• ETRI Journal
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• v.28 no.2
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• pp.175-181
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• 2006

A new CMOS voltage-controlled fully-differential transconductor is presented. The basic structure of the proposed transconductor is based on a four-MOS transistor cell operating in the triode or saturation region. It achieves a high linearity range of ${\pm}\;1\;V$ at a 1.5 V supply voltage. The proposed transconductor is used to realize a new fully-differential Gm-C low-pass filter with a minimum number of transconductors and grounded capacitors. PSpice simulation results for the transconductor circuit and its filter application indicating the linearity range and verifying the analytical results using $0.35\;{\mu}m$ technology are also given.

• Proceedings of the Korean Information Science Society Conference
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• 2004.10a
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• pp.556-558
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• 2004

최근 VLSI 설계 분야에서, 단열 논리는 에너지 효율성이 뛰어난 저전력 설계 기술 중 하나로 각광 받고 있다. 이러한 단열 논리는 기존의 저전력 회로 설계를 위해 사용되었던 CMOS 논리들을 서서히 대체해 나갈 컷으로 기대되고 있다. 하지만 않은 단열 논리들의 제시에도 불구하고, 기존의 CMOS논리들을 단열 논리로 대체하는 기법에 관한 연구는 거의 없는 실정이다. 이 논문에서는 래치형 패스 트랜지스터 단열 논리(LPAL)와 이를 이용한 저전력 설계 기법을 소개하였다. 래치형 패스 트랜지스터 단열 논리는 기존의 단열 논리들이 가지고 있는 단정을 해결하고, 보다 저전력 지향적으로 CMOS논리를 대체 할 수 있다는 장점을 가진다.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.439-440
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• 2008

A high-speed DCO is proposed that uses the negative-skewed delay scheme. The DCO consists of a ring of inverters with each PMOS transistor driven from the output of 3 earlier stage through a set of minimum-sized pass-transistors. The digitization of negative-skewed delay is achieved by selecting pass-transistors turned on and digitizing the gate voltages of the selected pass-transistors. The proposed 7-stage DCO has been simulated using 1.8V, $0.18\;{\mu}m$ TSMC CMOS process to obtain a resolution of 3ps and an operation range of 2.88-5.03GHz.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.6
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• pp.447-458
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• 2003

A high speed multiplier is essential basic building block for digital signal processors today. Typically iterative algorithms in Signal processing applications are realized which need a large number of multiply, add and accumulate operations. This paper describes a macro block of a parallel structured multiplier which has adopted a 32$\times$32-b regularly structured tree (RST). To improve the speed of the tree part, modified partial product generation method has been devised at architecture level. This reduces the 4 levels of compression stage to 3 levels, and propagation delay in Wallace tree structure by utilizing 4-2 compressor as well. Furthermore, this enables tree part to be combined with four modular block to construct a CSA tree (carry save adder tree). Therefore, combined with four modular block to construct a CSA tree (carry save adder tree). Therefore, multiplier architecture can be regularly laid out with same modules composed of Booth selectors, compressors and Modified Partial Product Generators (MPPG). At the circuit level new Booth selector with less transistors and encoder are proposed. The reduction in the number of transistors in Booth selector has a greater impact on the total transistor count. The transistor count of designed selector is 9 using PTL(Pass Transistor Logic). This reduces the transistor count by 50% as compared with that of the conventional one. The designed multiplier in 0.25${\mu}{\textrm}{m}$ technology, 2.5V, 1-poly and 5-metal CMOS process is simulated by Hspice and Epic. Delay is 4.2㎱ and average power consumes 1.81㎽/MHz. This result is far better than conventional multiplier with equal or better than the best one published.

• Journal of Sensor Science and Technology
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• v.19 no.1
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• pp.25-30
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• 2010

This paper presents a low noise CMOS regulator for a low power capacitive sensor interface in a $0.5{\mu}m$ CMOS standard technology. Proposed LDO regulator circuit consist of a voltage reference block, an error amplifier and a new buffer between error amplifier and pass transistor for a good output stability. Conventional source follower buffer structure is simple, but has a narrow output swing and a low S/N ratio. In this paper, we use a 2-stage wide band OTA instead of source follower structure for a buffer. From SPICE simulation results, we got 0.8 % line regulation and 0.18 % load regulation.

• Journal of IKEEE
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• v.7 no.1 s.12
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• pp.56-62
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• 2003

In this paper, we designed a adder and a multiplier using current mode T-gate on $GF(2^2)$. The T-gate is consisted of current mirror and pass transistor, the designed 4-valued T-gate used adder and multiplier on $GF(2^2)$. We designed its under 1.5um CMOS standard technology. The unit current of the circuits is 15㎂, and power supply is 3.3V VDD. The proposed current mode CMOS operator have a advantage of module by T-gate`s arrangement, and so we easily implement multi-valued operator.

• Transactions on Electrical and Electronic Materials
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• v.18 no.5
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• pp.257-260
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• 2017

In this paper, we present the design of a 4.5 V low dropout (LDO) voltage regulator implemented in the 130 nm CMOS process. The design uses a two-stage cascaded operational transconductance amplifier (OTA) as an error amplifier, with a body bias technique for reducing dropout voltages. PMOS is used as a pass transistor to ensure stable output voltages. The results show that the proposed LDO regulator has a dropout voltage of 32.06 mV when implemented in the130 nm CMOS process. The power dissipation is only 1.3593 mW and the proposed circuit operates under an input voltage of 5V with an active area of $703{\mu}m^2$, ensuring that the proposed circuit is suitable for low-power applications.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.8
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• pp.33-41
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• 1998

We have designed a high speed and low power 16bit-ELM adder with variable-sized cells uitlizing the fact that the logic depth of lower bit position is less than that of the higher bit position int he conventional ELM architecture. As a result of HSPICE simulation with 0.8.mu.m single-poly double-metal LG CMOS process parameter, out 16bit-ELM adder with variable-sized cells shows the reduction of power-delay-product, which is less than that of the conventional 16bit-ELM adder with reference-sized cells by 19.3%. We optimized the desin with various logic styles including static CMOs, pass-transistor logic and Wang's XOR/XNOR gate. Maximum delay path of an ELM adder depends on the implementation method of S cells and their logic style.

• Journal of Sensor Science and Technology
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• v.33 no.3
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• pp.147-151
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• 2024

The importance of Wireless Sensor Networks is becoming more evident owing to their practical applications in various areas. However, the energy problem remains a critical barrier to the progress of WSNs. By reducing the energy consumed by the sensor nodes that constitute WSNs, the performance and lifespan of WSNs will be enhanced. In this study, we introduce an energy-efficient ternary modulator that employs multi-threshold CMOS for logic conversion. We optimized the design with a low-power ternary gate structure based on a pass transistor using the MTCMOS process. Our design uses 71.69% fewer transistors compared to the previous design. To demonstrate the improvements in our design, we conducted the HSPICE simulation using a CMOS 180 nm process with a 1.8V supply voltage. The simulation results show that the proposed ternary modulator is more energy-efficient than the previous modulator. Power-delay product, a benchmark for energy efficiency, is reduced by 97.19%. Furthermore, corner simulations demonstrate that our modulator is stable against PVT variations.

• Journal of the Korea Computer Industry Society
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• v.6 no.5
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• pp.757-766
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• 2005

There have been great demands for higher density SRAM in all area of SRAM applications, such as mobile, network, cache, and embedded applications. Therefore, aggressive shrinkage of 6T Full CMOS SRAM had been continued as the technology advances, However, conventional 6T Full CMOS SRAM has a basic limitation in the cell size because it needs 6 transistors on a silicon substrate compared to 1 transistor in a DRAM cell. The typical cell area of 6T Full CMOS SRAM is $70{\sim}90F^{2}$, which is too large compared to $8{\sim}9F^{2}$ of DRAM cell. With 80nm design rule using 193nm ArF lithography, the maximum density is 72M bits at the most. Therefore, pseudo SRAM or 1T SRAM, whose memory cell is the same as DRAM cell, is being adopted for the solution of the high density SRAM applications more than 64M bits. However, the refresh time limits not only the maximum operation temperature but also nearly all critical electrical characteristics of the products such as stand_by current and random access time. In order to overcome both the size penalty of the conventional 6T Full CMOS SRAM cell and the poor characteristics of the TFT load cell, we have developed $S^{3}$ cell. The Load pMOS and the Pass nMOS on ILD have nearly single crystal silicon channel according to the TEM and electron diffraction pattern analysis. In this study, we present $S^{3}$ SRAM cell technology with 100nm design rule in further detail, including the process integration and the basic characteristics of stacked single crystal silicon TFT.