• Journal of Korean Society for Quality Management
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• v.31 no.1
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• pp.123-131
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• 2003

This paper considers a six sigma project for reducing the defects rate of the welding process in manufacturing firms. The project follows a disciplined process of five macro phases. define, measure, analyze, improve and control(DMAIC). The need of customers is used to identify critical to quality(CTQ) of project. And a process map is used to identify process input factors of CTQ. Four key process input factors are selected by using an input factor evaluation of teams; an interval of welding, an abrasion, an electric current and a moving freely. DOE is utilized for finding the optimal process conditions of the three key process input factors. Another one key input factor improved to welding machine. The six sigma level of defects rate becomes a 2.01 from a 1.61 at the beginning of the project.

• IE interfaces
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• v.16 no.spc
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• pp.1-6
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• 2003

This study deals with the problem of selecting 6 sigma projects. Traditionally, such selection was based on CTQ (critical to quality) or COPQ (cost of poor quality) derived within business units. Since the objective of 6 sigma is to achieve business goals in a short period, 6 sigma projects should be selected and carried out in coincidence with the whole company's strategies. This paper proposes two methods of selecting 6 sigma projects: one is to identify CTQ's by analyzing the company's BSC's (balanced score card) and then deploying them into subunits of the company and the other is to identify those projects with large hidden COPQ or cost of waste by applying value stream analysis and process model simulation to derive process cost models.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
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• v.7 no.3
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• pp.17-25
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• 2012

Wire bonding process in making semiconductor needs the most precise control and Critical To Quality(CTQ). Thus, it is regarded to be the most essential step in packaging process. In this process, pure gold wire is used to connect the chip and PCB(substrate or lead frame). However, the price of gold has been skyrocketing continuously for a long period of time and is expected to further increase in the near future. This phenomenon situates us in an unfavorable condition amidst the competitive environment. To avoid this situation, many semiconductor material making companies developed new types of wires: Au.Ag wire is one material followed by many others. This study is aimed to optimize the parameter in wire bonding with the use of 6sigma and QFD(Quality Function Deployment). 6sigma process is a good means to not only solve the problem, but to increase productivity. In order to find the key factor, we focused on VOB(Voice of Business) and VOC(Voice of Customer). The main factors from VOB, VOC are called CTQ. However, there were times when these main factors were far from offering us the correct answer, thus making the situation more difficult to handle. This study shows that QFD aids in deciding which of the accurate factors to undertake. Normally QFD is used in designing and developing products. 6sigma process is held more effective when it used with QFD.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.38 no.3
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• pp.21-28
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• 2015

As film products are increasingly used in a wide range of areas, from producing traditional flexible packaging to high-tech electronic products, a higher level of quality is demanded. Most film products are made in the form of rolled finished goods, therefore, various quality issues related to their shape characteristics must be addressed. The thickness of the film products is one of the most common and important critical-to-quality attributes (CTQs). Particularly, the degree of thickness uniformity is more important than other thickness parameters, because it will be potential causes of many secondary thickness-related quality problems, such as wrinkles or faulty windings. To control the degree of thickness uniformity, the fixed bending region is oneof the most important CTQs to manage. Fixed bending regions are special points in the transverse direction of a rolled product with consistent minute variations of the thickness gap. This paper describes the measurement and analysis of thickness uniformity data, which were performed in a real manufacturing field of biaxial oriented polypropylene (BOPP) film. In previous researches, quality function deployment (QFD) or fault tree analysis were used to find the most critical process attributes out to controlthe CTQ of thickness uniformity. Whereas, this paper uses traditional control charts to find the most critical process attributes out in this problem. In addition, the selection of one of the major critical process attributes (CTPs) that is expected to affect the CTQ of thickness uniformity is also described. The selected critical-to-process attributes are the controlled temperatures along the transverse direction. A dramatic improvement in thickness uniformity was observed when the selected CTPs were controlled.

• Journal of the Korean Society of Systems Engineering
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• v.5 no.1
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• pp.49-56
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• 2009

This research attempts to acquire technical performance measure information based on identifying the Critical To Quality(CTQ) parameters of user requirement by using Quality Function Deployment(QFD) methodology in the initial phase of a defense R&D project. This results will contribute to the integration of technical progress to the Work Breakdown Structure(WBS) based project performance tracking. It also improve the bridging of systems engineering activities to the project management and the project decision making process.

• Journal of the Korean Data and Information Science Society
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• v.19 no.4
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• pp.1255-1267
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• 2008

Evaluation indices for products or services are important to improve the internal process of the company and to compare those with competitive ones. The sigma level in Six Sigma management does important role to evaluate the core characteristic, CTQ(Critical To Quality), derived in the considered product/service or process. In this research, we propose an overall evaluation index for the product/service or process with multiple characteristics, in other words, multiple CTQs. The proposed overall evaluation index is useful for the cases that the single CTQ is not enough to evaluate the practical interests, for example, the final products and services with complex procedures and relatively large scaled processes. This approach is discussed with sigma level for applying Six Sigma Projects, however, it is applicable to indices based on proportion or percentage as well. The practical examples with a manufacturing process and a customer survey based on focus group interview are given for illustrations.

• Journal of Korean Society for Quality Management
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• v.34 no.1
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• pp.1-12
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• 2006

This paper presents a six sigma project for improving gate painting quality in a medium-sized automotive part company. The project follows a disciplined process of five macro phases: Define, Measure, Analyze, Improve, and Control. A CTQ(critical to quality) is determined based on COPQ(cost of poor quality) analysis, and a process map is utilized for identifying process input variables. Three KPIV s(key process input variable) are selected; Painting Temperature, Painting Quantity, and Painting Viscosity, and DOE(design of experiments) is utilized for finding the optimal process conditions for three KPIVs. MINITAB software is used for data analyses and DOE. The sigma level of defects rate has improved from 2.93 to 3.66.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.33 no.1
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• pp.33-40
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• 2010

Because sampling interval for data collection tends to be short compared with the overall processing time, in chemical process, instrumental process related tanks or furnace collected data have a significant autocorrelation. Insufficient control technique and frequent control actions cause unstable condition of the process. Traditional control charts which were developed based on iid (independently and identically distributed) among data cannot be applied on the existence of autocorrelation. Also unstable process is difficult to identity or diagnose. Because large-scale process has a lot of measurable variables and multi-step-structures among data, it is difficult to find relation between measurable variables and nonconformity. In this paper, we suggested an appicable model to diagnose the process and to find relation between measurable variables (CTQ) and nonconformity in the process having autocorrelation, unstable condition frequently, a lot of measurable variables, and multi-step-structure. And we applied this model to real process, to verify that the process engineers could easily and effectively diagnose the process and control the nonconformity.

• Journal of the Korea Safety Management & Science
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• v.12 no.2
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• pp.225-230
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• 2010

The purpose of the study was to apply and to expand the six sigma to reduce waiting times for computed tomography (CT) examination which manipulated by the department of radiology. It was preceded by DMAIC (Define, Measure, Analyze, Improve, and Control). In the stage of definition, it wereselected for total 5 critical to quality (CTQ), which were the kindness, the waiting time, the examination explanation, the waiting day and the waiting stand environment, that increased the reserved time of CT examination. In the stage of measurement, the number of examinations and of reservation waiting days performed and resulted in final CTQ(Y) which measured each 1.68 and 1.85 sigma. In the stage of analysis, the examination concentrated on morning time, non-scheduled examination of the day, the delayed time of booking, frequent telephone contacting and equipment malfunction were determined as variable key causes. In the stage of improvement, it were performed with expansion of the examination in the morning time, integration of laboratories that used to in each steps, developing the ability of simultaneous booking schedule for the multiple examinations, developing program of examination request, and the customer management team operations. For the control, the number of examinations and reserved waiting days were measured each 3.14 and 1.13 sigma.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.1-9
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• 2007

OSP(organic solderability preservatives) finish has been considered as a very effective process for substituting the metal surface treatment of Ni/Au finish because of lower cost, interface property and environmental issue of OSP finish. However, the discoloration of OSP layer is formed during assembly process consisting of various steps of temperature. The causes of discoloration and the characterization of solder joint were investigated with a degree of discoloration and the assembly process of OSP finished products, which was also compared statistically with that of conventional Ni/Au finished products. As the results, the solution of process trouble for OSP finished products is able to be offered.