optical breakdown of the ambient gas above the solid surface covered with contaminant particles. The subsequently created shock wave followed by a high-speed flow stream detaches the particles. In this work, a novel surface cleaning process using laser-induced breakdown of liquid is introduced and demonstrated. LIB of a micro liquid jet increases the shock wave intensity and thus removes smaller particle than the conventional LSC method. Experiments demonstrate that the cleaning force and cleaning efficiency are also increased significantly by this method.

• Korean Journal of Materials Research
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• v.28 no.8
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• pp.440-444
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• 2018

An effective cleaning method for Ni removal in Ni-induced lateral crystallization(Ni-MILC) poly-Si TFTs and their electrical properties are investigated. The HCN cleaning method is effective for removal of Ni on the crystallized Si surface, while the nitric acid treatment results decrease by almost two orders of magnitude in the Ni concentration due to effective removal of diffused Ni mainly in the poly-Si grain boundary regions. Using the HCN cleaning method after the nitric acid treatment, re-adsorbed Ni on the Si surfaces is effectively removed by the formation of Ni-cyanide complexions. After the cleaning process, important electrical properties are improved, e.g., the leakage current density from $9.43{\times}10^{-12}$ to $3.43{\times}10^{-12}$ A and the subthreshold swing values from 1.37 to 0.67 mV/dec.

• Clean Technology
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• v.14 no.2
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• pp.103-109
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• 2008

In this study, in order to develop evaluation method of the cleaning efficiency of residual flux which remains on the surface after soldering with solder paste, a specially designed metal tool is used to reduce spread uncertainty of flux while soldering. Using this tool, the measurement of cleaning efficiency of flux after soldering for some typical alternative semi-aqueous cleaners and 1,1,1-TCE by weighing method was conducted. As the test result of cleaning efficiency for each cleaner at several different cleaning times, the precision of the data is confirmed to within about 4% relative standard deviation (RSD) range. So, it is considered that this would be a good evaluation method for evaluating the cleaning efficiency of the residual flux which remains after solder paste soldering in the alternative cleaning. The results of this test method shows that the cleaning efficiency of ST 100SX and Neozal 750H in the cleaning of residual flux was better than other semi-aqueous cleaners, but its cleaning efficiency was clearly inferior to 1,1,1-TCE.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2017.05a
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• pp.272-273
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• 2017

As businesses put a greater emphasis on outward appearances, the demand for external window cleaning has been on the rise. However, with the conventional labor-intensive window cleaning method, it is hard to meet this demand. Therefore, this study proposes a Life Cycle Cost (LCC) analysis model for a guiderail-type cleaning robot, and estimate the LCCs of the conventional method and the cleaning robot. The findings of this research are expected to serve as a guide for future development of a cleaning robot.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.10a
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• pp.162-163
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• 2016

Conventional window cleaning method has a number of limitations, for example, workers dependent and high crash risk. The purpose of this study is to derive the performance requirements of a window cleaning apparatus through technology survey. For this, we investigated the domestic and international patents related to window cleaning, and interviewed experts in the field of window cleaning and mechanical design. Through this research, we have proposed performance requirements of the window cleaning apparatus.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.7-10
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• 2016

The post cleaning method for clean the shadow mask using in OLED (organic light emitting diode) emitter layer is always reforming. The cleaning solution and analysis method of shadow mask is still lack and not optimized. We use the simple and useful analytical method to determine the quantity and quality of organic and inorganic residue on surface of shadow mask. Finally analyze the cleaning solution using Raman spectroscopy efficiently.