• Title/Summary/Keyword: Circular Cutting

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Analysis of Non-uniform Tension Effect on Dynamic Characteristics of Spinning Circular Plates in the Wafer Cutting Machine (웨이퍼 가공기에서 회전 원판의 동특성에 미치는 불균일 장력의 영향 분석)

  • 임경화
    • Journal of KSNVE
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    • v.8 no.2
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    • pp.324-330
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    • 1998
  • The forced vibration analysis of the outer-clamped spinnig annular disk with arbitrary in-plane is formulated to investigate the influence of non-uniform tension on the cutting accuracy of wafer cutting machine. The arbitrary in-plan force along the outer edge of an annular plate is expressed as a Fourier series. Galerkin method and modal superposition method are employed to obtain the forced responses under the static force and the impulse force in astationary coordinate. Through qualitative and quantitative analyses, it can be found that forced and impulse responses are sensitive to the non-uniformity of in-plane force, which can bring a bad effect to the accuracy of wafer cutting process. Also, in case of a spinning disk with non-uniform in-plane force, critical speed is required to define in a different way, compared with conventional definition in axi-symmetrical spinning disk.

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Development of Scribing Machine for Dicing of GaN Wafer (GaN 웨이퍼의 다이싱을 위한 스크라이빙 머신의 개발)

  • Cha, Young-Youp;Go, Gyong-Yong
    • Journal of Institute of Control, Robotics and Systems
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    • v.8 no.5
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    • pp.419-424
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    • 2002
  • After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.

Optimization of Motion Control System on the Machine Tool (공작기계의 이송계 제어 시스템의 최적화)

  • 박인준;곽경남;백형래
    • Proceedings of the KIPE Conference
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    • 1997.07a
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    • pp.336-340
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    • 1997
  • This paper is a study about motor technic of motion and feedforward control in order to shape cutting control on the machine tool. The shape error caused by delay of the servo system in the direction of radius at the time of circular cutting is reduced by feedforward control, shape error generated by the position command delay is minimized by using the acceleration/deceleration time constant after the interpolation. The study was verified to optimization of motion control on experiments of a vertical machining center of the machine tool.

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Development of Scribing Machine for Semiconductor Wafer (반도체 웨이퍼용 스크라이빙 머신의 개발)

  • 차영엽;최범식;고경용
    • 제어로봇시스템학회:학술대회논문집
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    • 2000.10a
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    • pp.222-222
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    • 2000
  • The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In older to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber and precision servo mechanism in order to dice a semiconductor wafer.

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Polarization-Diversity Cross-Shaped Patch Antenna for Satellite-DMB Systems

  • Lim, Jong-Hyuk;Back, Gyu-Tae;Yun, Tae-Yeoul
    • ETRI Journal
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    • v.32 no.2
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    • pp.312-318
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    • 2010
  • A small reconfigurable patch antenna is proposed to achieve polarization diversity for digital multimedia broadcasting systems at 2.6 GHz. To obtain polarization diversity, a pair of on-slit PIN diodes is inserted in each diagonal of a cross-shaped patch. Thus, four PIN-diodes on these slits are utilized to change the connection of the slits and thus achieve polarization. Bias circuits for the diodes are allocated in the cutting corner of the cross-shaped patch to minimize the antenna size. The antenna produces left-hand circular polarization, right-hand circular polarization, or linear polarization, depending on the PIN-diode status. Analysis of circular polarization operation is explicated. Measurements show a gain of about 1.5 dB, a cross polarization of about -20 dB, and an axial ratio of about 2.5 dB.

Transent Thermal Stresses in a Thin Circular Disk due to a Moving Point Source of Heat on a Concentric Circle (원판(圓板)에서 동심원상(同心圓上)을 이동(移動)하는 열원(熱源)에 의(依)한 과도적(過渡的) 열응력해석(熱應力解析))

  • Hyo-Chul,Kim
    • Bulletin of the Society of Naval Architects of Korea
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    • v.12 no.2
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    • pp.13-34
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    • 1975
  • Analytical solutions for the transient temperature distribution and quasi-static thermal stresses which arise in a thin circular disk of finite radius subjected to an instantaneous point source acting in its interior have been obtained. And the solutions have been extended to the case of a moving heat source with the aid of the Duhamel's superposition integral. The solutions given are in the form of double infinite serieses, and their numerical results have been compared with the experimental temperature histories. It can be found out that the theoretical histories of thermal stresses show a good agreement with the experimental results and the theoretical histories of thermal stresses show a good qualitative agreement with a physical phenomena. The solutions can be applied to the problems such as a flame hardening of the cylindrical machine elements and a circular patch welding or a circular cutting of the structural member.

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Tool-path Generation for a Robotic Skull Drilling System (로봇을 이용한 두개골 천공 시스템의 공구 경로 생성)

  • Chung, YunChan
    • Korean Journal of Computational Design and Engineering
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    • v.18 no.4
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    • pp.243-249
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    • 2013
  • This paper presents a tool-path generation methods for an automated robotic system for skull drilling, which is performed to access to some neurosurgical interventions. The path controls of the robotic system are classified as move, probe, cut, and poke motions. The four motions are the basic motion elements of the tool-paths to make a hole on a skull. Probing, rough cutting and fine cutting paths are generated for skull drilling. For the rough cutting path circular paths are projected on the offset surfaces of the outer top and the inner bottom surfaces of the skull. The projected paths become the paths on the top and bottom layers of the rough cutting paths. The two projected paths are blended for the paths on the other layers. Syntax of the motion commands for a file format is also suggested for the tool-paths. Implementation and simulation results show that the possibility of the proposed methods.

Design of Elliptical Gears for Wire Cutting (타원형 기어의 와이어커팅을 위한 설계)

  • Lee, Sung-Chul
    • Tribology and Lubricants
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    • v.23 no.4
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    • pp.149-155
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    • 2007
  • The CAD model of a elliptical gear for wire cutting has been developed. The rolling contact of pitch ellipses whose rotation axes coincide with their focus has been analyzed, and the perimeter of the pitch ellipse has been divided into equal-length segments by the number of teeth. A master tooth profile, which is a composite curve of circular arcs that represents involute, has been introduced. The elliptical gear has been designed by imposing the master tooth on the divided points of the pitch ellipse, and a full fillet has been achieved between neighbour teeth. Thus, the whole profile of an elliptical gear is a composite curve of arcs only, and consequently NC codes for wire cutting can be easily generated. Furthermore, a computer simulation program is developed to verify the mesh of the elliptical gear.

Morpholgical Characteristics of Hair Section According to Cutting Tools (커트 도구에 따른 모발 절단면의 형태학적 특성)

  • Lee, Gui-Young;Roh, Jung-Ae;Chang, Byung-Soo
    • Applied Microscopy
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    • v.38 no.4
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    • pp.347-351
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    • 2008
  • The morphological characteristics of the cut sections of hair using razor, clipper and scissors were investigated with scanning electron microscopy. With the razor, the cutting section had a long elliptical form and a rhythmical ribbon shape. It was curved outward since the end part of it became thinner. With the scissors, the cutting section had a flat, circular form. It seemed to be because the scissors imposed a constant strength on the hair. With the clipper, the cutting section had also a circular form but a layer of the macrofibril was generated in the middle part of the cortex. It seemed to be generated while the rapidly moving blades of the clipper cut the hair in an instant.