• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4392-4397
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• 2012

In this study, we used the commercial package (Unigraphics) to construct a junction box cable car when laser plastic parts have been processed using urethane resin(TSR-755) as a starting mold material. After construction, we carried out the filing, packing, cooling, and deforming analyzation using Injection Molding Analysis (Simpoe-Mold) to determine the gate positioning and automatic cooling cycle through the examination. The results show that inserting into the injection mold after processing ceramic has reduced the time of thermal conductivity of molding and cooling; and quick selection of gates and cooling lines could possibly cause an improvement of productivity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.9
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• pp.1357-1363
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• 1997

Currently it is increasing to use th bonded dissimilar materials in the various field of advanced engineering such as the highly rigid and lighter vehicle, plastic molding LSI package and metal/ceramic bonded joint. In spite of such a wide application of the bonded dissimilar materials, the evaluation method of the bonding strength has not been established yet. Therefore in this paper we analyze the interface crack problem by introducing fracture mechanics parameters as the basic research about estimating of the strength of adhesive joints. The variation of stress intensity factor according to the elastic modulus of adherend and thickness of bonded layer are investigated. Numerical results are based on the results of boundary element analysis of four different type butt joints subjected to uniaxial tension loading.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.913-916
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• 2005

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}pa$. $m^3/cm^2$.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.39-43
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• 2003

Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.

• Korean Journal of Optics and Photonics
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• v.19 no.2
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• pp.140-143
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• 2008

The integrated external cavity laser has been fabricated with a 1550 nm FP-LD, an optical filter, a micro ball lens and accurate ceramic blocks using a micro-block stacking (MBS) technique. The integrated external cavity laser module whose size is only $2.0{\times}2.1{\times}0.7\;mm^3$ has been mounted on the TO-CAN package. For the case of the 1.8% transmission filter, the single mode characteristic has been obtained with the optical power of -27.1 dBm and the SMSR of 31.7 dB.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.129-132
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• Journal of Sensor Science and Technology
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• v.13 no.3
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• pp.230-235
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 seem at a supplied voltage of 100 V with a 50% duty cycle, maximum non-linearity was 2.24% FS and leak rate was $3.03{\times}10^{-8}pa{\codt}m^{3}/cm^{2}$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• Journal of Technologic Dentistry
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• v.35 no.2
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• pp.89-95
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• 2013

Purpose: The purpose of this study was to evaluate bond strength of Metal Disk alloy and casting alloy. Methods: Metal specimens were divided into 4 groups for each alloy. Three point flexural test were used to measure the bond strength of CAD/CAM metal alloy and casting alloy. Statistical analysis was done using the Statistical Package for Social Sciences version 19.0 for Windows. As for the analysis methods, the study used Kruskal-Wallis test. Results: The average bonding strengths of Group 1 to porcelain was $36.7{\pm}9.90$ MPa, Group 2 to porcelain was $37.68{\pm}4.51$ MPa, Group 3 to porcelain was $36.43{\pm}6.57$ MPa, Group 4 to porcelain was $42.88{\pm}6.81$ MPa, Each group was not significantly different. Conclusion: Bond strength of Casting alloy is equal to or higher than bond strength of CAD/CAM Metal Disk alloy. Alloy clinical bond strength is 25 MPa, So CAD/CAM Metal Disk alloy can be used as dental material.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.