• 폴리머
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• 제25권2호
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• pp.302-310
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• 2001

무전해도금법을 이용하여 구리/PET 필름 복합재료를 제조하였으며 에칭방법과 촉매액의 조성 및 acceleration 방법을 달리하여 PET 필름과 무전해도금된 구리 피막간의 접착력을 향상시키고자 하였다. HCl 용액으로 에칭된 PET 필름은 NaOH에 의한 것보다 더욱 세밀하게 에칭되어져 구리와 PET 필름간의 접착력은 향상되었으나 전자파 차폐효과는 유사한 경향을 보였다. 촉매액의 조성변화에 따른 영향을 살펴본 결과 PdCl$_2$:SnCl$_2$의 몰비가 1:4에서 1:16으로 증가할수록 PET 필름 위에 적층된 Pd/Sn 콜로이드 입자들의 크기가 감소하며 고르게 분포되는 경향을 보였다. 따라서 이들의 몰비가 증가할수록 구리도금이 균일하고 조밀하게 이루어져 접착력 및 차폐효과가 증가하였다. 또한 NaOH보다 HCl로 acceleration한 경우 촉매 입자의 크기가 작고 더 균일하게 분포되어 우수한 접착력과 도금물성을 나타내었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2003년도 제24회 학술발표회 초록집
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• pp.72-72
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• 2003

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권4호
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• pp.210-218
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• 2000

For the fabrication of $YBa_2Cu_3O_x$ thick film, a substrate of $Y_2BaCuO_5$ was fabricated by adding $CeO_2$ into $Y_2BaCuO_5$ and two types of doping materials added with binder material were prepared. Each doping material was patterned on $Y_2BaCuO_5$substrate by the screen printing method and then was annealed at the temperature with a few step. It could be observed by X-ray diffraction patterns and SEM photographs that through the diffusion process of the $Y_2BaCuO_5$ and each doping material, the $YBa_2Cu_3O_x$ phase was formed. And with n additive of $CeO_2$ the thickness of formed $YBa_2Cu_3O_x$decreased. From the experiment of current limiting on thick film, the sample with thiner thickness of $YBa_2Cu_3O_x$ showed the more effective characteristics of current limiting.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.370-370
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• 2012

Feature size of Cu interconnects keep shrinking into several tens of nanometer level. For this reason, the Cu interconnects face challenging issues such as increase of electro-migration, line-width dependent electrical resistivity increase, and gap-filling difficulty in high aspect ratio structures. As the thickness of the Cu film decreases below 30 nm, the electrical resistivity is not any more constant, but rather exponential. Research on alloying with other elements have been started to inhibit such escalation in the electrical resistivity. A faint trace of Al added in Cu film by sputtering was reported to contribute to suppression of the increase of the electrical resistivity. From an industrial point of view, we introduced cyclic metal organic chemical vapor deposition (MOCVD) in order to control Al concentration in the Cu film more easily by controlling the delivery time ratio of Cu and Al precursors. The amount of alloying element could be lowered at level of below 1 at%. Process of the alloy formation was applied into gap-filling to evaluate the performance of the gap-filling. Voidless gap-filling even into high aspect ratio trenches was achieved. In-depth analysis will be discussed in detail.

• 한국세라믹학회지
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• 제29권2호
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• pp.152-160
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• 1992

High-Tc superconductor thick films of YBa2Cu$\chi$O7-y (X=3, 3.5, 4) of which thickness varies from 100 $\mu\textrm{m}$ to 200 $\mu\textrm{m}$ were successfully prepared by plasma spraying method, and the characteristics of thick film depending on copper content and heat treatment conditions were investigated. Regardless of heat-treated temperature, the specimens with X=3 were composed of YBa2Cu$\chi$O7-y, Y2BaCuO5 and BaCuO3 phases. The specimens with X=4, however, were composed of YBa2Cu$\chi$O7-y phase at all heat treatment conditions. The specimens with X=4 composition showed the best superconducting characteristics after heat treatment at 925$^{\circ}C$, and the superconducting transition temperature with zero resistivity (Tc,zero) was 87K. The thick film lost superconductivity when the specimens were heat-treated at 950$^{\circ}C$ because of interdiffusion between superconductor elements and bond coating elements and Y2BaCuO5 phase was found was found to be main phase at the interface.

• 센서학회지
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• 제30권6호
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• pp.451-455
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• 2021

Porous copper bromide (CuBr) films are highly advantageous for detecting ammonia (NH₃). The fabrication of porous CuBr films requires complex high-temperature processes or multistep processes. Herein, we report the uncomplicated preparation of porous CuBr films by a spin-coating method and the films' excellent NH₃ sensing properties. The porous films were prepared by spin-coating 100, 150, and 200 mM CuBr solutions, and then dried in a vacuum oven for 2 h. All the films showed a high NH₃ response; in particular, the film prepared using a 100 mM CuBr solution showed an extremely high response (resistance ratio = 852) to 5 ppm NH₃. The film also showed fast response and recovery times, 272 s and 10 s respectively, even at room temperature. The outstanding NH₃ sensing characteristics were explained in relation to the porosity and thickness of the prepared films. The high-performance NH₃ sensors used in this study can be used for both indoor air quality and environmental monitoring applications.

• E2M - 전기 전자와 첨단 소재
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• 제9권8호
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• pp.819-824
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• 1996

We have investigated the temperature dependence of CO gas sensitivity for ZnO and ZnO-CuO thick films at 200 ppm CO gas, where those films were prepared by thermal transformation. The ZnO thick film shows the maximum sensitivity of -4 at >$300^{\circ}C$ On the other hand, ZnO-CuO(more than 1mol%) thick film shows that the maximum sensitivity reduced to less than 1.5. The decrease in sensitivity of CO gas with increasing the CuO contents is due to the decrease of the oxygen absorption in thick films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1230-1233
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• 2004

Ozone is useful oxidizing gas for the fabrication of oxide thin films. Accordingly researching on oxidizing gas is required. In order to obtain high quality oxide thin films, higher ozone concentration is necessary. In this paper oxidation property was evaluated relation between oxide gas pressure and inverse temperature(CuO reaction). The obtained condition was formulated by the fabrication of Cu metal thin film by co-deposition using the ion Beam Sputtering method. Because the CuO phase peak appeared at the XRD evaluation of the CuO thin film using ozone gas, this study has succeeded in the fabrication of the CuO phase at $825^{\circ}C$.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1544-1546
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• 1996

Thin films of Cu-Ni alloys of various compositions were prepared by RF sputtering onto glass and stainless steel substrates. The effect of composition, substrate temperature, Ar partial pressure, aging time on the electrical properties of Cu-Ni film strain gages in the thickness range $500{\sim}2000{\AA}$ was studied. The maximum resistivity is obtained from 53wt%Cu-47wt%Ni films, while their TCR becomes minimum. This tendency is very desirable for thin film strain gages.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집
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• pp.110-113
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• 2005

Ozone is useful oxidizing gas for the fabrication of BSCCO thin films. In order to obtain high quality oxide BSCCO thin films, higher ozone concentration is necessary. The growth rates of the films was set in the region from 0.17 to 0.27 nm/min. MgO(100) was used as a substrate. In this paper oxidation property was evaluated relation between oxide gas pressure and inverse temperature(CuO reaction). The obtained condition was formulated by the fabrication of Cu metal thin film by co-deposition using the Ion Beam Sputtering method. Because the CuO phase peak appeared at the XRD evaluation of the CuO thin film using ozone gas, this study has succeeded in the fabrication of the CuO phase at $825^{\circ}C$.