• Korean Management Science Review
• /
• v.26 no.3
• /
• pp.157-167
• /
• 2009

Technology transition from defense technology to weapon system is an important process for defense acquisition program. Many countries such as USA, UK, Australia and Republic of Korea use technology readiness level (TRL) as a tool for technology transition by identifying critical technology elements (CTEs) and assessing the technology maturity. In this paper we review a transition process for the defense acquisition. Then we suggest a method to evaluate system's TRL using each component TRL and integration readiness level (IRL) between each technologies. We apply the method to an ACTD project. A result show that technology maturity is influenced by integration between technologies.

• Proceedings of the KWS Conference
• /
• 2007.11a
• /
• pp.150-152
• /
• 2007

It has been known that the underfilling technique is effective in reducing thermal and environmental stress concentration at solder joint in FC asscemblies. In this paper, the effect of thermomechanical properties of underfill such as coefficient of thermal expansion(CTE) and Young's modulus on reliability of FC assembly under thermal cycling was investigated. For parametric study for optimal design of underfill, finite element analyses(FEA) were performed for seven different CTEs and five different Young's modulus. The results show that the concentrated maximum stress decreases as Young's modulus of underfill increases and the CTE of underfill decreases.

• Proceedings of the KSME Conference
• /
• 2004.04a
• /
• pp.192-197
• /
• 2004

The anisotropy in coefficient of thermal expansion (CTE) between the in-plane and out-of-plane of 3-dimensional thick composite structures induces residual stresses and the large void content due to insufficient compaction of fabric composites, which results in low interlaminar strengths. In order to reduce the through thickness CTE and the void content, in this work, carbon fabric phenolic laminates were compacted by pressure generated by autoclave and a compressive jig, from which the through-thickness CTEs and the void contents were measured. From the measurement, it was found that the through-thickness CTE and the void content had different characteristics from ordinary composites due to gas produced during the cure reaction of phenolic resin.

• Korean Journal of Materials Research
• /
• v.10 no.3
• /
• pp.184-190
• /
• 2000

We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Tunnel and Underground Space
• /
• v.25 no.2
• /
• pp.168-185
• /
• 2015

The thermal-hydrological-mechanical (T-H-M) behavior of rock mass surrounding a large-scale high-temperature cavern thermal energy storage (CTES) at a shallow depth has been investigated, and the effects of hydrological conditions such as water table and rock permeability on the behavior have been examined. The liquid saturation of ground water around a storage cavern may have a small impact on the overall heat transfer and mechanical behavior of surrounding rock mass for a relatively low rock permeability of $10^{-17}m^2$. In terms of the distributions of temperature, stress and displacement of the surrounding rock mass, the results expected from the simulation with the cavern below the water table were almost identical to that obtained from the simulation with the cavern in the unsaturated zone. The heat transfer in the rock mass with reasonable permeability ${\leq}10^{-15}m^2$ was dominated by the conduction. In the simulation with rock permeability of $10^{-12}m^2$, however, the convective heat transfer by ground-water was dominant, accompanying the upward heat flow to near-ground surface. The temperature and pressure around a storage cavern showed different distributions according to the rock permeability, as a result of the complex coupled processes such as the heat transfer by multi-phase flow and the evaporation of ground-water.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.34 no.5
• /
• pp.293-300
• /
• 2021

In this study, the microstructure and thermal conductivity correlation was investigated for concrete materials used in concrete thermal energy storage (CTES) among real-time energy storage devices. Graphite was used as admixture to increase the thermal conductivity performance of the CTES. Concrete specimens of 10% and 15% substitution of cement by mass with graphite, as well as ordinary portland cement (OPC) specimens were prepared, and the microstructural changes and effects on thermal conductivity were analyzed. Porosities of OPC and concrete with graphite were compared using micro-CT, and the microstructural characteristics were quantified using probability functions. Three-dimensional virtual specimens were constructed for thermal analysis, to confirm the effect of microstructural characteristics on thermal conductivity, and the results were compared with the measured conductivity obtained using the hot-disc method. To identify thermal conductivity of graphite for thermal analysis, solid phase conductivity was inversely determined based on simulation and experimental results, and the effect of graphite on thermal conductivity was analyzed.

• Applied Chemistry for Engineering
• /
• v.22 no.1
• /
• pp.104-108
• /
• 2011

In the non-conductive adhesives (NCAs) for adhesion of micro electro mechanical system (MEMS), there are some problems such as delamination and cracking resulting from the large differences of coefficients of thermal expansion (CTE) between NCAs and substrates. So, the addition of inorganic particles such as silica and nano clay to the CTEs composit have been applied to reduce the CTEs of the adhesives. Additions of the flexibilizers such as siloxanes have also been performed to improve the flexibility of epoxy composite. Amino modified siloxane (AMSs) were used to improve compatibility between epoxy and siloxane. In this study, glass transition temperatures (Tg) and moduli of those composites were measured to confirm the effects of AMS with two different equivalents on thermal/mechanical properties of AMS/epoxy composites. Tg of KF-8010/epoxy composites decreased from 148 to $122^{\circ}C$ and those of X-22-161A/epoxy composites decreased from 148 to $121^{\circ}C$. Moduli of KF-8010/epoxy composites decreased from 2648 to 2143 MPa by adding KF-8010 and moduli of X-22-161A/epoxy composites decreased from 2648 to 2014 MPa. In short, using long Si-O chain AMS leads to a greater decrease in moduli. However, haven't showed significant differences in Tg's.

• Proceedings of the KSRS Conference
• /
• 2006.03a
• /
• pp.381-385
• /
• 2006

2008년 발사를 목표로 개발되고 있는 통신해양기상위성(COMS: Communication, Ocean and Meteorological Satellite)는 기상 관측과 해양 관측 임무 및 통신 임무까지 수행하는 정지궤도 위성이다. 통신해양기상위성은 크게 탑재체와 지상국으로 나눌 수 있고 지상국은 다시 통신 임무를 위한 CTES(Communication Test Earth Station), 해양/기상 임무를 위한 IDACS(Image Acquisition and Control System), 그리고 위성 관제와 운영을 위한 SGCS(Satellite Ground Control System)로 구분된다. 이 중 IDACS의 서브시스템 중 하나인 LHGS(LRIT/HRIT Generation Subsystem)는 LRIT/HRIT(Low Rate Information Transmission/High Rate Information Transmission)를 생성하고 배포하는 기능을 가지고 있다. 관측 종료 후 LRIT/HRIT 전송 완료까지 15분 이내로 이루어져야 한다는 기상청의 요구사항을 만족하기 위해서 JPEG 압축 시간도 중요한 요소로 고려되어야 한다. 그래서 본 논문에서는 MTSAT에서 받은 LRIT/HRIT의 자료 처리를 바탕으로 lossless JPEG와 lossy JPEG의 압축 시간을 측정하여 압축률을 비교하여 성능 분석을 해보기로 한다. 이렇게 도출해낸 수치자료는 COMS LHGS 설계에 활용할 수 있다.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.27 no.5
• /
• pp.393-401
• /
• 2014

In this paper, we propose an evaluation scheme of the coefficients of thermal expansion (CTE) of constituents in composite materials using an inverse analysis. The size of constituents typically is about a few micrometers, which makes the identification of material properties difficult as well as the measurement results inaccurate. The proposed inverse analysis scheme, which is combined with the Mori-Tanaka method for predicting an equivalent CTE of composite materials, provides the CTE of the constituents in a straightforward manner by minimizing the cost function defined in lamina scale with the steepest descent method. To demonstrate the effectiveness and accuracy of the proposed scheme, the CTEs of several fibers (glass fiber, P75, P100, and M55J) embedded in matrix are evaluated and compared with experimental results. Furthermore, we discuss the effects of uncertainty of laminar and matrix properties on the prediction of fiber properties.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.3
• /
• pp.73-82
• /
• 2003

Recently, PWB(Printed Wiring Board) has been recognized in the field of microelectronic package as core technology for designing or manufacturing. PWB is the structure stacked by several materials with different thermophysical properties, which shows the different CTEs(Coefficient or Thermal Expansions) during the fabrication process and causes a lot of defects such as warpage, shrinkage, dimension, etc. Thermal deformation of PWB is affected mainly by the volume change of solder-resist among fabrication parameters. Therefore, thermal deformation of PBGA and CSP consisting of 2 layers and 4 layers was studied with solder-resist process. When over 30% in volume fraction of solder-resist, thermal deformation of 2-layered PWB was min. 40% higher than that of 4-layered PWB because 4-layered PWB contained the layer with high toughness such as prepreg, which counterbalanced the thermal deformation of solder-resist. Otherwise, when below 30%, PWB showed similar thermal deformation without regard to layers and design.