• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.155-159
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• 2002

This paper describes the development process of mosquito trap with the effect of air cleaning by using the substance-field analysis and evolution pattern of systems in the theory of inventive problem solving (TRIZ). We g(It the concept of the mosquito trap with mosquito attractants instead of mosquito reluctants such as mosquito stick coil and skin medicine with bad and toxic smell. The number of mosquitos traped by one trap near cattle shed per one night in summer, was over 10 thousands with some effects of air cleaning

• Journal of the Korea Fashion and Costume Design Association
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• v.21 no.4
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• pp.213-220
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• 2019

The dry cleaning effect related to the type of soil and fiber was analyzed using silicone and alcohol-based solvents(ethyl alcohol, isopropyl alcohol, acetone) that are relatively safe for the human body and environment to improve the detergency of hydrophilic soils in dry cleaning system. Based on this analysis, an effective dry cleaning method to be carried out for improving the detergency according to the type of hydrophilic soils. After dry cleaning was performed using 20 types of artificial soiled fabrics consisting of 7 types of fibers and 4 types of hydrophilic soils, the detergency was measured and the results were compared and analyzed by solvents and fiber types. The results are presented as follows; first, the detergency of hydrophilic soils using silicone solvents showed a low rate of detergency. In particular, the tannin soil showed a lower level of detergency compared to the protein soil. Second, the detergency of hydrophilic soils using silicon solvents with dry soap differed in some detergency according to the soil and fiber types. Especially, the detergency of curry soil on cotton fabric showed significant improvement. Third, the protein soil was not removed from dry cleaning using alcohol-based solvents, but the effect of dry cleaning of curry soil on both cotton and polyester fabric was substantially improved. As a result, the elimination of blood soil is more effective in silicon solvents than in alcohol-based solvents. The removal of tannin soils may improve detergency by adding dry soap to silicon solvents or by using alcohol-based solvents as alternative solvents. The use of alternative solvents such as silicon and alcohol solvents can contribute to the environmental improvement of the dry cleaning industry, which uses petroleum-based solvents. It is also expected to provide consumers with the opportunity to choose eco-friendly and efficient dry cleaning methods.

• Journal of Korean Society of Steel Construction
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• v.21 no.1
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• pp.55-62
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• 2009

Blast cleaning has been applied in steel bridges for cleaning forged surface and increasing adhesive property of applied coating systems. Blasting is the operation of cleaning or preparing a surface by forcible propelling a stream of abrasive metals against it. Blast cleaning may improve surface geometry and induce compressive residual stress, and eventually may increase fatigue life of weld joints. In this paper, fatigue tests were carried out on three types of non-load-carrying fillet welded cruciform joints, as-welded joints, blast-treated joints, and stress-relieved joints after blasting, in order to investigate effect of blast cleaning on fatigue behavior of the weld joints. By Blast cleaning, the weld toe radius was increased by 29% and compressive residual stress was induced near weld toes. Blast cleaning increased fatigue life and fatigue endurance limit of the weld joints. When the applied stress ranges decreased, the increment in fatigue life became larger. About a 150% increase in fatigue limit could be realized by using blast cleaning.

• Journal of Korean Society of Water and Wastewater
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• v.29 no.4
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• pp.459-468
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• 2015

Deposits discharged through the cleaning mainly were cement mortar, bitumen paintings and rust pieces, and fragments of perforation, stones and gravels. Deposits were more removed through swabbing pig cleaning rather than air scouring cleaning on the whole. However, air scouring cleaning were not influenced by the constraint conditions such as a change in the diameter or the presence of the valve in water mains compare to swabbing pig cleaning. So, it was thought that air scouring cleaning might be more favorable to water distribution network cleaning in the future. After the cleaning, water quality including residual chlorine and turbidity also was improved because of the removal of a significant amount of the deposits. Therefore, if the cleaning is continuously and regularly implemented in water mains, it is expected that it will help to recover the reliability and to preserve the health of water quality.

• Journal of the Korean Society of Safety
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• v.14 no.1
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• pp.86-92
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• 1999

This study was carried out to investigate the effect of chemical cleaning of corrosion product on cooling system made of copper as a basic material and using cooling water as pure water. We studied chemical cleaning condition that minimizes the influence on basic material by means of EDTA solution so as to eliminate the slurry in cooling system. In addition, the proper amount of NALCO-39L (Nitrite-Borate-BZT mixture) as a inhibitor was determined in order to protect the copper in cooling system against corrosion after chemical cleaning and the effect of corrosion resistance on the copper surface treated was excelent in comparison with surface untreated. As a result, we found that the main components of sludge in cooling system produced by corrosion of copper were $Cu_2O$, CuO, Cu, and Fe. The optimum condition of chemical cleaning was 400ppm EDTA solution at $60^{\circ}C$. Inhibitor concentration needed to treat the surface of pure copper was 15～20ppm per unit area and corrosion rate of copper treated with 500ppm inhibitor solution for 72 hrs at $60^{\circ}C$ was remarkably decreased as compared with that of pure copper.

• The Journal of Advanced Prosthodontics
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• v.4 no.4
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• pp.192-196
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• 2012

PURPOSE. The purpose of this study was to evaluate the effect of provisional cement removal by different dentin cleaning protocols (dental explorer, pumice, cleaning bur, Er:YAG laser) on the shear bond strength between ceramic and dentin. MATERIALS AND METHODS. In total, 36 caries-free unrestored human third molars were selected as tooth specimens. Provisional restorations were fabricated and cemented with eugenol-free provisional cement. Then, disc-shaped ceramic specimens were fabricated and randomly assigned to four groups of dentin cleaning protocols (n = 9). Group 1 (control): Provisional cements were mechanically removed with a dental explorer. Group 2: The dentin surfaces were treated with a cleaning brush with pumice Group 3: The dentin surfaces were treated with a cleaning bur. Group 4: The provisional cements were removed by an Er:YAG laser. Self-adhesive luting cement was used to bond ceramic discs to dentin surfaces. Shear bond strength (SBS) was measured using a universal testing machine at a 0.05 mm/min crosshead speed. The data were analyzed using a Kolmogorov Smirnov, One-way ANOVA and Tukey HSD tests to perform multiple comparisons (${\alpha}$=0.05). RESULTS. The dentin cleaning methods did not significantly affect the SBS of ceramic discs to dentin as follows: dental explorer, pumice, cleaning bur, and Er:YAG laser. CONCLUSION. The use of different cleaning protocols did not affect the SBS between dentin and ceramic surfaces.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.88-89
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• 2009

In this paper, we investigated about wet cleaning effect as deep trench formation methods for Power chip devices. Deep trench structure was classified by two methods, PSU (Poly Stick Up) and Non-PSU structure. In this paper, we could remove residue defect during wet. cleaning after deep trench etch process for non-PSU structure device as to change wet cleaning process condition. V-SEM result showed void image at the trench bottom site due to residue defect and residue component was oxide by EDS analysis. In order to find the reason of happening residue defect, we experimented about various process conditions. So, defect source was that oxide film was re-deposited at trench bottom by changed to hydrophobic property at substrate during hard mask removal process. Therefore, in order to removal residue defect, we added in-situ SCI during hard mask removal process, and defect was removed perfectly. And WLR (Wafer Level Reliability) test result was no difference between normal and optimized process condition.

• Korean Journal of Materials Research
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• v.31 no.2
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• pp.97-100
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• 2021

We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

• Journal of Korean Society of Steel Construction
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• v.20 no.5
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• pp.583-590
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• 2008

Blasting has been applied in newly-built steel structures for cleaning forged surfaces and increasing the adhesive property of applied painting systems. However, the effect of the blast cleaning on fatigue behavior of welded joints is not clear. In this paper, fatigue tests were carried out on out-of-plane gusset welded joints and the effect of the blast cleaning on the fatigue behavior was studied. The curvature radius at the weld toe of the surface-treated specimens by using the blast method is larger than that of as-welded specimens. By the blast cleaning compressive residual stresses were induced into weld toes. The experimental results showed that the fatigue life of surface-treated specimens is longer than that of as-welded specimens, even though the fatigue life of surface-treated specimens and that of as-welded specimens are not clearly different in the high stress range. About a 160% increase in fatigue limit could be realized by using blast cleaning.