• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.14 no.1
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• pp.24-31
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• 2018

The mechanical design procedure is studied for the PCHE(printed circuit heat exchanger) with electrochemical etched flow channels. The effective heat transfer plates of PCHE are assembled by diffusion bonding to make a module. PCHE is widely used for industrial applications due to its compactness, cost efficiency, and serviceability at high pressure and/or temperature conditions. The limitations and technical barriers of PCHE are investigated for application to nuclear components. Rules for design and fabrication of PCHE are specified in ASME Section VIII but not in ASME Section III of nuclear components. Therefore, the calculation procedure of key dimensions of PCHE is defined based on ASME section VIII. The effective heat transfer region of PCHE is defined by several key dimensions such as the flow channel radius, edge width, wall thickness, and ridge width. The mechanical design procedure of key dimensions was incorporated into a program for easy use in the PCHE design. The effect of assumptions used in the key dimension calculation on stress values is numerically investigated. A comparative analysis is done by comparing finite element analysis results for the semi-circular flow channels with the formula based sizing calculation assuming rectangular cross sections.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1147-1152
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• 2009

The objectives of this paper are to study the characteristics of heat transfer and pressure drop of the zigzag channel PCHE using diffusion bonding technology by numerical analysis. PCHE of five types are designed, which are zigzag channel angle $180^{\circ}$, $160^{\circ}$, $140^{\circ}$, $120^{\circ}$ and $100^{\circ}$. The zigzag PCHE was numerically investigated for Reynolds number in a range of $150{\sim}800$. The temperatures of the hot side were performed at $80^{\circ}C$ while that of the cold side was conducted at $20^{\circ}C$. The results show that the performance of heat transfer rate for zigzag channel $100^{\circ}$ increases about 11.5% compared to that of zigzag channel $180^{\circ}$. On the other hand, the performance of pressure drop for zigzag channel $100^{\circ}$ is remarkably higher than that of zigzag channel $180^{\circ}$, about 1.4 times.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.21 no.9
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• pp.475-482
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• 2009

The objectives of this paper are to study the characteristics of heat transfer and pressure drop of the zigzag channel PCHE using diffusion bonding technology by numerical analysis. PCHE of five types are designed, which are zigzag channel angle 180$^{\circ}$, 160$^{\circ}$, 140$^{\circ}$, 120$^{\circ}$ and 100$^{\circ}$. The zigzag PCHE was numerically investigated for Reynolds number in a range of 150$\sim$800. The temperatures of the hot side were performed at 80$^{\circ}$ while that of the cold side was conducted at 20$^{\circ}C$. The results show that the performance of heat transfer rate for zigzag channel 100$^{\circ}$ increases about 11.5% compared to that of zigzag channel 180$^{\circ}$. On the other hand, the performance of pressure drop for zigzag channel 100$^{\circ}$ is remarkably higher than that of zigzag channel 180$^{\circ}$, about 2.4 times.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1005-1008
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• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.239-243
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• 2007

Superplastic forming/diffusion bonding(SPF/DB) has been widely used in the automotive and aerospace industry since it has great advantages to produce very light and strong components. Finite element method(FEM) is used to model the SPF/DB process of 3-sheet sandwich panel to predict the pressure-time curve and to analyze the process parameters. In order to eliminate defects of the part, a new pressurization scheme is proposed. Contrary to the conventional one-step pressurization, which causes the folding at the DB joint, two-step pressurization can eliminate the folding. Effect of pressurization cycle was investigated by using FE analysis and proper pressurization cycle is proposed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.34 no.3
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• pp.79-85
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• 2024

We investigated the crystal structural property and chemical bonding nature of cellulose nanocrystal extracted directly from cotton cellulose using high-pressure homogenizer. The nanowire-like cellulose nanocrystals were randomly distributed in the form of a dense mesh. Based on calculating the interplanar distance of the Bragg-diffracted crystal plane observed through X-ray diffraction (XRD) analysis, it was found that the cellulose nanocrystals formed by high-pressure homogenizer had a monoclinc crystal structure, corresponding to the cellulose Iβ sub-polymorph. Solid-state nuclear magnetic resonance (NMR) analysis for the quantitatively evaluation of the amorphous region in cellulose nanocrystals revealed that the crystallinity index of cellulose nanocrystals was calculated to be 53.06 %. The O/C ratio of the surface of cellulose nanocrystal was estimated to be 0.82. Further analysis showed that chemical bonds of C-C bond or C-H bond, C-O bond, O-C-O bond or C=O bond, and O-C=O bond were the main chemical bonding states of the cellulose nanocrystal surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.2
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• pp.25-30
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• 2015

This study involved the fabrication of precision machine tools using a polycrystalline diamond tip [sintered PCD and cemented carbide (WC-Co) tip] and WC-Co shanks via diffusion bonding with a paste-type nickel alloy filler metal. Diffusion bonding is a process whereby two materials are pressed together at high temperature and high pressure for a sufficient period of time to allow significant atomic diffusion to occur. For smooth progress, a filler metal of nickel alloy was used at the interface. Optical microscopy images were used to observe the copula of the bonded layer. It was confirmed that cracks occurred near the junction in all cases. The tensile strength of the bond was measured using a universal testing machine (UTM) with WC-Co proportional test specimens.

• Journal of computational fluids engineering
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• v.8 no.2
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• pp.33-41
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• 2003

A simplified simulation model is designed to investigate the vacuum-driven bonding of glass panels in the cell process for LCD manufacturing. The bonding process is modelled by the transient flow of a weakly-compressible fluid in a very thin channel between two horizontal glass panels. An order of magnitude scaling analysis is conducted based on the characteristic feature of the channel of which height is much smaller than the horizontal length scales. It is revealed that the flow in the channel is represented by a Poiseuille flow of a compressible fluid. A finite volume model has been constructed to acquire the numerical solution to the derived simplified equations. For a simple test problem of pressure-driven microchannel flow, an assessment is made of the accuracy and validity of the proposed model. The basic aspects of vacuum-driven bonding are examined numerically, and the applicability of the present simulation model is illustrated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.