• Korean Journal of Computational Design and Engineering
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• v.9 no.4
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.10
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• pp.903-910
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• 2000

In this paper, we describe a slave chip based on the Profibus-DP protocol and a system board to verify the developed slave chip. The Profibus-DP protocol is designed using VHDL and implemented on FPGA. The system board adopting the developed FPGA is designed FPGA is designed in which the firmware is implemented on Intel 8051 by using C language. Among the Profibus-DP protocols, low level layers from the physical layer to the data link layer is implemented in the form of hardware that we are able to greatly reduce the CPU load in processing protocols, and then higher layers could be processed by software. These technologies result in an IP to make terminal devices in the distributed control systems. Therefore, many digital logics as well as communication logics can be implemented onto SOC(System On a Chip) and it could be applied to various fieldbus-related areas.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.3
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• pp.549-557
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• 2012

In this paper an on-chip photo energy harvesting system with MPPT(Maximum Power Point Tracking) control is proposed. The ISC(Integrated Solar Cell) is implemented using p-diff/n-well diodes available in CMOS processes. MPPT control is implemented using the linear relationship between the open-circuit voltage of a PV(Photovoltaic) cell and its MPP(Maximum Power Point) voltage such that a small pilot PV cell can track the MPP of a main PV cell in real time. Simulation results show that the designed circuit with the MPPT control delivers the MPP voltage to load even though the load is heavy such that the load circuit can operate properly. The proposed circuit is designed in 0.18um CMOS process. The designed main PV cell and pilot PV cell occupy $8mm^2$ and $0.4mm^2$ respectively.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.2051-2054
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• 2004

This paper proposes a more accurate task level energy measurement technique for high speed microprocessors. The technique is based on the relationship of the amount of current consumed by the microprocessor and the pulse width of the power supply controller chip, employed in the synchronous buck DC-DC converter in the microprocessor's power supply. The accuracy of the measurement is accomplished by measuring variation in pulse width in each power supply cycle. The major advantage of this technique is that its accuracy does not depend on the operating frequency of the microprocessor. To prove the proposed technique, we implemented the measurement unit of the microprocessor energy meter using an FPGA chip operating at 50 MHz. Both static and dynamic load measurement are tested in order to obtain some behaviours. Moreover, various commercially available mainboards which employ synchronous buck regulators at 200 KHz switching frequency, were measured. The results agree with previous works with better accuracy at higher operating frequency.

• Journal of Biomedical Engineering Research
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• v.22 no.3
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• pp.285-291
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• 2001

In this paper, we designed two preprocessing adaptive filter - high pass filter and notch filter - using FPGA. For minimizing the calculation load of multi-channel and high-resolution ECG system, we utilize FPGA rather than digital signal processing chip. To implement the designed filters in FPGA, we utilize FPGA design tool(Altera corporation, MAX-PLUS II) and CSE database as test data. In order to evaluate the performance in terms of processing time, we compared the designed filters with the digital filters implemented by ADSP21061(Analog Devices). As a result, the filters implemented by FPGA showed better performance than the filters based on ADSP21061. As a consequence of examination, we conclude that FPGA is a useful solution in multi-channel and high-resolution signal processing.

• Proceedings of the KIEE Conference
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• 1987.07b
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• pp.1495-1498
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• 1987

This paper described the design of register part, ROM and entire digital filter implementation by merging with ALU, control part last year. The register part consists of shift register, parallel load serial output register, multiplexer and selector, and we designed specially the 1024 memory cells ROM and decoder to decode the register data. Also, presented scaling algorithm to prevent the overflow.

• Journal of information and communication convergence engineering
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• v.8 no.5
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• pp.534-538
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• 2010

Efficient control of a marine engine requires an engine control unit (ECU) system that handles fast and precise signal processes for in-coming and out-going signals from fast running engines. In order to handle these roles, the sequential control has been adapted in the ECU system in small and medium size ship engines, which has caused high production cost and complexity of the system. Hence, this paper is focused on developing an distributed ECU system for high speed and high precision control of a marine engine by efficiently combining a CPLD chip and a microprocessor. By sharing load at the MCU with the designed CPLD chip, we could achieve in driving a marine engine with high speed and precise control so that the ECU board has been simplified and its production cost has been reduced.

• Journal of IKEEE
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• v.12 no.1
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• pp.34-42
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• 2008

This paper proposes a new on-chip voltage down converter(VDC), which employs a new reference voltage generator(RVG). The converter adopts a temperature-independence reference voltage generator, and a voltage-up converter. The architecture of the proposed VDC has a high-precision, and it was verified based on a 0.25${\mu}m$ 1P5M standard CMOS technology. For 2.5V to 1.0V conversion, the RVG circuit has a good characteristics such as temperature dependency of only 0.2mV/$^{\circ}C$, and the voltage-up circuit has a good voltage deviation within ${\pm}$0.12% for ${\pm}$5% variation of supply voltage VDD. The output voltage is stabilized with ${\pm}$1mV for load current varying from 0 to 100mA.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.385-388
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• 1997

As the environmental regulations become stricter, new machining technologies are being developed which takes envi ronmenta 1 aspects into account . Since cut t ing oi I has some impact on environment. many researches are being carried out to minimize the use of cutting oi I. The methods for minimizing cutting oil usage includes the following techniques: I ) Cooling of tools and work piece. 2) Useage of compressed cooling air for the removal of chip. 3) Minimal useage of environment-friendly vegetable cutt:ngoiI for lubrication between chip and tools. Since the turning machine is continuous, tools are under constant thermal load and tool wear increases as the lubricative performance degrades. Also surface roughnesses have a direct influence on turning. In order to examine the characteristics of turningmachining, this work investigates experimentally the degree of tool wear and characteristics of surface roughness in relation to machining conditions, supply methods, and cooling methods.