• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 대한기계학회논문집A
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• 제25권12호
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• pp.2048-2055
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• 2001

This paper develops a computational model for estimating the ride quality of a cabover type large-sized truck in a double wheel bumpy ride test. The computational model is developed using ADAMS. To verify the developed model, an actual vehicle double wheel bumpy ride test is performed. In the test, the vehicle maintains a straight course with a constant velocity such that the front two wheels are passed the bump at the same time. The bump has the height of 60mm, and the width of 550mm. In the test, four velocities are used. They are 10kph, 20kph, 30kph and 40kph. Since the large-sized truck's center of gravity location is high, and its weight is heavy, it is a quite severe test condition to perform the test with more than 30kph velocity. In the test, vertical accelerations on the floor of the cab are measured. The measured accelerations are compared to the simulation results. From the comparison, it is shown that the developed model can predict not only the measured acceleration's tendency but also peak accelerations quite well. In this paper, the validated model is utilized to compare the ride quality between a vehicle with a multi-leaf spring and a vehicle with a tapered leaf spring in the front suspension system in a double bumpy ride test.

• 대한금속재료학회지
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• 제49권3호
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• pp.237-242
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• 2011

The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

• Tribology and Lubricants
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• 제25권2호
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• pp.108-113
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• 2009

This paper presents a experimental results for the performance evaluation of a double-bumped air foil bearing. The test results of a double-bumped AFB is compared with a single-bumped AFB at a heavily-loaded condition. The diameter of the test bearing is 50 mm, and the axial length is 50 mm. Nominal clearance of the single-bumped AFB is evaluated as $105{\mu}m$, and that of the double-bumped AFB is as $95{\mu}m$. The test of the AFBs are demonstrated at 3 test mode; the load variation mode, the speed variation mode, and start-stop mode. The single-bumped AFB demonstrated a upward load-carrying capacity of 95 N and a downward load-carrying capacity of 130 N at 20,000 rpm. The double-bumped AFB demonstrated a upward load-carrying capacity of 170 N and a downward load-carrying capacity of 170 N at 20,000 rpm. The single-bumped AFB demonstrated a downward lift-off speed of 16,300 rpm at 105 N. The double-bumped AFB demonstrated a downward lift-off speed of 15,400 rpm at 105 N. The start-stop test of the AFBs assure 5,000 cycle endurance life. The test results are compared with the theoretical calculation results. The test and theorectical results show thata double-bump air foil bearing provides a higher load-carrying capacity, stiffness and damping than a single-bump air foil bearing in a heavily-loaded condition.

• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.267-271
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• 2004

The joint strength and fracture surface of Sn-Pb solder bump in photo diode packages after isothermal aging testing were studied experimentally. Cu/Sn-Pb solders were adopted, and aged for up to 900 hours at 12$0^{\circ}C$ and 17$0^{\circ}C$ to analyze the effect of intermetallic compound(IMC). In 900-hour aging experiments, the maximum shea strength of Sn-Pb solder decreased by 20％ and 9％. The diffraction patterns of Cu$_{6}$Sn$_{5}$, scallop-shape IMC, and planar-shape Cu$_3$Sn were observed by Transmission Electron Microscopy (TEM).EM).

• Progress in Superconductivity
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• 제4권1호
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• pp.64-67
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• 2002

The attenuation of millimeter waves (70-100 ㎓) propagating along Josephson Junction stripline had been measured by pattern recognition near gap voltage and proximity current bump. Test series arrays of 2000, 3000, and 4000 Josephson junctions with the area of $12\mu\textrm{m}$$\times$ $38\mu\textrm{m}$ had two sub-arrays with 50 Junctions at both ends. The arrays were fabricated with and without applying a plasma nitridation process to Nb ground plane. The effects of a nitridationprocess measured by the pattern recognition near gap voltage and proximity current bump were about 1.3-1.7 ㏈ and 1.6-1.8 ㏈, respectively. This means that the last sub-arrays with a nitridation process receive 26-34% more power than those without a nitridation process.

• Tribology and Lubricants
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• 제28권4호
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• pp.173-177
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• 2012

We used contact resonance force microscopy (CRFM) technique to determine the quantitative elastic properties of multiple materials integrated on the sub micrometer scale. The CRFM approach measures the frequencies of an AFM cantilever's first two flexural resonances while in contact with a material. The plain strain modulus of an unknown or test material can be obtained by comparing the resonant spectrum of the test material to that of a reference material. In this study we examined the following bumping materials for flip chip by using copper electrode as a reference material: NiP, Solder (Sn-Au-Cu alloy) and under filled epoxy. Data were analyzed by conventional beam dynamics and contact dynamics. The results showed a good agreement (~15% difference) with corresponding values determined by nanoindentaion. These results provide insight into the use of CRFM methods to attain reliable and accurate measurements of elastic properties of materials on the nanoscale.

• 한국자동차공학회논문집
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• 제11권5호
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• pp.201-209
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• 2003

Virtual human models are widely used to save time and expense in vehicle safety studies. A human model is an essential tool to visualize and simulate a vehicle driver in virtual environments. This research is focused on creation and application of a human model fer virtual reality. The Korean anthropometric data published are selected to determine basic human model dimensions. These data are applied to GEBOD, a human body data generation program, which computes the body segment geometry, mass properties, joints locations and mechanical properties. The human model was constituted using MADYMO based on data from GEBOD. Frontal crash and bump passing test were simulated and the driver's motion data calculated were transmitted into the virtual environment. The human model was organized into scene graphs and its motion was visualized by virtual reality techniques including OpenGL Performer. The human model can be controlled by an arm master to test driver's behavior in the virtual environment.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.19-26
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• 2007

본 연구의 목적은 CMOS 이미지 센서용 Au 플립칩 범프와 전해 도금된 Au 기판 사이의 초음파 접합의 가능성 연구이다. 초음파 접합 조건을 최적화하기 위해서, 대기압 플라즈마 세정 후 접합 압력과 시간을 달리하여 초음파 접합 후 전단 시험을 실시하였다. 범프의 접합 강도는 접합 압력과 시간 변수에 크게 좌우되었다. Au 플립칩 범프는 상온에서 성공적으로 하부 Au 도금 기판과 접합되었으며, 최적 조건 하에서 접합 강도는 약 73 MPa이었다.