• 한국응용과학기술학회지
• /
• 제26권3호
• /
• pp.288-296
• /
• 2009

In this study, the silica-based hybrid material with high barrier property was prepared by incorporating ethylene-vinyl alcohol (EVOH) copolymer, which has been utilized as packaging materials due to its superior gas permeation resistance, during sol-gel process. In preparation of this EVOH/$SiO_2$ hybrid coating materials, the (3-glycidoxy-propyl)-trimethoxysilane (GPTMS) as a silane coupling agent was employed to promote interfacial adhesion between organic and inorganic phases. As confirmed from FT-IR analysis, the physical interaction between two phases was improved due to the increased hydrogen bonding, resulting in homogeneous microstructure with dispersion of nano-sized silica particles. However, depending on the range of content of added silane coupling agent (GPTMS), micro-phase separated microstructure in the hybrid could be observed due to insufficient interfacial attraction or possibility of polymerization reaction of epoxide ring in GPTMS. The oxygen barrier property of the mono-layer coated BOPP (biaxially oriented polypropylene) film was examined for the hybrids containing various GPTMS contents. Consequently, it is revealed that GPTMS should be used in an optimum level of content to produce the high barrier EVOH/$SiO_2$ hybrid material with an improved optical transparency and homogeneous phase morphology.

• 한국전기전자재료학회논문지
• /
• 제14권12호
• /
• pp.1008-1015
• /
• 2001

Thin films of vanadium oxide(VO$\_$x/) have been deposited by r.f. magnetron sputtering from V$_2$O$\_$5/ target in gas mixture of argon and oxygen. The oxygen/(oxygen+argon) partial pressure ratio is changed from 0% to 8%. Crystal structure, chemical composition, bonding, optical and electrical properties of films sputter-deposited under different oxygen gas pressures are characterized through XPS, AES, RBS, FTIR, optical absorption and electrical conductivity measurements. V$_2$O$\_$5/ and lower oxides co-exist in sputter-deposited films and as the oxygen partial pressure is increased the films become more stoichiometric V$_2$O$\_$5/. The increase of O/V ratio with increasing oxygen gas pressure is attributed to the partial filling of oxygen vacancies through diffusion. It is observed that the oxygen atoms located on the V-O plane of V$_2$O$\_$5/ layer participate more readily in the oxidation process. With increasing oxygen gas pressure indirect and direct optical band gaps are increased, but thermal activation energies are decreased.

• 정보저장시스템학회논문집
• /
• 제2권4호
• /
• pp.240-244
• /
• 2006

As high-definition television(HDTV) broadcasting becoming more generalized, there have been many researches and developments about a large storage capacity and a fast data transfer rate in optical disk drives (ODD). Pickup actuators must have high flexible mode frequencies and large gain margins. Flexible modes are caused by the flexibility of moving parts in the actuator and a servo bandwidth is limited by them. As a result, the system becomes unstable for high-speed operations in high density reading and recording. In this paper, we suggest improved modeling method in considering of the bonding layer. And, the flexible mode frequency of actuator is improved by Design of Experiments of lens holder. The Magnet circuit is designed considering the relation with the moving part. Through improving the yoke design, the magnetic flux is changed and the DC tilt is reduced. Consequently, we designed an actuator which has a high flexible mode frequency and a large gain margins.

• 한국표면공학회지
• /
• 제44권5호
• /
• pp.190-195
• /
• 2011

Diamond-like carbon (DLC) has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion on the metal substrates because of weak bonding between DLC film and the metal substrate. The purpose of this study is to enhance an adhesion of DLC film. For improving adhesion, the substrate was treated by active screen plasma nitriding before DLC film deposing. Nitrided substrates were investigated by Glow Discharge Spectrometer (GDS), Micro-Vickers Hardness. DLC films were deposited on several metals by linear ion source, and characteristics of the films were investigated using nano-indentation, Field Emission Scanning Electron Microscope (FESEM). The adhesion was measured by scratch tester. The adhesion of DLC films was increased when nitriding layer was formed before DLC deposition. Therefore, the adhesion of DLC film can be enhanced as increasing the hardness of materials.

• 한국세라믹학회지
• /
• 제31권9호
• /
• pp.1060-1068
• /
• 1994

Stable zirconia sol was prepared from zirconium butoxide Zr(OC4O9)4 as a precursor and ethylacetoacetate(EAcAc) or diethylene glycol(DEG) as a chelating agent under ambient agent under ambient atmosphere by Sol-Gel process. The sythesized sol was coated on 304 stainless steel substrate by dip coating, thereafter zirconia film could be obtained by heat-treatment at $600^{\circ}C$. The characteristics of coating film were determined by FT-IR, XRD, and ellipsometion peak represented Zr-O-Zr bonding of tetragonal phase was shown at 470cm-1. Crystallization of zirconia gel and film from amorphous state to tetragonal phase started at 40$0^{\circ}C$, and then transformed into monoclinic phase around $700^{\circ}C$. Zirconia film coated on 304 stainless steel substrate showed relatively low porosity of 16% when it was coated with 0.4M zirconia sol and thereafter heat-treated at 80$0^{\circ}C$ and the film was densified continuously up to 90$0^{\circ}C$. The zirconia film of 10 nm thick acted as a protective layer against oxidation up to $700^{\circ}C$.

• 정보저장시스템학회논문집
• /
• 제3권1호
• /
• pp.47-53
• /
• 2007

In this paper, a thermo-piezoelectric mechanism with integrated heaters and piezoelectric sensors has been studied for low power probe-based data storage. Silicon nitride cantilever integrated with silicon heater and piezoelectric sensor has been developed to improve the uniformity of cantilevers. Data bits of 40 nm in diameter were recorded on PMMA film. The sensitivity of the piezoelectric sensor was 0.615 fC/nm after poling the PZT layer. And, the $34\times34$ probe array integrated with CMOS circuits has been successfully developed by simple one-step bonding process. The process can simplify the process step and reduce tip wear using silicon nitride tip.

• ETRI Journal
• /
• 제32권3호
• /
• pp.414-421
• /
• 2010

The interconnection mechanisms of a smart anisotropic conductive adhesive (ACA) during processing have been characterized. For an understanding of chemorheological mechanisms between the fluxing polymer and solder powder, a thermal analysis as well as solder wetting and coalescence experiments were conducted. The compatibility between the viscosity of the fluxing polymer and melting temperature of solder was characterized to optimize the processing cycle. A fluxing agent was also used to remove the oxide layer performed on the surface of the solder. Based on these chemorheological phenomena of the fluxing polymer and solder, an optimum polymer system and its processing cycle were designed for high performance and reliability in an electrical interconnection system. In the present research, a bonding mechanism of the smart ACA with a polymer spacer ball to control the gap between both substrates is newly proposed and investigated. The solder powder was used as a conductive material instead of polymer-based spherical conductive particles in a conventional anisotropic conductive film.

• 대한치과기공학회지
• /
• 제38권2호
• /
• pp.69-77
• /
• 2016

Purpose: This study was to evaluate the shear bond strength of ceramic fused to Ni-Cr alloy(Alophaloy) by heat treatment. Methods: The specimens were divided into 5 groups according to heat treatment conditions prior to porcelain application. Eighteen specimens from each group were subjected to the shear load a universal testing machine using a 0.1mm/min cross-head speed and two specimens from each group were observed with SEM and EDX line profile. Results: The observation of the oxide film on the metal surface by SEM photograph showed a coarsening with an increasing degassing hold time. The diffusion of metal oxide was observed farther from the opaque layer in the heat treated specimen than no heat treated specimen. The shear bond strength measured highest to A5(55.23MPa) in the 10min holding group and measured lowest from A1(24.38MPa) in the no heat treated group, and there was a significant difference(p<0.05). Conclusion: The shear bond strength of Ni-Cr alloy improved in the heat treatment compared to the no heat treatment specimen.

• 대한치과보철학회지
• /
• 제38권4호
• /
• pp.461-471
• /
• 2000

This study evaluated the effect of degassing on the ceramic bond strength of two Ni-Cr alloys under varying holding time at the upper limit temperature and atmospheric conditions. Metal specimens were divided into 5 groups for each alloy according to degassing conditions prior to porcelain application no degassing, degassing under vacuum without hold, degassing under vacuum with hold for 5 min. and 10 min. respectively at the upper limit temperature and degassing in air. Total number of metal ceramic specimens was eighty and each group had eight specimens. The ceramic bond strength was measured by four-point flexural test using Instron and the fractured surface was examined under SEM. The results obtained were as follows. 1. Degassing in air improved the ceramic bond strength of Ni-Cr alloys. 2. In degassing under vacuum, hold at the upper limit temperature was advantageous to the ceramic bonding of Ni-Cr alloys. 3. After ceramic metal bond test, metal surfaces were partially covered with the thin porcelain layer, and the cohesive failures in porcelain were predominant in groups showing higher ceramic bond strength.

• 한국전기전자재료학회논문지
• /
• 제27권3호
• /
• pp.137-140
• /
• 2014

With the recent advent of through silicon via (TSV) technology, wafer level-TSV interconnection become feasible in high volume manufacturing. To increase the manufacturing productivity, it is required to develop equipment for backside passivation layer deposition for TSV wafer bonding process with high deposition rate and low film stress. In this research, we investigated the relationship between process parameters and the induced wafer stress of PECVD silicon nitride film on 300 mm wafers employing statistical and artificial intelligence modeling. We found that the film stress increases with increased RF power, but the pressure has inversely proportional to the stress. It is also observed that no significant stress change is observed when the gas flow rate is low.