• Title/Summary/Keyword: Bonding length

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A novel low resistivity copper diffusion joint for REBa2Cu3O7-δ tapes by thermocompression bonding in air

  • Wei, Ren;Zhen, Huang;Fangliang, Dong;Yue, Wu;Zhijian, Jin
    • Progress in Superconductivity and Cryogenics
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    • v.24 no.4
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    • pp.16-24
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    • 2022
  • Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

Investigation of Cutting Characteristics of Linear Hotwire Cutting System and Bonding Characteristics of Expandable Polystyrene Foam for Variable Lamination Manufacturing(VLM) Process (가변 적층 쾌속 조형 공저 개발을 위한 발포 폴리스티렌폼의 선형 열선 절단시스템 절단 특성 및 접착강도 특성에 대한 연구)

  • Ahn, Dong-Gyu;Lee, Sang-Ho;Yang, Dong-Yol;Shin, Bo-Sung;Lee, Yong-Il
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.12
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    • pp.185-194
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    • 2000
  • Rapid Prototyping(RP) techniques have their unique characteristics according to the working principles: stair-stepped surface of parts due to layer-by-layer stacking, low build speed caused by line-by-line solidification to build one layer, and additional post processing to improve surface roughness, so it is required very high cost to introduce and to maintain of RP apparatus. The objective of this study is to develop a new RP process, Variable Lamination Manufacturing using linear hotwire cutting technique and expandable polystyrene foam sheet as part material(VLM-S), and to investigate characteristics of part material, cutting characteristics by using linear hotwire cutting system and bonding. Experiments were carried out to investigate mechanical properties of part material such as anisotropy and directional tensile strength. In order to obtain optimal dimensional accuracy, surface roughness, and reduced cutting time, addition experiments were performed to find the relationship between cutting speed and cutting offset of hotwire, and heat generation of hotwire per unit length. So, adhesion strength tests according to ASTM test procedure showed that delamination did not occur at bonded area. Based on the data, a clover-shape was fabricated using unit shape part(USP) it is generated hotwire cutting. The results of present study have been reflected on the enhancement of the VLM-S process and apparatus.

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Investigation of bonding properties of denture bases to silicone-based soft denture liner immersed in isobutyl methacrylate and 2-hydroxyethyl methacrylate

  • Akin, Hakan;Tugut, Faik;Mutaf, Burcu;Guney, Umit
    • The Journal of Advanced Prosthodontics
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    • v.6 no.2
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    • pp.121-125
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    • 2014
  • PURPOSE. The purpose of this study was to investigate the bonding properties of denture bases to silicone-based soft denture liners immersed in isobutyl methacrylate (iBMA) and 2-hydroxyethyl methacrylate (HEMA) for various lengths of time. MATERIALS AND METHODS. Polymethyl methacrylate (PMMA) test specimens were fabricated (75 mm in length, 12 mm in diameter at the thickest section, and 7 mm at the thinnest section) and then randomly assigned to five groups (n=15); untreated (Group 1), resilient liner immersed in iBMA for 1 minute (Group 2), resilient liner immersed in iBMA for 3 minutes (Group 3), resilient liner immersed in HEMA for 1 minute (Group 4), and resilient liner immersed in HEMA for 3 minutes (Group 5). The resilient liner specimens were processed between 2 PMMA blocks. Bonding strength of the liners to PMMA was compared by tensile test with a universal testing machine at a crosshead speed of 5 mm/min. Data were evaluated by 1-way ANOVA and post hoc Tukey-Kramer multiple comparisons tests (${\alpha}$=0.05). RESULTS. The highest mean value of force was observed in Group 3 specimens. The differences between groups were statistically significant (P<.05), except between Group 1 and Group 4 (P=.063). CONCLUSION. Immersion of silicone-based soft denture liners in iBMA for 3 minutes doubled the tensile bond strength between the silicone soft liner and PMMA denture base materials compared to the control group.

Annealing Characteristics of Ultrafine Grained AA1050/AA5052 Complex Aluminum Alloy Sheet Fabricated by Accumulative Roll-Bonding (반복겹침접합 압연공정에 의해 제조한 초미세립 AA1050/AA5052 복합알루미늄합금판재의 어닐링 특성)

  • Lee, Seong-Hee;Lee, Gwang-Jin
    • Korean Journal of Materials Research
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    • v.21 no.12
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    • pp.655-659
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    • 2011
  • An ultrafine grained complex aluminum alloy was fabricated by an accumulative roll-bonding (ARB) process using dissimilar aluminum alloys of AA1050 and AA5052 and subsequently annealed. A two-layer stack ARB process was performed up to six cycles without lubricant at an ambient temperature. In the ARB process, the dissimilar aluminum alloys, AA1050 and AA5052, with the same dimensions were stacked on each other after surface treatment, rolled to the thickness reduction of 50%, and then cut in half length by a shearing machine. The same procedure was repeated up to six cycles. A sound complex aluminum alloy sheet was fabricated by the ARB process, and then subsequently annealed for 0.5h at various temperatures ranging from 100 to $350^{\circ}C$. The tensile strength decreased largely with an increasing annealing temperature, especially at temperatures of 150 to $250^{\circ}C$. However, above $250^{\circ}C$ it hardly decreased even when the annealing temperature was increased. On the other hand, the total elongation increased greatly above $250^{\circ}C$. The hardness exhibited inhomogeneous distribution in the thickness direction of the specimens annealed at relatively low temperatures, however it had a homogeneous distribution in specimens annealed at high temperatures.

Microstructure and Mechanical Properties of AA6061/AA5052/AA6061 Complex Sheet Fabricated by Cold-Roll Bonding Process (냉간압연접합법에 의해 제조된 AA6061/AA5052/AA6061 복합판재의 미세조직 및 기계적 성질)

  • Hwang, Ju-Yeon;Lee, Seong-Hee
    • Korean Journal of Materials Research
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    • v.29 no.6
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    • pp.392-397
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    • 2019
  • A cold roll-bonding process is applied to fabricate an AA6061/AA5052/AA6061 three-layer clad sheet. Two AA6061 and one AA5052 sheets of 2 mm thickness, 40 mm width, and 300 mm length are stacked, with the AA5052 sheet located in the center. After surface treatment such as degreasing and wire brushing, sample is reduced to a thickness of 1.5 mm by multi-pass cold rolling. The rolling is performed at ambient temperature without lubricant using a 2-high mill with a roll diameter of 400 mm at rolling speed of 6.0 m/sec. The roll bonded AA6061/AA5052/AA6061 complex sheet is then hardened by natural aging(T4) and artificial aging(T6) treatments. The microstructures of the as-roll bonded and age-hardened Al complex sheets are revealed by optical microscopy; the mechanical properties are investigated by tensile testing and hardness testing. After rolling, the roll-bonded AA6061/AA5052/AA6061 sheets show a typical deformation structure in which grains are elongated in the rolling direction. However, after T4 and T6 aging treatment, there is a recrystallization structure consisting of coarse equiaxed grains in both AA5052 and AA6061 sheets. The as roll-bonded specimen shows a sandwich structure in which an AA5052 sheet is inserted into two AA6061 sheets with higher hardness. However, after T4 and T6 aging treatment, there is a different sandwich structure in which the hardness of the upper and lower layers of the AA6061 sheets is higher than that of the center of the AA5052 sheet. The strength values of the T4 and T6 age-treated specimens are found to increase by 1.3 and 1.4 times, respectively, compared to that value of the starting material.

The effects of total-etch, wet-bonding, and light-curing of adhesive on the apical seal of a resin-based root canal filling system (접착제의 접착변수가 레진계 근관충전제의 근단밀폐효과에 미치는 영향)

  • Ryu, Won-Il;Shon, Won-Jun;Baek, Seung-Ho;Lee, In-Han;Cho, Byeong-Hoon
    • Restorative Dentistry and Endodontics
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    • v.36 no.5
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    • pp.385-396
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    • 2011
  • Objectives: This study evaluated the effects of adhesion variables such as the priming concepts of canal wall and the curing modes of adhesives on the sealing ability of a resin-based root canal filling system. Materials and Methods: Apical microleakage of the Resilon-RealSeal systems filled with 3 different combinations of adhesion variables was compared with the conventional gutta-percha filling using a dye penetration method. Experimental groups were SEDC, Resilon (Resilon Research LLC) filling with self-etch RealSeal (SybronEndo) primer and dual-cure RealSeal sealer; NELC, Resilon filling with no etching, Scotchbond Multi-Purpose (3M ESPE) primer application and light-curing adhesive; and TELC, Resilon filling with Scotchbond Multi-Purpose primer and adhesive used under total etch / wet bonding and lightcure protocols. GPCS, gutta-percha filling with conventional AH26 plus sealer, was the control group. Results: The median longitudinal dye penetration length of TELC was significantly shorter than those of GPCS and SEDC (Kruskal-Wallis test, p < 0.05). In the cross-sectional microleakage scores, TELC showed significant differences from other groups at 2 to 5 mm from the apical foramen (Kruskal-Wallis test, p < 0.05). Conclusions: When a resin-based root canal filling material was used, compared to the self-etching primer and the dual-cure sealer, the total etch/wet-bonding with primer and light-curing of adhesive showed improved apical sealing and was highly recommended.

Effect of Combining Wood Particles and Wire Net on the Physical Properties of Board (목재(木材)파티클과 철강결체(鐵鋼結締)가 보오드의 물리적(物理的) 성질(性質)에 미치는 영향(影響))

  • Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.13 no.3
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    • pp.3-26
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    • 1985
  • The object of this study was to investigate the effects on physical and mechanical properties of wood particle and sawdust board combined with wire net. Conventional forming, press-lam, and veneer comply boards combining one to four wire net sheets were made from wood particle and sawdust with different spacings (8, 10, 12, and 18 Mok) and different wire diameters (0.35, 0.50, and 0.80mm) composing wire net. They were compared and analyzed statistically with specific gravity, thickness swelling, length swelling, bending properties (modulus of rupture, modulus of elasticity, work to proportional limit, and total work), internal bonding strength, and screw holding strength between wood particle and sawdust boards. The results obtained at this study as cording to the discussions might be concluded as follows; 1. In specific gravity, both particle and sawdust boards by press-lam method were higher than by conventional forming and veneer comply method, and the boards containing more wire net sheets also showed higher value. But the wire net spacings(Mok) had no influence on specific gravity. In general, particle board showed higher specific gravity than sawdust board. Veneer comply board showed lowest specific gravity values. 2. Both particle and sawdust boards by press-lam method was slightly lower than by conventional forming and veneer comply method in thickness swelling. The sawdust board containing 8, 12. and 18 Mok wire net showed lower thickness swelling than the corresponding particle board, but both sawdust and particle boards containing the T8 and 10 Mok wire net showed higher and similar thickness swelling. 3. Both particle and sawdust boards containing wire net showed no difference in MOR and MOE of bending. Comply board was the highest and particle board showed slightly higher than sawdust board in MOR and MOE values. 4. In work to proportional limit and total work in bending, both particle and sawdust boards containing thicker wire diameter and more wire net sheets showed higher value. From these facts, it is conceivable that boards with thicker wire diameter and more wire net sheets show increasing resistance against external force. But there was no significant difference between particle and sawdust borads. 5. In resistance against delamination (internal bonding strength), both sawdust and particle boards containing wire net showed lower value than control, and also showed decreasing tendency with more number of wire net sheet composed. Particle board showed higher resistance against delamination than sawdust board. 6. In screw holding strength, sawdust board containing thicker wire diameter and more wire net sheets showed higher value, but particle board by press-lam method was higher than by conventional forming and veneer comply method. Screw holding strength of particle board was higher than that of sawdust board.

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Simulation Study of a Large Area CMOS Image Sensor for X-ray DR Detector with Separate ROICs (센서-회로 분리형 엑스선 DR 검출기를 위한 대면적 CMOS 영상센서 모사 연구)

  • Kim, Myung Soo;Kim, Hyoungtak;Kang, Dong-uk;Yoo, Hyun Jun;Cho, Minsik;Lee, Dae Hee;Bae, Jun Hyung;Kim, Jongyul;Kim, Hyunduk;Cho, Gyuseong
    • Journal of Radiation Industry
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    • v.6 no.1
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    • pp.31-40
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    • 2012
  • There are two methods to fabricate the readout electronic to a large-area CMOS image sensor (LACIS). One is to design and manufacture the sensor part and signal processing electronics in a single chip and the other is to integrate both parts with bump bonding or wire bonding after manufacturing both parts separately. The latter method has an advantage of the high yield because the optimized and specialized fabrication process can be chosen in designing and manufacturing each part. In this paper, LACIS chip, that is optimized design for the latter method of fabrication, is presented. The LACIS chip consists of a 3-TR pixel photodiode array, row driver (or called as a gate driver) circuit, and bonding pads to the external readout ICs. Among 4 types of the photodiode structure available in a standard CMOS process, $N_{photo}/P_{epi}$ type photodiode showed the highest quantum efficiency in the simulation study, though it requires one additional mask to control the doping concentration of $N_{photo}$ layer. The optimized channel widths and lengths of 3 pixel transistors are also determined by simulation. The select transistor is not significantly affected by channel length and width. But source follower transistor is strongly influenced by length and width. In row driver, to reduce signal time delay by high capacitance at output node, three stage inverter drivers are used. And channel width of the inverter driver increases gradually in each step. The sensor has very long metal wire that is about 170 mm. The repeater consisted of inverters is applied proper amount of pixel rows. It can help to reduce the long metal-line delay.

Tests on Transfer Bond Performance of Epoxy Coated Prestressing Strands (에폭시 코팅 처리된 PS강선의 정착부착성능 실험)

  • 유승룡
    • Magazine of the Korea Concrete Institute
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    • v.6 no.1
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    • pp.89-100
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    • 1994
  • The current test procedure for transfer length, which determine transfer length by measuring concrete strain, has an actual bond stress state in the prestressed pretensioned member : however, it is difficult to determine the bond properties of maximum bond stress and bond stiffness with this method. It is also difficult for design engineer to understand and select a correct safety criterion from the widely distributed results of such a ransfer test alone. An alternative testing procedure is provided here to determine the bond properties without measuring the concrete strain. In this test the bond stress is measured directly by creating a similar boundary condition within the transfer length in a real beam during the transfer of prestressing force. The prestressing force was released step by step by step from the unloading side. The release of force induces a swelling of the strand at the unloading side of concrete block, bonding force in the block, and a bond slip of the strand toward the other side of the block. Two center-hole load cells are used to record the end loads until the point of general bond slip(maximum bond stress). It is suggested that this test procedure be performed with the ordinary transfer test when determining the transfer length in a prestressed, pretensioned concrete beam.

Effects of Target Density and Strand Size on Properties of Oriented Strand Board Composed of Thinned Wood of Larix leptolepis Gordon (낙엽송(落葉松) 간벌목(間伐木)을 원료(原料)로 한 Oriented Strand Board(OSB)의 목표밀도(目標密度)와 Strand Size가 OSB의 재질(材質)에 미치는 영향(影響))

  • Park, Heon;Kang, Eun-Chang
    • Journal of the Korean Wood Science and Technology
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    • v.24 no.4
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    • pp.56-63
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    • 1996
  • This study was to manufacture thinned wood of Larix leptolepis Gordon into Oriented Strand Board(OSB) with Urea-Formaldehyde Resin. The OSB was made of four kinds of strand in slenderness ratio 150 ; thickness $0.3{\pm}0.05mm$, $0.4{\pm}0.05mm$, $0.5{\pm}0.05mm$ and $0.6{\pm}0.05mm$, respectively length 45mm, 60mm, 75mm and 90mm. Target densities were 0.65gr/$cm^3$, 0.75gr/$cm^3$ and 0.85gr/$cm^3$. The stepwise 9 minutes-multi-pressing schedule in the maximum pressure 40kgf/$cm^2$, the minimum pressure 10kgf/$cm^2$ was applied for $400mm{\times}390mm{\times}12mm$ board at the temperature of $150^{\circ}C$ in a hot press. In MOR The OSB of thin strand thickness $0.3{\pm}0.05mm$(length 45mm) and density 0.85gr/$cm^3$ was the highest. The strand thickness had more effect on MOR than the strand length. In strand thickness $0.4{\pm}0.05mm$(length 60mm) and density 0.85gr/$cm^3$ was the highest MOE. The strand thickness and length had adverse effects on MOE each other. At internal bonding. The OSB of strand thickness $0.3{\pm}0.05mm$(length 45mm) and board density 0.75gr/$cm^3$ showed the highest value. OSB had higher IB value with thinner strand thickness. The thinner strand thickness showed the lower thickness swelling in turn $0.3{\pm}0.05mm$(length 45mm), $0.4{\pm}0.05mm$(length 60mm), $0.5{\pm}0.05mm$(length 75mm). $0.6{\pm}0.05mm$(length 90mm). Target densities 0.75gr/$cm^3$ 0.65gr/$cm^3$, 0.85gr/$cm^3$ showed in turn lower value. Finally, The OSB made of thinned wood of Larix leptolepis Gordon showed good results in laboratory experiment.

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