• Title/Summary/Keyword: CVD 다이아몬드

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Synthesis of fiber-textured diamond films by MWPECVD (마이크로파 플라즈마 CVD법에 의한 섬유집합조직 다이아몬드막의 합성)

  • 박재철;김병상
    • Electrical & Electronic Materials
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    • v.9 no.5
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    • pp.470-475
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    • 1996
  • Fiber-textured diamond films have been deposited on scratched silicon(100) substrate by micro wave .plasma enhanced chemical vapor deposition at the condition of micro wave power : 950 W, pressure : 60 torr, H$_{2}$ gas flow rate : 50 sccm, CH$_{4}$ gas flow rate : 1.5 sccm, substrate temperature : about 900.deg. C and deposition time : 20 hours. The films were characterized by mean of scanning electron microscopy, Raman spectroscopy and X-ray analysis.

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Synthesis of Crystalline film from ${CH_4}-{H_2}-{N_2}$ gases with MW-PACVD (${CH_4}-{H_2}-{N_2}$ 기체계에서 MW-PACVD를 이용한 결정상 합성)

  • Kim, Do-Geun;Baek, Young-Joon;Seong, Tae-Yeon
    • Korean Journal of Materials Research
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    • v.10 no.9
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    • pp.648-655
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    • 2000
  • Synthesis of the crystalline film was investigated under the diamond growth condition with altering the addition of the nitrogen from 0% to 95%. With increasing the nitrogen concentration, surface morphology of the film was changed from the diamond film with {100} growth plane to the non-faceted diamond film with nano-scale grains. It also showed that the deposition of the diamond film could be synthesized using only methane and nitrogen gases without hydrogen gas. Separated particles with diamond structure showed an octahedral shaped I the nitrogen ranges between 30% and 80%, and newly formed hexagonal crystals are observed when substrate temperature with diamond structure, however, also identify that the hexagonal crystal was SiCN composite composed of Si, C and N atoms.

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The effect of oxygen in RF PACVD diamond thin film (고주파 플라즈마 CVD 다이아몬드 박막의 합성시 첨가된 산소의 효과)

  • Kim, Dae-Il;Lee, Sang-Hee;Lee, Byoung-Soo;Park, Jong-Kwan;Park, Sang-Hyun;Kim, Bo-Youl;Woo, Ho-Whan;Lee, Duck-Chool
    • Proceedings of the KIEE Conference
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    • 1998.11c
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    • pp.786-788
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    • 1998
  • Synthetic diamond films were deposited on pretreated silicon substrate in activated gas phase using RF plasma-assisted CVD. We investigated the influence of $O_2$ gas on facets of diamond crystal. In $H_2-CH_4-O_2$ gas mixture, the increase of oxygen concentration lead to well-faceted diamond particles and increasing crystallinity of diamond films. The deposited diamond films were analyzed by SEM, XRD, Raman spectroscopy.

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Planarization of Diamond Films Using KrF Excimer Laser Processing (KrF 엑사이머 레이저 법을 이용한 다이아몬드 박막의 평탄화)

  • Lee, Dong-Gu
    • Journal of the Korean Society for Heat Treatment
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    • v.13 no.5
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    • pp.318-323
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    • 2000
  • The planarization of rough polycrystalline diamond films synthesized by DC arc discharge plasma jet CVD (chemical vapor deposition) was attempted using KrF excimer laser pulses. The effects of laser incidence angle and reaction gases (ozone and oxygen) on etching rate of diamond were studied. The temperature change of diamond and graphite with different laser fluences was calculated by computer simulation to explain the etching behavior of diamond films. The threshold energy density from the experiment for etching of pure crystalline diamond was about $1.7J/cm^2$ and fairly matched the simulation value. Preferential etching of a particular crystallographic plane was observed through scanning electron microscopy. The etching rate of diamond with ozone was lower than that with oxygen. When the angle of incidence was $80^{\circ}$ to the diamond surface normal, the peak-to-valley surface roughness was Significantly reduced from $20{\mu}m$ to $0.5{\mu}m$.

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Synthesis of Diamond-Like Carbon Films by R.F.Plasma CVD (고주파플라즈마 CVD법에 의한 다이아몬드상 탄소박막의 합성)

  • 박상현;이덕출
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.39 no.10
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    • pp.1037-1043
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    • 1990
  • Diamond thin films were synthesized from the mixed gases of methane and hydrogen on silicon substrates by RF plasma chemical vapor deposition and deposited films were investigated by SEM, X-ray diffractometry and Raman spectroscopy. It is found that high quality diamond-like carbon films were successfully synthesized by PECVD under the deposition condition of 1-10 vol% of methane concentration, 0.15-0.4torr of reactor pressure, 500W of RF power, and 5-20hr of reaction time. Especially, cubo-octahedral diamond-like carbon particles were synthesized by employing 1.0 vol % of methane concentration and 0.4torr of the reactor pressure.

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Synthesis of Diamond Thin Films by Rf Plasma Assisted Chemical Vapor Deposition (RF 플라즈마 CVD법에 의한 다이아몬드 박막의 합성)

  • 이상희;이덕출
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.7
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    • pp.552-556
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    • 1998
  • Diamond thin films were deposited on Si substrate using $CH_4 and H_2$mixed gas by RF plasma CVD. Prior to deposition, the substrate surface was mechanically scratched with the diamond paste of $3{\mu}m$ to improve the density of nucleation sites. The microstructure of diamond films deposited with methane(0.5%~2%) at the reaction pressure ranging from 20 torr to 50torrr were studied by a scanning electron microscope. It was observed in the deposited diamond films that the nucleation density decreased and crystallinity increased with decreasing the methane concentration. However, the nucleation density and crystallinity were decreased with decreasing the process pressure.

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The Conditioning Behaviors of Diamond CVD Deposited Seramic CMP Conditioner (다이아몬드 CVD 증착에 의한 세라믹 CMP Conditioner의 Conditioning 거동)

  • Kang, Young-Jae;Eom, Dae-Hong;Park, Jum-Yong;Park, Jin-Gu;Ko, Soong;Myung, Beom-Young;Lee, Sang-Ik;Kwon, Pan-Gi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.270-273
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    • 2002
  • Conditioning은 CMP(Chemical Mechanical Planarization)에 필수적인 공정중의 하나이다. Conditioning의 목적은 removal rate와 uniformity를 CMP 공정 중에서 일정하게 유지시키는데 목적이 있다. 예전의 conditioning disks는 stainless steel substrate 위에 diamond 입자를 올리고 Ni전기도금을 결합시켜서 사용하였다. 그러나, CMP 공정 중에 Ni의분해로 인한 금속의 오염과 diamond abrasive의 분리로 인하여 scratch 문제가 발생하였다. 이 문제를 해결하기 위해서 ceramic substrate와 그것을 정밀 가공하는 기술을 응용함으로써 본래의 conditioning disks가 가지고 있는 diamond 입자의 분리와 metals 분해의 문제를 해결할 수 있게 되었다.

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Crystalline Growth Properties of Diamond Thin Film Prepared by MPCVD

  • Park Soo-Gil;Kim Gyu-Sik;Einaga Yasuaki;Fujishima Akira
    • Journal of the Korean Electrochemical Society
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    • v.3 no.4
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    • pp.200-203
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    • 2000
  • Boron doped conducting diamond thin films were grown on Si substrate by microwave plasma chemical vapor deposition from a gaseous feed of hydrogen, acetone/methanol and solid boron. The doping level of boron was ca. $10^2ppm\;(B/C)$. The Si substrate was tilted ca. $10^{\circ}$ to make Si substrate, which have different height and temperature. Experimental results showed that different crystalline of diamond thin films were made by different temperature of Si substrate. There appeared $3\~4$ steps of different crystalline morphology of diamond. To characterize the boron-doped diamond thin film, Raman spectroscopy was used for identification of crystallinity. To survey surface morphology, microscope was used. Grain size was changed gradually by different temperature due to different height. The Raman spectrum of film exhibited a sharp peak at $1334cm^{-1}$, which is characteristic of crystalline diamond. The lower position of diamond film position, the more non-diamond component peak appeared near $1550 cm^{-1}$.

The deposition characteristics of the diamond films deposited on Si, Inconel 600 and steel by microwave plasma CVD method (마이크로파 플라즈마 CVD 방법으로 Si, Inconel 600 및 Steel 모재위에 증착된 다이아몬드 박막의 증착특성)

  • 김현호;김흥회;이원종
    • Journal of the Korean institute of surface engineering
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    • v.28 no.3
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    • pp.133-141
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    • 1995
  • The deposition characteristics of diamond films were investigated for three different substrates : Si, Inconel 600 and steel. Diamond films were prepared by microwave plasma CVD method using $CH_4$, $H_2$ and $O_2$ as reaction gases. The deposited films were analyzed with SEM, Raman spectroscopy and ellipsometer. For Si substrate, diamond films were successfully obtained for most of the deposition conditions used in this study. As the $CH_4$ flow rate decreased and the $O_2$ flow rate increased, the quality of the film was improved due to the reduced non-diamond phase in the film. For Inconel 600 substrate, the surface pretreatment with diamond powders was required to deposit a continuous diamond film. The films deposited at temperatures of $600^{\circ}C$ and $700^{\circ}C$ had mainly diamond phase, but they were peeled off locally due to the difference in the thermal expansion coefficient between the substrate and the deposited films. The films deposited at $500^{\circ}C$ and $850^{\circ}C$ had only the graphitic carbon phase. For steel substrate, all of the films deposited had only the graphitie carbon phase. We speculated that the formation of diamond nuclei on the steel substrate was inhibited due to the diffusion of carbon atoms into the steel substrate which has a large amount of carbon solubility.

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Properties of a free-standing diamond wafer deposited by the multi-cathode direct current plasma assisted CVD method (다음극 직류전원플라즈마 화학 증착법에 의해 합성된 자유막 다이아몬드 웨이퍼의 특성)

  • 이재갑;박종완
    • Journal of the Korean Vacuum Society
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    • v.10 no.3
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    • pp.356-360
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    • 2001
  • Properties of a free-standing diamond wafer with a diameter of 80 mm and a thickness of 900~950 $mu extrm{m}$ deposited by the multi-cathode direct current plasma assisted chemical vapor deposition (MCDC PACVD) method were investigated. Defects of the diamond film were observed by optical transmission microscopy and its crystallinity was characterized by Raman and IR spectroscopy. Defects were distributed partially on boundaries of the grain. In the grain, (111) plane contained a higher defect density than that on (100) plane. FWHM of Raman diamond peak and IR transmission at 10.6 $\mu\textrm{m}$ were 4.6 $\textrm{cm}^{-1}$ /~5.3 $\textrm{cm}^{-1}$ and 51.7 ~ 61.9 %, and their uniformity was $\pm$7% and $\pm$9%, respectively. The diamond quality decreased with going from center to edge of the wafer.

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