• 제목/요약/키워드: Chip Shape

검색결과 233건 처리시간 0.022초

Modeling of Wideband DS-SS Signaling over Multipath Fading Channels

  • Lee, Chankil;Jeon, Youngsik;Lyu, Deuk-Su
    • The Journal of the Acoustical Society of Korea
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    • 제16권3E호
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    • pp.24-31
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    • 1997
  • A mobile propagation characteristics for wideband DS-SS (Direct Sequence-Spectrum) signal is presented. Existing narrowband model is extended for the wideband pulse with an arbitrary shape. The received DS-SS signal in the frequency domain is the transfer function of the propagation channel weighted by the inverse Fourier transform. In this proposed method, received signal spectral density, instantaneous waveform, and Doppler spectrum of DS-SS signal via either Rayleigh of Rician channel can be obtained easily. Simulation results match well with both simulated theoretical fading statistics and classical theory. As expected, the extraction of chip timing in Rician fading shown to be more tractable than Rayleigh fading.

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A Spread Spectrum Clock Generator for DisplayPort 1.2 with a Hershey-Kiss Modulation Profile

  • Oh, Seung-Wook;Park, Hyung-Min;Moon, Yong-Hwan;Kang, Jin-Ku
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권4호
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    • pp.282-290
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    • 2013
  • This paper describes a spread spectrum clock generator (SSCG) circuit for DisplayPort 1.2 standard. A Hershey-Kiss modulation profile is generated by dual sigma-delta modulators. The structure generates various modulation slopes to shape a non-linear modulation profile. The proposed SSCG for DisplayPort 1.2 generates clock signals with 5000 ppm down spreading with a Hershey-Kiss modulation profile at three different clock frequencies, 540 MHz, 270 MHz and 162 MHz. The measured peak power reduction is about 15.6 dB at 540 MHz with the chip fabricated using a $0.13{\mu}m$ CMOS technology.

Analysis on the Surface Accuracy in according to Geometry of End Mill (엔드밀의 형상에 따른 가공정밀도 해석)

  • 고성림;이상규;김용현
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.1001-1004
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    • 2000
  • As tools for machining precision components, end mills and ball end mills are widely used. For the end mills have longer cylindrical shape comparing diameter, liable to deflect and induce deterioration of surface roughness. Tool geometry parameters and cutting process have complex relations with each other. So, It is hard to determine hew to select optimal tool geometry. So, to improve the stiffness, relationship between cutting process and tool geometry must be studied. In this study, relations between grinding wheel geometry, setting condition and tool geometry are revealed. For the purpose of studying relations between each parameter, the equivalent diameter of tool has been calculated assuming tool as a simple beam. By the various cutting simulations and experiments, tool geometry and cutting process has been studied.

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Optical properties of ink color filters (잉크 색상 필터의 광학적 특성)

  • Lee, Chan-Ku;Lee, Su-Dae
    • Journal of Korean Ophthalmic Optics Society
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    • 제8권1호
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    • pp.23-28
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    • 2003
  • We report a switchable RGB color filters for Lab on a chip. Ink color filter devices are fabricated by PDMS patterning process. The optical transmission in the ultra-violet and visible wavelengths of color filters have been investigated. The ink color filters are characterised by the slope and shape of the spectrum. The transmission of red/yellow filter consists of curves with a sharp cut-off spectrum at 600 and 500 nm. The blue output of the ink filter has 80% peak transmission and weak red-leak, while the green ink filter has 48% peak transmission and red-leak.

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A study on the Pulse generation technology of Nd :YAG laser adopting a FTC method (FTC방식을 적용한 Nd:YAG 레이저의 펄스 발생 기술에 관한 연구)

  • Hong, Jung-Hwan;Kim, Kyu;Song, Kum-Young;Kim, Hee-Je;Kang, Uk;Kim, Whi-Young
    • Proceedings of the KIEE Conference
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    • 대한전기학회 2002년도 하계학술대회 논문집 C
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    • pp.1807-1809
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    • 2002
  • In this study, asolid-state laser system adopting a firing time control(FTC) method in which three flashlamps are turned on consecutively was designed and fabricated to examine the pulse width and the pulse shape of the laser beams depending upon the changes in the lamp turn-on time. That is, this study shows a technology that makes it possible to make various pulse shapes by turning on three flashlamps consecutively on a real-time basis with the aid of a PIC one-chip microprocessor With this technique, the lamp turn-on delay time can be varied more diversely from 0 to 10 ms and the real-time control is possible with an external keyboard enabling various pulse shapes. In addition longer pulses can be more widely used for industrial processing and lots of medical purposes.

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Multipath Mitigation Method Through Asymmetry Estimation of Correlation Function (상관함수의 비대칭성 추정을 통한 다중 경로 오차 제거 기법)

  • Jang Han-Jin;Moon Sung-Wook;Kim Jeong-Won;Lee Sang-Jeong;Hwang Dong-Hwan
    • Journal of Institute of Control, Robotics and Systems
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    • 제12권10호
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    • pp.1050-1055
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    • 2006
  • Since the muiltipath signal arrives at the GPS receiver later than the line-of-sight signal, the multipath signal makes the shape of the correlation function asymmetric. This paper proposes a multipath mitigation method through asymmetry estimation of the correlation function, in which multiple correlators are utilized. The asymmetry is estimated from correlation values of correlators which have different chip spacings. Based on the estimated asymmetry, the correlation function is modified in order to get a better code tracking performance. Even through the proposed method uses multiple correlators including the narrow correlator, the acquisition performance is not degraded since the number of search cell of the narrow correlator part can be reduced in the algorithm of the proposed method. The simulation results show that the proposed method gives better performance than the generic correlator in multipath environment.

A Calibration Method Using Four Fiducials Applicable to Nonlinear Displacement of PCBs on SMT Devices (표면실장장비에서 PCB 비선형 변형 대응을 위한 4점 피튜셜 보정 방법)

  • Jang, Chan-Soo;Kim, Yung-Joon;Kim, Jae-Ok
    • Journal of the Korean Society for Precision Engineering
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    • 제19권9호
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    • pp.151-156
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    • 2002
  • A new position correction method using four fiducials as reference points was developed and examined. It was aimed to calibrate nonlinear deformation by numerous error sources. A correlation for correction was derived from the geometric relationship between four fiducials and chip position. Compared with three points method, it exhibited more accurate correction, especially for inner area of a quadrilateral composed of four fiducial points. Its accuracy was found to be increased as fiducials moves outwardly within a printed circuit board (PCB) and/or as they form more rectangle-like shape As for arbitrarily nonlinear deformation, this method can be applied using more than five fiducials. In this case, local-area calibration is carried out by sectioning a board area into several rectangular are as.

A numerical study on the residual stress in LED encapsulment silicone after curing and cooling (경화 및 냉각을 거친 LED 패키징 실리콘의 잔류응력에 대한 수치해석적 고찰)

  • Song, M.J.;Kim, K.H.;Kang, J.J.;Kim, H.K.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 한국소성가공학회 2009년도 춘계학술대회 논문집
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    • pp.425-428
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    • 2009
  • Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. To mold a solid-state silicone encapsulment, curing by mixing at elevated temperatures followed by cooling is necessary. As the silicone molding process is involved in healing and subsequent cooling, the thermal residual stress, which causes mechanical warpage or optical birefringence in the final silicone encapsulment, may be induced if there are non-uniformities in cured silicone material properties or encapsulment shape design. The prediction of residual stress is necessary to design a high-quality silicone molding process. Therefore, in the present paper, a numerical parametric study was attempted to evaluate the heating and cooling effects on the thermal residual stress induced in the cured silicone.

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엔드밀 정밀도 향상을 위한 주변기술 연구

  • 김경배;서천석;김영경;이용인;최영근
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.450-455
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    • 2002
  • Quality of endmill applied to high speed Machining can be classified in precision and tool life. Especially, Endmills are damaged easily when high speed machining are occurred vibration and deflection by thin and long shape of endmill, limitation of chip-pocket. Furthermore, Endmills are determined tool life by the quality of base material and the character of coating. This study have carried on research and analysis about grinding technique, circumference technique to improve precision that determine the quality of endmill. As the result of this study, that the technique is able to manufacture endmill applied to high speed Machining have been obtained.

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Machinability in Micro-precision Machining of Ni-Plated Layer by Diamond Tool (다이어몬드 공구를 이용한 Ni 도금층의 정밀미세가공 시 절삭성)

  • Kim, Seon-Ah;Park, Dong-Sam
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • 제18권6호
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    • pp.636-641
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    • 2009
  • Recently, expansion of micro-technology parts requires micro-precision machining technology. Micro-groove machining is important to fabricate micro-grating lens and many micro-parts such as microscope lens, fluidic graphite channel etc. Conventional groove fabrication methods such as etching and lithography have some problems in efficiency and surface integrity. But, mechanical micromachining methods using single crystal diamond tools can reduce these problems in chemical process. For this reason, microfabrication methods are expected to be very efficient, and widely studied. This study deals with machinability in micro-precision V-grooves machining of nickel plated layer using non-rotational single crystal diamond tool and 3-axis micro stages. Micro V-groove shape, chip formation and tool wear were investigated for the analysis of machinability of Ni plated layer.

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