• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.3
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• pp.111-115
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• 2006

We investigated accelerated soft error rate(ASER) in 8M static random access memory(SRAM) cells. The effects on ASER by well structure, operational voltage, and cell transistor threshold voltage are examined. The ASER decreased exponentially with respect to operational voltage. The chips with buried nwell1 layer showed lower ASER than those either with normal well structure or with buried nwell1 + buried pwell structure. The ASER decreased as the ion implantation energy onto buried nwell1 changed from 1.5 MeV to 1.0 MeV. The lower viscosity of the capping layer also revealed lower ASER value. The decrease in the threshold voltage of driver or load transistor in SRAM cells caused the increase in the transistor on-current, resulting in lower ASER value. We confirmed that in order to obtain low ASER SRAM cells, it is necessary to also the buried nwell1 structure scheme and to fabricate the cell transistors with low threshold voltage and high on-current.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.1
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• pp.15-18
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• 2003

The characteristics of accelerated soft error rate (ASER) for fabricated 8M SRAM are evaluated for various well structures. The application of the Buried NWell (BNW) and the variations of each well structure, well dose in process conditions are checked by ASER failure in time (FIT) in terms of reliability. The application of only the BNW shows the lowest ASER FIT value. The BNW added to the Buried PWell (BPW) shows a 200% increase and the BNW plus the Striped BPW (SBPW) shows a 100% increase compared to applying the BNW. The cases of applying SBPW show very high ASER FIT.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.6
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• pp.507-511
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• 2006

We investigated accelerated soft error rate (ASER) in static random access memory (SRAM) cells of thin film transistor (TFT) type. The effects on ASER by cell density, buried nwell structure, operational voltage, and polysilicon-2 layer thickness were examined. The increase in the operational voltage, and the decrease in the density of SRAM cells, respectively, resulted in the decrease of ASER values. The SRAM chips with buried nwell showed lower ASER than those with normal well structure did. The ASER decreased as the test distance from alpha source to the sample increased from $7{\mu}m\;to\;15{\mu}m$. As the polysilicon-2 thickness increased up to $1000\;{\AA}$, the ASER decreased exponentially. In conclusion, the best condition for low soft error rate, which is essential to obtain highly reliable SRAM device, is to apply the buried nwell structure scheme and to fabricate thin film transistors with the thick polysilicon-2 layer

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.6
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• pp.242-245
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• 2005

We compared and analyzed ASER (Accelerated Soft Error Rate) for cell structures and metal plate capacitance in the fabricated 16M SRAM. Application of the BNW (Buried NWELL) lowered the ASER value compared to the normal well structure. By applying the metal plate capacitor with the BNW, the lowest ASER value can be obtained. The thinner oxide thickness of the metal plate capacitor provides higher capacitance and lower ASER value. The ASER is improved from 2200 FIT to 1000 FIT after sole application of the BNW. However, it is dramatically improved to 15 FIT once the metal plate capacitor is additionally applied.