• Journal of Advanced Marine Engineering and Technology
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• v.41 no.3
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• pp.251-257
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• 2017

In this paper, an algorithm for detecting defects in thin-film-transistor liquid-crystal display (TFT-LCD) cell images is presented. TFT-LCD cell images typically contain periodic cell patterns that make it difficult to detect defects. We propose an efficient and powerful algorithm for eliminating the cell patterns using magnitude spectrum analysis. The first step was to obtain a spectrum for a cell image using the Fourier transform while eliminating larger coefficients using an adaptive filter. Next, an image without the cell pattern was obtained by using the inverse Fourier transform. Finally, the defect pixels were detected using the STD algorithm. The validity of the proposed method was investigated using real TFT-LCD cell images. The experimental results indicate that the proposed technique is extremely effective for detecting defects in TFT-LCD cell images.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.6
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• pp.509-518
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• 2023

In this paper, we designed a 4Kb poly-fuse OTP IP (Intellectual Property) required for analog circuit trimming and calibration. In order to reduce the BL resistance of the poly-fuse OTP cell, which consists of an NMOS select transistor and a poly-fuse link, the BL stacked metal 2 and metal 3. In order to reduce BL routing resistance, the 4Kb cells are divided into two sub-block cell arrays of 64 rows × 32 rows, with the BL drive circuit located between the two 2Kb sub-block cell arrays, which are split into top and bottom. On the other hand, in this paper, we propose a core circuit for an OTP cell that uses one poly-fuse link to one select transistor. In addition, in the early stages of OTP IP development, we proposed a data sensing circuit that considers the case where the resistance of the unprogrammed poly-fuse can be up to 5kΩ. It also reduces the current flowing through an unprogrammed poly-fuse link in read mode to 138㎂ or less. The poly-fuse OTP cell size designed with DB HiTek 90nm CMOS process is 11.43㎛ × 2.88㎛ (=32.9184㎛2), and the 4Kb poly-fuse OTP IP size is 432.442㎛ × 524.6㎛ (=0.227mm²).

• The Journal of the Acoustical Society of Korea
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• v.18 no.3E
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• pp.44-48
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• 1999

The CMOS four-quadrant analog multiplier for low-voltage low-power applications are presented in this thesis. The circuit approach is based on the characteristic of the LV (Low-Voltage) composite transistor which is one of the useful analog building block. SPICE simulations are carried out to examine the performances of the designed multiplier. Simulation results are obtained by 0.6㎛ CMOS parameters with 2V power supply. The basic configuration of the multiplier is the CMOS Gilbert cell with two LV composite transistors. The linear input range of the multiplier is over ±0.4V with a linearity error of less than 1.3%. The measured -3dB bandwidth is 288MHz and the power dissipation is 255 ㎼.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.1
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• pp.20-30
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• 2001

A 1.8V $650{\;}\textrm{mm}^2$ 4Gb DRAM having $0.10{\;}\mu\textrm{m}^2$ cell size has been successfully developed using 0.11 $\mu\textrm{m}$DRAM technology. Considering manufactur-ability, we have focused on developing patterning technology using KrF lithography that makes $0.11{\;}\mu\textrm{m}$ DRAM technology possible. Furthermore, we developed novel DRAM technologies, which will have strong influence on the future DRAM integration. These are novel oxide gap-filling, W-bit line with stud contact for borderless metal contact, line-type storage node self-aligned contact (SAC), mechanically stable metal-insulator-silicon (MIS) capacitor and CVD Al process for metal inter-connections. In addition, 80 nm array transistor and sub-80 nm memory cell contact are also developed for high functional yield as well as chip performance. Many issues which large sized chip often faces are solved by novel design approaches such as skew minimizing technique, gain control pre-sensing scheme and bit line calibration scheme.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2000.11a
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• pp.17-20
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• 2000

This study is about a retrograde triple well employed in the Cell tr. of next DRAM and flash memory. triple well structure is formed deep n-well under the light p-well using MeV ion implantation. MeV P implanted deep n-well was observed to show greatly improved characteristics of electrical isolation and soft error. Junction leakage current, however, showed a critical behavior as a function of implantation and annealing conditions. {311} defects were observed to be responsible for the leakage current. {311} defects were generated near the R$\sub$p/ (projected range) region and grown upward to the surface during annealing. This is study on the defect behavior in device region as a function of implantation and annealing conditions.

• Proceedings of the KIEE Conference
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• 1987.07b
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• pp.1463-1466
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• 1987

The problem of generating minimal area CMOS functional cell layout can be converted to that of decomposing the transistor connection graph into a minimum number of subgraphs, each having a pair of Euler paths with the same sequence of input labels on the N-graph and P-graph, which are portions of the graph corresponding to NMOS and PMOS parts respectively. This paper proposes a heuristic algorithm which yields a nearly minimal number of Euler paths from the path representation formula which represents the give a logic function. Subpath merging is done through a list processing scheme where the pair of paths which results in the lowest cost is successively merged from all candidate merge pairs until no further path merging and further reduction of number of subgraphs are possible. Two examples were shown where we were able to further reduce the number of interlaces, i.e., the number of non-butting diffusion islands, from 3 to 2, and from 2 to 1, compared to the earlier work [1].

• Journal of Information Display
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• v.1 no.1
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• pp.3-8
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• 2000

We have developed a high performance vertical alignment TFT-LCD (Thin Film Transistor Liquid Crystal Display), that shows a high light transmittance, and wide viewing angle characteristics with an unusually high contrast ratio. In order to optimize the electro-optical properties we have studied the effect of cell parameters, multi-domain structure and retardation film compensation. With the optimized cell parameters and process conditions, we have achieved a 24" wide UXGA TFTLCD monitor (16:10 aspect ratio 1920X1200) showing a contrast ratio of over 500:1, panel transmittance near 4.5%, response time near 25 ms, and viewing angle higher than 80 degree in all directions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.26-31
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• 2002

To realize a high integrated Flash memory utilizing SONOS memory devices, the NOR type 1TC(one Transistor Cell) SONOS Flash arrays are fabricated and characterized. This SONOS Flash arrays with common source lines are designed and fabricated by conventional 0.35$\mu\textrm{m}$ CMOS process. The thickness of ONO for memory cell is tunnel oxide of 34${\AA}$, nitride of 73${\AA}$ and blocking oxide of 34${\AA}$. To investigate operating characteristics, CHEI(Channel Hot Electron Injection) method and Bit line erase method are selected as the write operation and the erase method, respectively. The disturbance characteristics according to the write/erase/read cycling are also examined. The degradation characteristics are investigated and then the reliability of SONOS flash memory is guaranteed.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.561-562
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• 2006

This paper presents an SRAM which uses the technique to equalize the internal cell node by adding an NMOS transistor. Accordingly, the write driver operates rapidly in a differential current of bit lines, and the operation speed of SRAM improves. An SRAM was implemented with a memory cell, a sense amplifier and a write driver. The SRAM obtained the performance of 18% power reduction and improvement of 56% operation speed. And Power delay product was reduced with 63%. The proposed SRAM was designed based on a 0.35um 1P4M CMOS technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.17-20
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• 2000

This study is about a retrograde triple well employed in the Cell tr. of next DRAM and flash memory. Triple well structure is formed deep n-well under the light p-well using MeV ion implantation. MeV P implanted deep n-well was observed to show greatly improved characteristics of electrical isolation and soft error. Junction leakage current, however, showed a critical behavior as a function of implantation and annealing conditions. {311} defects were observed to be responsible for the leakage current. {311} defects were generated near the R$\_$p/ (Projected range) region and grown upward to the surface during annealing. This is study on the defect behavior in device region as a function of implantation and annealing conditions.