• 품질경영학회지
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• 제31권1호
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• pp.123-131
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• 2003

This paper considers a six sigma project for reducing the defects rate of the welding process in manufacturing firms. The project follows a disciplined process of five macro phases. define, measure, analyze, improve and control(DMAIC). The need of customers is used to identify critical to quality(CTQ) of project. And a process map is used to identify process input factors of CTQ. Four key process input factors are selected by using an input factor evaluation of teams; an interval of welding, an abrasion, an electric current and a moving freely. DOE is utilized for finding the optimal process conditions of the three key process input factors. Another one key input factor improved to welding machine. The six sigma level of defects rate becomes a 2.01 from a 1.61 at the beginning of the project.

• 산업공학
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• 제16권spc호
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• pp.1-6
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• 2003

This study deals with the problem of selecting 6 sigma projects. Traditionally, such selection was based on CTQ (critical to quality) or COPQ (cost of poor quality) derived within business units. Since the objective of 6 sigma is to achieve business goals in a short period, 6 sigma projects should be selected and carried out in coincidence with the whole company's strategies. This paper proposes two methods of selecting 6 sigma projects: one is to identify CTQ's by analyzing the company's BSC's (balanced score card) and then deploying them into subunits of the company and the other is to identify those projects with large hidden COPQ or cost of waste by applying value stream analysis and process model simulation to derive process cost models.

• 벤처창업연구
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• 제7권3호
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• pp.17-25
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• 2012

반도체를 제작하는데 있어 Wire bonding 공정은 가장 정밀한 관리와 핵심품질특성(CTQ)을 필요로 한다. 포장과정에 있어서 가장 필수적인 단계로 간주된다. 이 과정에서는 순금 와이어가 칩과 PCB를 연결하기 위해서 사용된다. 금의 가격은 오랜 기간 동안 꾸준히 증가하여왔고, 근래에도 더 증가할 것으로 예상된다. 이러한 상황에서, 많은 반도체 제조 회사들은 새로운 종류의 와이어를 개발했다. 합금와이어가 그 중 하나이고 그것에 많은 연구가 이루어지고 있다. 본 연구는 Wire bonding 공정에서의 parameter를 6sigma와 품질기능전개(QFD)를 사용해 최적화시키고자 한다. 6sigma 과정은 그 문제를 해결하는데 뿐만이 아니라 생산성을 향상시키는데 좋은 기법이다. 중요한 요인을 찾기 위해서 고객의 소리에 초점을 두었다. 고객의 소리의 주요 요인들은 CTQ라고 불린다. 본 연구는 CTQ의 목표수준을 설정 한 후 중요인자를 선정하기 위하여 QFD 활동을 하였으며, 최적 조건 설정하기 위해 실험계획법을 이용하였다. 따라서 본 논문에서는 품질기능전개에서 신제품 개발 시 공정 조건을 최적화 하는 과정을 제시 하여 양산에서 발생될 수 있는 품질 위험요소를 사전에 제거 시킬 수 있게 되었다.

• 산업경영시스템학회지
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• 제38권3호
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• pp.21-28
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• 2015

As film products are increasingly used in a wide range of areas, from producing traditional flexible packaging to high-tech electronic products, a higher level of quality is demanded. Most film products are made in the form of rolled finished goods, therefore, various quality issues related to their shape characteristics must be addressed. The thickness of the film products is one of the most common and important critical-to-quality attributes (CTQs). Particularly, the degree of thickness uniformity is more important than other thickness parameters, because it will be potential causes of many secondary thickness-related quality problems, such as wrinkles or faulty windings. To control the degree of thickness uniformity, the fixed bending region is oneof the most important CTQs to manage. Fixed bending regions are special points in the transverse direction of a rolled product with consistent minute variations of the thickness gap. This paper describes the measurement and analysis of thickness uniformity data, which were performed in a real manufacturing field of biaxial oriented polypropylene (BOPP) film. In previous researches, quality function deployment (QFD) or fault tree analysis were used to find the most critical process attributes out to controlthe CTQ of thickness uniformity. Whereas, this paper uses traditional control charts to find the most critical process attributes out in this problem. In addition, the selection of one of the major critical process attributes (CTPs) that is expected to affect the CTQ of thickness uniformity is also described. The selected critical-to-process attributes are the controlled temperatures along the transverse direction. A dramatic improvement in thickness uniformity was observed when the selected CTPs were controlled.

• 시스템엔지니어링학술지
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• 제5권1호
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• pp.49-56
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• 2009

This research attempts to acquire technical performance measure information based on identifying the Critical To Quality(CTQ) parameters of user requirement by using Quality Function Deployment(QFD) methodology in the initial phase of a defense R&D project. This results will contribute to the integration of technical progress to the Work Breakdown Structure(WBS) based project performance tracking. It also improve the bridging of systems engineering activities to the project management and the project decision making process.

• Journal of the Korean Data and Information Science Society
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• 제19권4호
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• pp.1255-1267
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• 2008

Evaluation indices for products or services are important to improve the internal process of the company and to compare those with competitive ones. The sigma level in Six Sigma management does important role to evaluate the core characteristic, CTQ(Critical To Quality), derived in the considered product/service or process. In this research, we propose an overall evaluation index for the product/service or process with multiple characteristics, in other words, multiple CTQs. The proposed overall evaluation index is useful for the cases that the single CTQ is not enough to evaluate the practical interests, for example, the final products and services with complex procedures and relatively large scaled processes. This approach is discussed with sigma level for applying Six Sigma Projects, however, it is applicable to indices based on proportion or percentage as well. The practical examples with a manufacturing process and a customer survey based on focus group interview are given for illustrations.

• 품질경영학회지
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• 제34권1호
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• pp.1-12
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• 2006

This paper presents a six sigma project for improving gate painting quality in a medium-sized automotive part company. The project follows a disciplined process of five macro phases: Define, Measure, Analyze, Improve, and Control. A CTQ(critical to quality) is determined based on COPQ(cost of poor quality) analysis, and a process map is utilized for identifying process input variables. Three KPIV s(key process input variable) are selected; Painting Temperature, Painting Quantity, and Painting Viscosity, and DOE(design of experiments) is utilized for finding the optimal process conditions for three KPIVs. MINITAB software is used for data analyses and DOE. The sigma level of defects rate has improved from 2.93 to 3.66.

• 산업경영시스템학회지
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• 제33권1호
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• pp.33-40
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• 2010

Because sampling interval for data collection tends to be short compared with the overall processing time, in chemical process, instrumental process related tanks or furnace collected data have a significant autocorrelation. Insufficient control technique and frequent control actions cause unstable condition of the process. Traditional control charts which were developed based on iid (independently and identically distributed) among data cannot be applied on the existence of autocorrelation. Also unstable process is difficult to identity or diagnose. Because large-scale process has a lot of measurable variables and multi-step-structures among data, it is difficult to find relation between measurable variables and nonconformity. In this paper, we suggested an appicable model to diagnose the process and to find relation between measurable variables (CTQ) and nonconformity in the process having autocorrelation, unstable condition frequently, a lot of measurable variables, and multi-step-structure. And we applied this model to real process, to verify that the process engineers could easily and effectively diagnose the process and control the nonconformity.

• 대한안전경영과학회지
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• 제12권2호
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• pp.225-230
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• 2010

The purpose of the study was to apply and to expand the six sigma to reduce waiting times for computed tomography (CT) examination which manipulated by the department of radiology. It was preceded by DMAIC (Define, Measure, Analyze, Improve, and Control). In the stage of definition, it wereselected for total 5 critical to quality (CTQ), which were the kindness, the waiting time, the examination explanation, the waiting day and the waiting stand environment, that increased the reserved time of CT examination. In the stage of measurement, the number of examinations and of reservation waiting days performed and resulted in final CTQ(Y) which measured each 1.68 and 1.85 sigma. In the stage of analysis, the examination concentrated on morning time, non-scheduled examination of the day, the delayed time of booking, frequent telephone contacting and equipment malfunction were determined as variable key causes. In the stage of improvement, it were performed with expansion of the examination in the morning time, integration of laboratories that used to in each steps, developing the ability of simultaneous booking schedule for the multiple examinations, developing program of examination request, and the customer management team operations. For the control, the number of examinations and reserved waiting days were measured each 3.14 and 1.13 sigma.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.1-9
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• 2007

OSP(Organic Solderability Preservatives)표면처리는 저비용, 고신뢰성, 친환경 특성으로 기존의 금속계 표면처리인 Ni/Au 표면처리를 대체할 수 있는 공정으로 관심 받고 있다. 그러나, OSP는 저분자로 구성된 유기물이므로 여러 온도공정으로 구성된 전자패키지공정에서 제품의 변색이 필연적으로 발생하여 전체 양산수율에 미치는 영향은 매우 크다. 본 연구에서 OSP 처리된 제품을 전자패키지 공정별로 발생하는 변색수준에 따라서 시편을 분류 및 채취하여 변색원인분석 및 솔더조인트 특성평가를 수행하였으며, 기존의 표면처리공정인 Ni/Au 처리된 제품과 통계 적으로 비교 분석하였다. 따라서 변색원인에 대한 분석을 통하여 OSP 처리된 전자패키지 제품에 적용 시 발생하는 공정문제점에 대한 해결책을 제시하였다.