• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1763-1765
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• 2000

This paper presents deposition and characterizations of microcrystalline silicon ($\mu$ c-Si:H) films prepared by hot wire chemical vapor deposition at substrate temperature at 300$^{\circ}C$. The flow rates of $SiH_4$ gas are critical parameter for the formation of Si films with microcrystalline phase. We could obtain $\mu$ c-Si:H with columnar grain structure and volume fraction of 75% without H2 dilution. The electronic properties, hydrogen bonding configurations, and $H_2$ concentration inside the films are also strongly affected by $SiH_4$ flow rate, which is provided in this paper.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.42-42
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• 2007

In the future, electronic components will be integrated on flexible polymer substrates and then miniaturized by thin films using suitable thin film technologies. In this article, the concept of a room temperature CVD is demonstrated using $Bi_3NbO_7$ (BNO) films with a cubic fluorite structure and their structural and electrical properties were investigated in films deposited without substrate heating. Effects of substrate temperature on electrical properties of BNO films were also studied. Films deposited without substrate heating (real temperature of $50^{\circ}C$) show partially crystallized BNO single phases with grain size of approximately 6.5 nm. Their dielectric and leakage properties are comparable to those of films deposited by pulsed laser deposition at room temperature. The concept of room temperature CVD will become a new paradigm in the deposition of dielectric thin films for flexible electron device applications.

• Journal of Powder Materials
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• v.22 no.2
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• pp.122-128
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• 2015

In this study, titanium(Ti) meshes and porous bodies are employed to synthesize carbon nanotubes(CNTs) using methane($CH_4$) gas and camphene solution, respectively, by chemical vapor deposition. Camphene is impregnated into Ti porous bodies prior to heating in a furnace. Various microscopic and spectroscopic techniques are utilized to analyze CNTs. It is found that CNTs are more densely and homogeneously populated on the camphene impregnated Ti-porous bodies as compared to CNTs synthesized with methane on Ti-porous bodies. It is elucidated that, when synthesized with methane, few CNTs are formed inside of Ti porous bodies due to methane supply limited by internal structures of Ti porous bodies. Ti-meshes and porous bodies are found to be multi-walled with high degree of structural disorders. These CNTs are expected to be utilized as catalyst supports in catalytic filters and purification systems.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.47-52
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• 2013

Graphene has been synthesized on 100- and 300-nm-thick Ni/$SiO_2$/Si substrates with $CH_4$ gas (1 SCCM) diluted in mixed gases of 10% $H_2$ and 90% Ar (99 SCCM) at $900^{\circ}C$ by using inductively-coupled plasma chemical vapor deposition (ICP-CVD). The film morphology of 100-nm-thick Ni changed to islands on $SiO_2$/Si substrate after heat treatment at $900^{\circ}C$ for 2 min because of grain growth, whereas 300-nm-thick Ni still maintained a film morphology. Interestingly, suspended graphene was formed among Ni islands on 100-nm-thick Ni/$SiO_2$/Si substrate for the very short growth of 1 sec. In addition, the size of the graphene domains was much larger than that of Ni grains of 300-nm-thick Ni/$SiO_2$/Si substrate. These results suggest that graphene growth is strongly governed by the direct formation of graphene on the Ni surface due to reactive carbon radicals highly activated by ICP, rather than to well-known carbon precipitation from carbon-containing Ni. The D peak intensity of the Raman spectrum of graphene on 300-nm-thick Ni/$SiO_2$/Si was negligible, suggesting that high-quality graphene was formed. The 2D to G peak intensity ratio and the full-width at half maximum of the 2D peak were approximately 2.6 and $47cm^{-1}$, respectively. The several-layer graphene showed a low sheet resistance value of $718{\Omega}/sq$ and a high light transmittance of 87% at 550 nm.

• KEPCO Journal on Electric Power and Energy
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• v.1 no.1
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• pp.169-174
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• 2015

In this research, pristine graphene was synthesized using methane ($CH_4$) gas, and N-doped graphene was synthesized using pyridine ($C_5H_5N$) liquid source by chemical vapor deposition (CVD) method. Basic optical properties of both pristine and N-doped graphene were investigated by Raman spectroscopy and XPS (X-ray photoemission spectroscopy), and electrical transport characteristics were estimated by current-voltage response of graphene channel as a function of gate voltages. Results for CVD grown pristine graphene from methane gas show that G-peak, 2D-peak and C1s-peak in Raman spectra and XPS. Charge neutral point (CNP; Dirac-point) appeared at about +4 V gate bias in electrical characterization. In the case of pyridine based CVD grown N-doped graphene, D-peak, G-peak, weak 2D-peak were observed in Raman spectra and C1s-peak and slight N1s-peak in XPS. CNP appeared at -96 V gate bias in electrical characterization. These result show successful control of the property of graphene artificially synthesized by CVD method.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.538-539
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• 2013

여러 장점으로 인해 OLED는 디스플레이 및 조명 등 적용분야가 넓어지고 있지만, 수분 및 산소에 취약하여 그 수명이 제한되는 단점이 있다. 이를 해결하고자 현재까지는 glass cap을 이용한 encapsulation 기술이 적용되고 있지만, flexible 기판에 적용하지 못하는 문제가 있다. 이러한 문제를 해결하고자 여러 가지 thin film encapsulation 기술이 적용되고 있으나 보다 신뢰성이 높은 기술의 개발이 절실한 때이다. Encapsulation 무기 박막 물질로서 $Si_3N_4$ 박막은 PE-CVD (Plasma Enhanced Chemical Vapor Deposition) 등의 박막 증착법을 사용한 많은 연구가 진행되어, 저온에서의 좋은 품질의 박막 증착이 가능하지만, 100도 이하의 thermal budget을 갖는 OLED Encapsulation에 사용하기에는 충분하지 않았다. CVD 박막의 특성을 더욱 개선하기 위해 최근 ALD (Atomic Layer Deposition) 방법을 통한 $Al_2O_3$ film 증착 방법이 연구되고 있지만, 낮은 증착 속도로 인해 양산에 걸림돌이 되고 있다. 본 연구에서는 또 다른 해결책으로서 Digital CVD 방법을 이용한 양질의 $Si_3N_4$ 박막의 증착을 연구하였다. 이것은 ALD 증착법과 유사하며, 1st step에서 PECVD 방법으로 4~5 ${\AA}$의 얇은 silicon 박막을 증착하고, 2nd step에서 nitrogen plasma를 이용하여 질화 반응을 진행하고, 이러한 cycle을 원하는 두께가 될 때까지 반복적으로 진행된다. 이 때 1 cycle 당 증착속도는 7 ${\AA}$/cycle 정도였다. 최적의 증착 방법과 조건으로 기존의 CVD $Si_3N_4$ 박막 대비 1/5 이하로 pinhole을 최소화 할 수는 있지만 완벽하게 제거하기는 힘든 문제가 있고, 이를 해결하기 위한 개선을 위한 접근 방법이 필요하다고 판단하였다. 본 연구에서는 무기물 박막인 carbon nitride를 이용한 SiN/C:N multilayer 증착 연구를 진행하였다. Fig. 1은 CVD 조건으로 증착된 두께 750 nm SiN film에서 여러 층의 C:N film layer를 삽입했을 때, 38 시간의 85%/$85^{\circ}C$ 가속실험에 따라 OLED의 발광 사진이다. 그림에서 볼 수 있듯이 C:N 층을 삽입하고 또한 그 박막의 수가 증가함에 따라서 OLED에 대한 encapsulation 특성이 크게 개선됨을 확인할 수 있다.

• Korean Chemical Engineering Research
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• v.61 no.1
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• pp.62-67
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• 2023

Due to the prolonged impact of COVID-19, the demand for Information Technology (IT) products is increasing, and their production facilities are expanded. Consequently, the use of harmful and dangerous chemicals are increased, the risk of fire(s) and explosion(s) is also elevated. In order to mitigate these risks, the government sets standards, such as KS C IEC 60079-10-1, and manages explosion-prone hazardous facilities where flammable substances are manufactured, used, and handled. However, using the standards of KS, it is difficult to predict the actual possibility of an explosion in a facility, because ventilation (an important factor) is not considered when setting up a hazardous work environment. In this study, the SEMI S6, Tracer Gas Test was applied to the chemical vapor deposition (CVD) facility, a major part of the display industry, to evaluate ventilation performance and to confirm the possibility of creating a less explosive environment. Based on the results, it was confirmed that the ventilation performance in the assumed scenarios met the standards stipulated in SEMI S6, along with supporting the possibility of creating a less explosive working condition. Therefore, it is recommended to use the prediction tool using engineering techniques, as well as KS standards, in such hazardous environments to prevent accidents and/or reduce economic burden following accidents.

• Journal of the Korean Vacuum Society
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• v.21 no.2
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• pp.86-92
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• 2012

We have studied the effect of speed of deposited atom on morphology evolution during Glancing Angle Deposition (GLAD). Using Kinetic Monte Carlo simulation that incorporate molecular dynamics simulations, we have shown that the rough surface morphology became smoother as the speed of deposited atom is increased. The growth exponent ${\beta}$ change from 0.97 to 0.67 as the speed increase from ${\upsilon}_0$ to $10{\upsilon}_0$ in the case of GLAD. We also examined the effect of speed of deposited atom for the case of chemical vapor deposition (CVD) simulation. Compared to GLAD, the variation in scaling exponent ${\beta}$ is small but the speed of deposited atom also have considerable effect on growth morpholgy in the case of CVD.

• Composites Research
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• v.31 no.2
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• pp.43-50
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• 2018

The effects of deposition temperature on chemical vapor deposited silicon carbide (CVD-SiC) were studied to obtain high deposition rates and excellent bending strength characteristics. Silicon carbide prepared at $1250{\sim}1400^{\circ}C$ using methyltrichlorosilane(MTS : $CH_3SiCl_3$) by hot-wall CVD showed deposition rates of $95.7{\sim}117.2{\mu}m/hr$. The rate-limiting reaction showed the surface reaction at less than $1300^{\circ}C$, and the mass transfer dominant region at higher temperature. The activation energies calculated by Arrhenius plot were 11.26 kcal/mole and 4.47 kcal/mole, respectively. The surface morphology by the deposition temperature changed from $1250^{\circ}C$ pebble to $1300^{\circ}C$ facet structure and multi-facet structure at above $1350^{\circ}C$. The cross sectional microstructures were columnar at below $1300^{\circ}C$ and isometric at above $1350^{\circ}C$. The crystal phases were all identified as ${\beta}$-SiC, but (220) peak was observed from $1300^{\circ}C$ or higher at $1250^{\circ}C$ (111) and completely changed to (220) at $1400^{\circ}C$. The bending strength showed the maximum value at $1350^{\circ}C$ as densification increased at high temperatures and the microstructure changed from columnar to isometric. On the other hand, at $1400^{\circ}C$, the increasing of grain size and the direction of crystal growth were completely changed from (111) to (220), which is the closest packing face, so the bending strength value seems to have decreased.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.157-157
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• 2011

Graphene has generated significant interest in the recent years as a functional material for electronics, sensing, and energy applications due to its unique electrical, optical, and mechanical properties. Much of the considerable interest in graphene stems from results obtained for samples mechanically exfoliated from graphite. Practical applications, however, require reliable and well-controlled methods for fabrication of large area graphene films. Recently high quality graphene layers were fabricated using chemical vapor deposition (CVD) on nickel and copper with methane as the source of the carbon atoms. Here, we report a simple and efficient method to synthesize graphene layers using solid carbon source. Few-layer graphene films are grown using filtered vacuum arc source (FVAS) technique by evaporation of carbon atom on Ni catalytic metal and subsequent annealing of the samples at 800$^{\circ}$C. In our system, carbon atoms diffuse into the Ni metal layer at elevated temperatures followed by their segregation as graphene on the free surface during the cooling down step as the solubility of carbon in the metal decrease. For a given annealing condition and cooling rate, the number of graphene layers is easily controlled by changing the thickness of the initially evaporated amorphous carbon film. Based on the Raman analysis, the quality of graphene is comparable to other synthesis methods found in the literature, such as CVD and chemical methods.