• 한국정밀공학회지
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• 제15권10호
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• pp.128-139
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• 1998

In this paper, a finite element method for predicting the temperature and stress distributions in micro-machining is presented. The work material is oxygen-free-high-conductivity copper(OFHC copper) and its flow stress is taken as a function of strain, strain rate and temperature in order to reflect realistic behavior in machining process. From the simulation, a lot of information on the micro-machining process can be obtained; cutting force, cutting temperature, chip shape, distributions of temperature and stress, etc. The calculated cutting force was found to agree with the experiment result with the consideration of friction characteristics on chip-tool contact region. Because of considering the tool edge radius, this cutting model using the finite element method can analyze the micro-machining with the very small depth of cut, almost the same size of tool edge radius, and can observe the 'size effect' characteristic. Also the effects of temperature and friction on micro-machining were investigated.

• 한국기계가공학회지
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• 제5권3호
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• pp.29-35
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• 2006

Various types of elliptical motions are generated by PZT mechanism which is composed of two parallel piezoelectric actuators. Elliptical vibration cutting(EVC) is obtained by attaching single crystal diamond cutting tool to the mechanism, and V-grooving for Brass and Aluminum is carried out by applying the EVC. It is experimentally observed that the cutting force in the process of the EVC reduces compared to the ordinary non-vibration cutting, which is due to the decrease of undeformed chip thickness and frictional force between the tool and chip. Ultrasonic elliptical vibration cutting(UEVC) suppresses burr formation and decreases cutting force still more, so UEVC makes it possible to enhance the shape accuracy of machined surface.

• 대한금속재료학회지
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• 제48권6호
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• pp.557-564
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• 2010

Formation of Sn through-silicon-via (TSV) and its interconnection processes were studied in order to form a three-dimensional interconnection structure of chip-stack packages. Different from the conventional formation of Cu TSVs, which require a complicated Cu electroplating process, Sn TSVs can be formed easily by Sn electroplating and reflow. Sn via-filling behavior did not depend on the shape of the Sn electroplated layer, allowing a much wider process window for the formation of Sn TSVs compared to the conventional Cu TSV process. Interlocking joints were processed by intercalation of Cu bumps into Sn vias to form interconnections between chips with Sn TSVs, and the mechanical integrity of the interlocking joints was evaluated with a die shear test.

• 한국정밀공학회지
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• 제13권8호
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• pp.139-145
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• 1996

Tapping is one of the most widely used machining operations. There are several methodes of producing external screw threads, e.g. turning, milling with single or multiple cutter, rolling, and grinding, but the methods available for cutting enternal threads are less numerous, and for threads in small holes, tapping is employed almost exclusively. In this study, the tap with the various geometry has been developed in order to tap special workmaterial at considerably higher cutting speed than that of the conventional HSS tap. The experimental tests are run with various cutting speed by using a piezo type tool dynamometer to measure tapping torque. Tapping torque is affected by the design of the tap, which seems to be due to internal friction and shearing of the metal. It is clarified that the process of chip formation strongly depends on rake angle, relief angle, angle of twist.

• Korean Chemical Engineering Research
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• 제44권5호
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• pp.513-519
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• 2006

본 연구에서는 유리(glass)와 석영(quartz)을 재질로 사용하여 MEMS(micro-electro mechanical systems) 공정을 통해 전기영동(electrophoresis)을 위한 microchip을 제작하였다. UV 광이 실리콘(silicon)을 투과하지 못하는 점에 착안하여, 다결정 실리콘(polycrystalline Si, poly-Si) 층을 채널 이외의 부분에 증착시킨 광 차단판(optical slit)에 의해 채널에만 집중된 UV 광의 신호/잡음비(signal-to-noise ratio: S/N ratio)를 크게 향상시켰다. Glass chip에서는 증착된 poly-Si 층이 식각 마스크(etch mask)의 역할을 하는 동시에 접합표면을 적절히 형성하여 양극 접합(anodic bonding)을 가능케 하 였다. Quartz 웨이퍼에 비해 불순물을 많이 포함하는 glass 웨이퍼에서는 표면이 거친 채널 내부를 형성하게 되어 시료용액의 미세한 흐름에 영향을 미치게 된다. 이에 따라, HF와 $NH_4F$ 용액에 의한 혼합 식각액(etchant)을 도입하여 표면 거칠기를 감소시켰다. 두 종류의 재질로 제작된 채널의 형태와 크기를 관찰하였고, microchip electrophoresis에 적용한 결과, quartz과 glass chip의 전기삼투 흐름속도(electroosmotic flow velocity)가 0.5와 0.36 mm/s로 측정되었다. Poly-Si 층에 의한 광 차단판의 존재에 의해, peak의 S/N ratio는 quartz chip이 약 2배 수준, glass chip이 약 3배 수준으로 향상되었고, UV 최대흡광 감도는 각각 약 1.6배 및 1.7배 정도 증가하였다.

• 대한전자공학회논문지SP
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• 제43권4호
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• pp.55-65
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• 2006

대부분의 고속 블록 움직임 추정 알고리즘은 탐색점의 수를 줄여서 연산량을 감소시킨다. 하지만 이러한 고속 움직임 추정 알고리즘들은 비정규화 데이터 흐름 때문에 멀티미디어 프로세서에서는 좋은 성능을 보이기 어렵다. 미디어 프로세서에서는 내부 메모리에서 데이터의 효과적인 재사용이 SAD 명령의 수를 줄이는 것보다 더욱 중요하다. 이는 수행 사이클의 성능이 외부 메모리 액세스의 횟수에 매우 의존적이기 때문이다. 따라서 본 논문에서는 내부 메모리로부터 데이터를 효과적으로 재사용 할 수 있는 라인 탐색 패턴과 라인 탐색 패턴에서 불필요한 SAD 연산을 줄이기 위한 서브 샘플링 방법을 적용한 Hexagon 모양 라인 탐색(Hexagon-shape line search, HEXSLS) 기법을 제안한다. 모의실험을 통하여 HEXSLS 기법의 MAE 성능은 전역 탐색 블록 정합(FSBMA) 기법과 비슷하고, Hexagon 기반 탐색 (Hexagon-based search) 보다 우수한 성능을 가짐을 보인다. 또한 HEXSLS는 Hexagon 기반 탐색이나 예측 라인 탐색(predictive line search) 기법보다 적은 외부 메모리의 액세스가 발생한다. 결과적으로, 제안한 HEXSLS 기법은 종래의 기법과 비교하여 미디어 프로세서에서 매우 낮은 수행 사이클 성능을 보인다.

• Design & Manufacturing
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• 제15권2호
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• pp.11-16
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• 2021

Recently, three-dimensional (3D) cell culture systems, which are superior to conventional two-dimensional (2D) vascular systems that mimic the in vivo environment, are being actively studied to reproduce drug responses and cell differentiation in organisms. Conventional two-dimensional cell culture methods (scaffold-based and non-scaffold-based) have a limited cell growth rate because the culture cannot supply the culture medium as consistently as microvessels. To solve this problem, we would like to propose a 3D culture system with an environment similar to living cells by continuously supplying the culture medium to the bottom of the 3D cell support. The 3D culture system is a structure in which microvascular structures are combined under a scaffold (agar, collagen, etc.) where cells can settle and grow. First, we have manufactured molds for the formation of four types of microvessel-mimicking chips: width / height ①100 ㎛ / 100 ㎛, ②100 ㎛ / 50 ㎛, ③ 150 ㎛ / 100 ㎛, and ④ 200 ㎛ / 100 ㎛. By injection molding, four types of microfluidic chips were made with GPPS (general purpose polystyrene), and a 100㎛-thick PDMS (polydimethylsiloxane) film was attached to the top of each microfluidic chip. As a result of observing the flow of the culture medium in the microchannel, it was confirmed that when the aspect ratio (height/width) of the microchannel is 1.5 or more, the fluid flows from the inlet to the outlet without a backflow phenomenon. In addition, the culture efficiency experiments of colorectal cancer cells (SW490) were performed in a 3D culture system in which PDMS films with different pore diameters (1/25/45 ㎛) were combined on a microfluidic chip. As a result, it was found that the cell growth rate increased up to 1.3 times and the cell death rate decreased by 71% as a result of the 3D culture system having a hole membrane with a diameter of 10 ㎛ or more compared to the conventional commercial. Based on the results of this study, it is possible to expand and build various 3D cell culture systems that can maximize cell culture efficiency by cell type by adjusting the shape of the microchannel, the size of the film hole, and the flow rate of the inlet.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.59-65
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• 2011

소형화, 박형화 및 집적화의 경향에 따라 FCBGA가 휴대폰과 같은 전자제품에 활발히 사용되고 있다. 그러나, 플립칩은 전기적 저항에 의한 열이 필연적으로 발생하며, 발생된 열은 패키지의 소형화에 따라 열의 분산 면적 감소로 인하여 발열의 증가가 나타나게 된다. 발열은 온도와 응력에 민감하게 반응하는 소자의 수명을 저해하고, 시스템에 있어 고장의 발생을 가져올 수 있다. 따라서 본 논문에서는 플립칩의 발열문제를 해결하기 위하여 Comsol 3.5a의 heat transfer module을 이용하여 FCBGA의 발열 특성을 정량적으로 분석하였다. 그리고 열 문제를 해결하기 위하여 시뮬레이션을 통한 새로운 마이크로 구조가 부착된 플립칩을 제안하였다. 또한 마이크로 패턴 구조의 형상, 높이, 간격에 대한 열 소산을 분석함으로써, 기존 플립칩에 비하여 열소산 특성이 18% 향상됨을 확인하였다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.5-10
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• 1998

Although the high speed machining technology (HSM) has been significantly studied in worldwide for past two decades, and has been widely applied in machining processes at many countries, it is not well known in domestic machining industries. The objective of this article, therefore, is to introduce the HSM to domestic industries so that they can apply the HSM on their products and results in improvements on productity and precision. The concept of HSM, tool materials and tool wear of HSM, surface roughness of HSM, and the chip shape of HSM are discussed.

• 한국표면공학회지
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• 제31권1호
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• pp.45-53
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• 1998

Sharp tips are commonly used for applications in fields as diverse as nanolithography, lowvoltage field emitters, emitters, nanoelectroniecs, electrochemisty, cell biology, field-ion and electron microscopy. tungsten wire, mater만 used in this experiment, which test the chip of wafer has been used to the needle of probe card. Tungsten wire was sharpened by electrochemical etching methode to get a typical tip shape.