• Title/Summary/Keyword: CVD(chemical vapor deposition)

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Simultaneous Transfer and Patterning of CVD-Grown Graphene with No Polymeric Residues by Using a Metal Etch Mask

  • Jang, Mi;Jeong, Jin-Hyeok;Trung, T.Q.;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.642-642
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    • 2013
  • Graphene, two dimensional single layer of carbon atoms, has tremendous attention due to its superior property such as high electron mobility, high thermal conductivity and optical transparency. Especially, chemical vapor deposition (CVD) grown graphene has been used as a promising material for high quality and large-scale graphene film. Unfortunately, although CVD-grown graphene has strong advantages, application of the CVD-grown graphene is limited due to ineffective transfer process that delivers the graphene onto a desired substrate by using polymer support layer such as PMMA(polymethyl methacrylate). The transferred CVD-grown graphene has serious drawback due to remaining polymeric residues generated during transfer process, which induces the poor physical and electrical characteristics by a p-doping effect and impurity scattering. To solve such issue incurred during polymer transfer process of CVD-grown graphene, various approaches including thermal annealing, chemical cleaning, mechanical cleaning have been tried but were not successful in getting rid of polymeric residues. On the other hand, lithographical patterning of graphene is an essential step in any form of microelectronic processing and most of conventional lithographic techniques employ photoresist for the definition of graphene patterns on substrates. But, application of photoresist is undesirable because of the presence of residual polymers that contaminate the graphene surface consistent with the effects generated during transfer process. Therefore, in order to fully utilize the excellent properties of CVD-grown graphene, new approach of transfer and patterning techniques which can avoid polymeric residue problem needs to be developed. In this work, we carried out transfer and patterning process simultaneously with no polymeric residue by using a metal etch mask. The patterned thin gold layer was deposited on CVD-grown graphene instead of photoresists in order to make much cleaner and smoother surface and then transferred onto a desired substrate with PMMA, which does not directly contact with graphene surface. We compare the surface properties and patterning morphology of graphene by scanning electron microscopy (SEM), atomic force microscopy(AFM) and Raman spectroscopy. Comparison with the effect of residual polymer and metal on performance of graphene FET will be discussed.

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Nearly single crystal, few-layered hexagonal boron nitride films with centimeter size using reusable Ni(111)

  • Oh, Hongseok;Jo, Janghyun;Yoon, Hosang;Tchoe, Youngbin;Kim, Sung-Soo;Kim, Miyoung;Sohn, Byeong-Hyeok;Yi, Gyu-Chul
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.286-286
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    • 2016
  • Hexagonal boron nitride (hBN) is a dielectric insulator with a two-dimensional (2D) layered structure. It is an appealing substrate dielectric for many applications due to its favorable properties, such as a wide band gap energy, chemical inertness and high thermal conductivity[1]. Furthermore, its remarkable mechanical strength renders few-layered hBN a flexible and transparent substrate, ideal for next-generation electronics and optoelectronics in applications. However, the difficulty of preparing high quality large-area hBN films has hindered their widespread use. Generally, large-area hBN layers prepared by chemical vapor deposition (CVD) usually exhibit polycrystalline structures with a typical average grain size of several microns. It has been reported that grain boundaries or dislocations in hBN can degrade its electronic or mechanical properties. Accordingly, large-area single crystalline hBN layers are desired to fully realize the potential advantages of hBN in device applications. In this presentation, we report the growth and transfer of centimeter-sized, nearly single crystal hexagonal boron nitride (hBN) few-layer films using Ni(111) single crystal substrates. The hBN films were grown on Ni(111) substrates using atmospheric pressure chemical vapor deposition (APCVD). The grown films were transferred to arbitrary substrates via an electrochemical delamination technique, and remaining Ni(111) substrates were repeatedly re-used. The crystallinity of the grown films from the atomic to centimeter scale was confirmed based on transmission electron microscopy (TEM) and reflection high energy electron diffraction (RHEED). Careful study of the growth parameters was also carried out. Moreover, various characterizations confirmed that the grown films exhibited typical characteristics of hexagonal boron nitride layers over the entire area. Our results suggest that hBN can be widely used in various applications where large-area, high quality, and single crystalline 2D insulating layers are required.

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FABRICATION OF Nb/Al SUPERCONDUCTING TUNNEL JUNCTION (Nb/Al SUPERCONDUCTING TUNNEL JUNCTION의 제작)

  • Cho, Sung-Ik;Park, Young-Sik;Park, Jang-Hyun;Lee, Yong-Ho;Lee, Sang-Kil;Kim, Sug-Whan;Han, Won-Yong
    • Journal of Astronomy and Space Sciences
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    • v.21 no.4
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    • pp.481-492
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    • 2004
  • We report the successful fabrication and I-V curve superconductivity test results of the Nb/Al-based superconducting tunnel junctions. STJs with side-lengths of 20, 40, 60 and $80{\mu}m$ were fabricated by deposition of polycrystalline Nb/Al/AlOx/Al/Nb 5-layer thin films incorporated on a 3-inch Si wafer. STJ was designed by $Tanner^{TM}$ L-Edit 8.3 program, and fabricated in SQUID fabrication facility, KRISS. S-layer STJ thin-films were fabricated using UV photolithography, DC magnetron sputtering, Reactive ion etching, and CVD(Chemical Vapor Deposition) techniques. Superconducting state test for STJ was succeeded in 4K with liquid helium cooling system. Their performance indicators such ie energy gap, normal resistance, normal resistivity, dynamic resistance, dynamic resistivity, and quality factor were measured from I-V curve. Fabricated Nb/Al STJ shows $11\%$ higher FWHM energy resolution than genuine Nb STJ.

Hot Wire Chemical Vapor Deposition of Hydrogenated Microcrystalline Silicon Films (열선 CVD법에 의한 수소화된 미세결정 실리콘 박막 증착)

  • Lee, Jeong-Chul;Kang, Ki-Whan;Kim, Seok-Ki;Yoon, Kyung-Hoon;Song, Jin-Soo;Park, I-Jun
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1928-1930
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    • 1999
  • This paper describes on the growth of a ${\mu}c$-Si:H film on low cost substrate like glass by Hot Wire CVD method. The ${\mu}c$-Si:H film, prepared in 50mTorr pressure, $1800^{\circ}C$ wire temperature, and $H_2/SiH_4$ 10 showed three clear peaks. (111), (220), and (311) in X-ray spectroscopy. The crystallite size and crystalline volume fraction, calculated from Raman spectroscopy, was about 6nm and 70%, respectively. The FTIR transmission spectra of the film showed a different absorption peak with a-Si:H film around $2000-2100cm^{-1}$.

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화학기상증착법을 이용한 h-BN의 성장과 그 특성

  • Seo, Eun-Gyeong;Kim, Seong-Jin;Kim, Won-Dong;Bu, Du-Wan;Hwang, Chan-Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.407-407
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    • 2012
  • 화학기상증착법(CVD; Chemical Vapor deposition)으로 h-BN을 증착하여 성장 시간에 따른 표면의 특성 및 결정성을 연구하였다. 암모니아 보레인(BH3NH3)을 보론 나이트라이드(Boron Nitride) 박막의 전구물질로 이용하였으며, $70{\sim}120^{\circ}C$로 열을 가하여 열분해하였다. $25{\mu}m$ 두께의 구리 기판을 챔버에 넣어서 Low pressure (~25 mTorr) 상태가 되도록 한다. 25 mTorr 이하의 압력에서 수소 가스 (0.2~1sccm)를 넣고 $20^{\circ}C$/min로 가열한 후 약 한 시간 후에 $990{\sim}1,000^{\circ}C$가 된다. 그 후 Cu foil의 표면을 부드럽게 하고, 산화막을 제거하기 위해 $990^{\circ}C$에서 40 분간 열처리(annealing)한다. 그 후 암모니아 보레인에서 분해된 보라진 가스(borazine; B3H6N3)로 h-BN을 합성한다. 성장 시간이 길수록 더 많은 부분이 보론 나이트라이드에 의해 덮인다는 것을 관찰하였고, 성장 시 주입하는 수소의 양(0.2~5 sccm)과 알곤(0~15 sccm)의 혼합 비율에 따라 보론 나이트라이드의 domain size가 변화함을 알 수 있었다. 그 각각의 차이를 주사 전자현미경(SEM; Scanning Electron Microscopy)을 통해 확인하고, 결정성을 라만 분광(Raman spectroscopy), 광전자 분광(XPS; X-ray photoelectron spectroscopy)으로 비교 분석하였다.

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Improvement of PDMS graphene transfer method through surface modification of target substrate (폴리디메틸실록산(PDMS)을 이용한 그래핀 전사법 개선을 위한 계면처리 연구)

  • Han, Jae-Hyung;Choi, Mu-Han
    • Journal of the Korean Applied Science and Technology
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    • v.32 no.2
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    • pp.232-239
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    • 2015
  • In this paper, we study the dry transfer technology utilizing PDMS (Polydimethylsiloxane) stamp of a large single-layer graphene grown on Cu-foil as catalytic metal by using Chemical Vapor Deposition (CVD). By changing the surface property of the target substrate through $UV/O_3$ treatment, we can transfer the graphene on the target substrate while minimizing mechanical damages of graphene layer. Multi-layer (1~4 layers) graphene was stacked on $SiO_2/Si$ wafer successfully by repeating thetransfer method/process and then optical transmittance and sheet resistance of graphene layers have been measured as a quality assessment.

Electrical characteristics of in-situ doped polycrystalline 3C-SiC thin films grown by CVD (CVD로 in-situ 도핑된 다결정 3C-SiC 박막의 전기적 특성)

  • Kim, Kang-San;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.199-200
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    • 2009
  • This paper describes the electrical properties of polycrystalline (poly) 3C-SiC thin films with different nitrogen doping concentrations. The in-situ-doped poly 3C-SiC thin films were deposited by using atmospheric-pressure chemical vapor deposition (APCVD) at $1200^{\circ}C$ with hexamethyldisilane (HMDS: $Si_2$ $(CH_3)_6)$ as a single precursor and 0 ~ 100 sccm of $N_2$ as the dopant source gas. The peaks of the SiC (111) and the Si-C bonding were observed for the poly 3C-SiC thin films grown on $SiO_2/Si$ substrates by using X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FT-IR) analyses, respectively. The resistivity of the poly 3C-SiC thin films decreased from $8.35\;{\Omega}{\cdot}cm$ for $N_2$ of 0 sccm to $0.014\;{\Omega}{\cdot}cm$ with $N_2$ of 100 sccm. The carrier concentration of the poly 3C-SiC films increased with doping from $3.0819\;{\times}\;10^{17}$ to $2.2994\;{\times}\;10^{19}\;cm^{-3}$, and their electronic mobilities increased from 2.433 to $29.299\;cm^2/V{\cdot}S$.

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Growth of Carbon Nanotubes for Nano Device Application (나노 디바이스 응용을 위한 탄소나노튜브 성장 특성)

  • Park, Yong-Wook;Lee, Seung-Dae
    • Journal of the Korea Computer Industry Society
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    • v.8 no.1
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    • pp.17-22
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    • 2007
  • Carbon nanotubes (CNTs) were grown by a thermal chemical vapor deposition (CVD) method, which has been regarded as one of the most promising candidates for the synthesis of CNTs due to low cost and high growth yield. The Ethylene $(C_2H_4)$, hydrogen $(H_2)$ and Argon(Ar) gases were used for the growth of CNTs at $700^{\circ}C$. As a catalyst for CNTs growth, Fe thin film and Iron nitrate and Molybdenyl acetylacetonate solution with alumina nano-particle were prepared on $SiO_2/Si$ substrate. The growth properties of CNTs were analyzed by SEM and AFM.

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Movement of graphene grain boundary and its interaction with defects during graphene growth (그래핀 결정입계의 이동 및 결함과의 상호작용)

  • Hwang, Suk-Seung;Choi, Byung-Sang
    • The Journal of the Korea institute of electronic communication sciences
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    • v.9 no.3
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    • pp.273-278
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    • 2014
  • On poly and single crystalline Cu substrates, the graphene was synthesized by chemical vapor deposition(CVD). Optical microscopic images which were not possible to show the detailed characterization of graphene growth were adjusted and analyzed using image analyzing software. As a result it was possible to show the detailed growth mechanism of graphene by utilizing the image analysis. Nucleation of graphene on Cu grain boundary and its growth behavior into Cu grain are shown. In addition, the movement of graphene grain boundary interacting with Cu grain boundary and pinholes during growth was illustrated in detail, and the cause and result are discussed as a result of those interactions.

Inspection of Ceramic Coatings Using Nanoindentation and Frequency Domain Photoacoustic Microscopy

  • Steen, T.L.;Basu, S.N.;Sarin, V.K.;Murray, T.W.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.26 no.6
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    • pp.390-402
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    • 2006
  • The elastic properties and thickness of mullite environmental barrier coatings grown through chemical vapor deposition (CVD) on silicon carbide substrates were measured using frequency domain photoacoustic microscopy. In this technique, extremely narrow bandwidth surface acoustic waves are generated with an amplitude modulated laser source. A photorefractive crystal based interferometer is used to detect the resulting surface displacement. The complex displacement field is mapped as a function of source-to-receiver distance in order to extract the wavelength of the surface acoustic wave at a given excitation frequency, and the phase velocity is determined. The coatings tested exhibited spatial variations in thickness and mechanical properties. The measured surface wave dispersion curves were used to extract an effective value for the elastic modulus and the coating thickness. Nanoindentation was used to validate the measurements of the effective elastic modulus. The average elastic modulus measured through the coating thickness using nanoindentation is compared to the effective modulus found using the photoacoustic system. Optical microscopy is used to validate the thickness measurements. The results indicate that the photoacoustic microscopy technique can be used to estimate the effective elastic properties in coatings exhibiting spatial inhomogeneities, potentially providing valuable feedback for the optimization of the CVD growth process.