• Food Science and Biotechnology
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• v.17 no.5
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• pp.1102-1105
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• 2008

The structural change and leakage of cellular substances of Saccharomyces cerevisiae attributed by high hydrostatic pressure (HHP) treatment were observed with scanning electron microscopy (SEM). S. cerevisiae (ATCC16664) was inoculated in apple juice for 10 min at $23^{\circ}C$ and the apple juice treated at 138, 207, 276, 345, and 414 MPa pressure for 30 sec at $23^{\circ}C$. Increased of roughness, elongation, wrinkling, and pores on yeast cell surfaces, the yeast cell walls were severely damaged by HHP treatment from 276 to 414 MPa. Inactivation of S. cerevisiae by HHP is dependent on structural changes on the cell walls observed with SEM.

• Journal of the Korean Society of Safety
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• v.33 no.3
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• pp.8-14
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• 2018

Ni-base superalloy has excellent resistance to extreme environments such as high temperatures and high stresses and are used as materials for large gas turbines. In this paper, the specimens were taken from the blade that were used for a long time, and their life span was studied by microstructure analysis and avoidance of cursing. The microstructural analysis of the specimens was carried out using a OM and SEM to observe the coarsening, carbides on gamma prime. Low-cycle fatigue tests were performed on new material and airfoil of long time-used blade. The test was conducted under various deformation conditions and temperature conditions of $760^{\circ}C$ and $870^{\circ}C$. The low cycle fatigue test was carried out using the Coffin-Manson equation and the fatigue life was predicted. After the test, crack path and fracture surface were analyzed using SEM.

• Journal of the Korean Vacuum Society
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• v.11 no.4
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• pp.225-229
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• 2002

LPCVD silicon films were deposited at temperatures between $560^{\circ}C$ and $650^{\circ}C$ Structure, surface roughness, films thickness and residual stress were measured by using XRD, SEM, ellipsometer, $Tektak^3$, Tencor FLX-2320 and other techniques. Polysilicon films of low stress, small surface roughness were obtained when the films are deposited at $560^{\circ}C$ in the amorphous phase and subsequently annealed to make polycrystalline silicon layers at $900^{\circ}C$ -$1100^{\circ}C$. The silicon films deposited in amorphous phase and crystallized by post thermal treatment showed better mechanical properties.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.50-55
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• 2008

Carbon Nanotube (CNT) films were deposited with varying deposition temperature by RF plasma CVD on Fe catalysts deposited onto $SiO_2$ films grown thermally on the silicon wafer using $C_2H_2$ and $H_2$ gases. The Fe catalysts on silicon oxide film were made by RF magnetron sputtering. The grounded grid mesh cover on the substrate holder was used for depositing CNT thin films with high purity. The surface morphologies and chemical structure of deposited CNT films were characterized using SEM, Raman, XPS and TEM. It was observed that deposited CNTs films were carbon fiber type having Bamboo-like multiwall structure and CNT film grown at $600^{\circ}C$ was more dense than that at $550^{\circ}C$, but become less dense at $650^{\circ}C$.

• Tunnel and Underground Space
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• v.11 no.4
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• pp.352-361
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• 2001

Mode I fracture toughness ( $K_{IC}$) of the frozen rocks and that of the frozen-thawed rocks were obtained by using BDT and CCNBD specimens. The test temperatures ranged from +$25^{\circ}C$ to -16$0^{\circ}C$. Wet and air-dry specimens of granite and sandstone were used in order to investigate the effect of water and porosity on fracture toughness. The SEM images of the frozen-thawed rocks were also analysed to check the density of thermal cracks. The $K_{IC}$ of the frozen rocks increased as the test temperature went down. The rate of increase was higher in wet condition than in dry condition and the rate of increase for wet granite was higher than that for wet sandstone. The $K_{IC}$ of the frozen-thawed rocks varied within 15% from the $K_{IC}$ of the rocks at room temperature. After one freeze-thaw process, thermal crack occurred in granite but no thermal cracks occurred in sandstone. And the crack density was increased as the temperature went down.n.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2001.11a
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• pp.22-22
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• 2001

전통적으로 초경합금은 무라까미 용액에서 에칭하거나 묽은 염산에 넣고 끓이는 방법에 의해 그 밋구조를 관찰하였다. 그러나 carbide 입자가 suvmicron 크기인 초경합금에서는 전통적인 에칭 방법으 에칭 후에도 입자/기지상, 입자/입자 입계를 동시에 구분시킬 수 있는 SEM 사진을 얻을 수 없다. 본 연구에서는 submicron 크기 초경합금의 고배율 SEM 사진을 얻을 수있는 90H2O2 - 10HNO3 (vol%)의 새로운 에칭 용액을 개발하였다. 경명의 submicron 크기 WC-Co 시편을 샐운 에칭 용액인 90H2O2 - 10HNO3 (vol%)에 넣고 약 6$0^{\circ}C$에서 약 12분 동안 에칭하였다. 에칭에 의해 Co 기지상은 빠르게 제기(dissolution)되었고, 동시에 표면의 WC 입자들은 각각의 결정학적 방향에 따라 천천히(slowly) 다른 속도로 부식(sissolution)되었다. 고배율 SEM을 관찰한 결과 WC/기지상 계면과 WC/WC 입계가 명화갛게 관찰되었다. WC 입자의 성장을 억제시키는입자성장 억제제(Cr3C2, TaC,VC)가 첨가된 WC Co 초경합금을 새로운 에칭 용액인 90H2O2 - 10HNO3 (vol%)에 넣고 약 6$0^{\circ}C$에서 약 12분동안 에칭하였다. 매우 작은 입자를 갖는 미세구조임에도 불구하고 고배율 SEM에서 WC/기지상 계면과 WC/WC 입계가 명확하게 관찰되었다. 90H2O2 - 10HNO3 (vol%)에서 Co 기지상이 빠르게 제거되는 것은 산 (acid)인 HNO3)에서 금속인 Co가 쉽게 녹기 때문이다. 동시에 WC 입자들이 각각 다른 속도로 에칭 된 것은 강력한 산화제인 H2O2가 각각의 WC입자 표면에 얇은 텅스텐 산화물 층을 형성시켰고 이들이 산인 HNO3에서 녹았기 때문이다. 본 연구에서 개발된 새로운 에칭 용액인 90H2O2 - 10HNO3 (vol%)의 에칭 원리가 똑같이 적용 가능한 다른 종류의 초경 합금에서도 사용이 가능할 것으로 판단된다.로 판단된다.

• Membrane Journal
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• v.24 no.6
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• pp.438-447
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• 2014

The amorphous and porous borosilicate without any cracks was obtained under the following condition : 0.01~ 0.10 mole ratio of trimethylborate (TMB)/ tetraethylorthosilicate (TEOS) and the temperature of $700{\sim}800^{\circ}C$. According to the BET and SEM measurements, borosilicate heat-treated in between 700 and $800^{\circ}C$ showed the surface area of $251.12{\sim}355.62m^2/g$, the pore diameter of 3.5~4.9 nm, and the particle size of 30~60 nm. According to the TGA measurements, the thermal stability of poly[1-(trimethylsilyl)propyne](PTMSP) membrane was enhanced by inserting borosilicate. SEM observation showed that the size of dispersed borosilicate in the composite membrane was $1{\mu}m$. The results showed that the permeability of $H_2$ and $N_2$ increased and the selectivity of $H_2/N_2$ decreased upon the addition of borosilicate into PTMSP membranes. Addition of borosilicate may possibly increase the free volume, cavity and porosity of membranes indicating that permeation occurred by molecular sieving, surface and Knudsen diffusion rather than solution diffusion of gases.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.3
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• pp.131-135
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• 2008

This study is to establish the coating technique for synthetic mica and to prepare synthetic mica with the non-aqueous property. The surface coating of synthetic mica is prepared with stearic acid using the high speed stirrer. The characterizations for mica powders coated the stearic acid are carried out by the deposition test, XRD and SEM. The results of research could be coated the stearic acid on the mica by 1600 rpm/min at $70^{\circ}C$ for 10 min. From the observation of SEM was found that the non-aqueous property mica could obtained by mixture ratios for stearic acid and mica, the inner temperature and rotation speed of the stirrer but treated time be unrelated.

• Polymer(Korea)
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• v.25 no.6
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• pp.876-883
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• 2001

A thermotropic liquid crystalline polyester (TLCP) containing a side group was, synthesized from ethoxyhydroquinone and bromoterephthalic acid. Intercalation of TLCP in layered clays is accomplished by heating the polymer with hexadecyl ammonium-montmorillonite ($C_{16}$) above melting transition temperature ($T_m$). Liquid crystallinity of the TLCP/$C_{16}$-hybrid was observed up to 6 wt% $C_{16}$-MMT. Some of the $C_{16}$-MMTs in TLCP were highly dispersed in a nanometer scale, but some of them were agglomerated. Thermal and morphological properties of the nanocomposites were examined by differential scanning calorimetry (DSC), thermogravimetric analyzer (TGA), polarized optical microscope, and electron microscopes (SEM and TEM).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.883-888
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.