• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.10
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• pp.3173-3185
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• 1996

Multi-model vibration control of laminated composites plates for various fiver orientations has been carried out by making use of piezolectric materials(PZT) as sensors and actuators. Cantilever plate is used as a specimen to test multi-modal vibration supression under random exitation. Impulse technique is applied to determine the natural frequency, the damping ratio(.zeta.) and the modal damping(2.zeta..omega.) of the first bending and the trosion modes. Two independent controllers are implemented to control the two modes simultaneously and established digitally on the basis of the direct negative velocity feedback control with collocated sensor/actuator. Experimental results for various fiber orientations and feedback gains are compared with finite element analysis considering stiffnesses and dampings of piezoeletiric sensors, actuators and bonding layer.

• Smart Structures and Systems
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• v.4 no.4
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• pp.391-406
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• 2008

This study attempts to develop a real-time debonding monitoring system for carbon fiber-reinforced polymer (CFRP) strengthened structures by continuously inspecting the bonding condition between the CFRP layer and the host structure. The uniqueness of this study is in developing a new concept and theoretical framework of nondestructive testing (NDT), in which debonding is detected without relying on previously-obtained baseline data. The proposed reference-free damage diagnosis is achieved based on the concept of time reversal acoustics (TRA). In TRA, an input signal at an excitation point can be reconstructed if the response signal measured at another point is reemitted to the original excitation point after being reversed in the time domain. Examining the deviation of the reconstructed signal from the known initial input signal allows instantaneous identification of damage without requiring a baseline signal representing the undamaged state for comparison. The concept of TRA has been extended to guided wave propagations within the CFRP-strengthened reinforced concrete (RC) beams to improve the detectibility of local debonding. Monotonic and fatigue load tests of large-scale CFRP-strengthened RC beams are conducted to demonstrate the potential of the proposed reference-free debonding monitoring system. Comparisons with an electro-mechanical impedance method and an inferred imaging technique are provided as well.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.3
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• pp.166-173
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• 2009

The reliability of hafnium oxide gate dielectrics incorporating lanthanum (La) is investigated. nMOSFETs with metal/La-doped high-k dielectric stack show lower $V_{th}$ and $I_{gate}$, which is attributed to the dipole formation at the high-k/$SiO_2$ interface. The reliability results well correlate with the dipole model. Due to lower trapping efficiency, the La-doping of the high-k gate stacks can provide better PBTI immunity, as well as lower charge trapping compared to the control HfSiO stacks. While the devices with La show better immunity to positive bias temperature instability (PBTI) under normal operating conditions, the threshold voltage shift (${\Delta}V_{th}$) at high field PBTI is significant. The results of a transconductance shift (${\Delta}G_m$) that traps are easily generated during high field stress because the La weakens atomic bonding in the interface layer.

• KCI Concrete Journal
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• v.13 no.1
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• pp.61-67
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• 2001

For the design of shear connection for the composite precast concrete slabs. it is necessary to investigate its strength, stiffness, slip capacity and fatigue endurance. For theme purposes, push-out tests were performed with variations of the stud shank diameter and the compressive strength of the mortar. From the experimental studies, it could be observed that the deformation of the shear studs in a full-depth precast concrete slabs were greater than those in a cast-in-place slabs. The static strength of the shear connections obtained agree approximately with those evaluated from the tensile strength of the stud shear connectors owing to the effect of the bedding layer between the slabs and the beams. An empirical equation for the initial shear stiffness of a shear connection was also proposed. On the basis of the push-out tests, a full-scale composite beams with 8.0m span was designed and fatigue tests were carried out to study the behaviour of the stud shear connection and its effects on the flexural behaviour of the beam. The bonding arid friction between the concrete slab and the steel beam considerably increased the fatigue endurance of the shear connection.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Journal of Technologic Dentistry
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• v.28 no.1
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• pp.19-26
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• 2006

The effect of Nb on interfacial bonding characteristics of Ni-Cr alloy for porcelain fused to metal crown (PFM) has been studied in order to investigate oxide layer. A specimens of Ni-Cr alloy, which is 0.8mm in thickness, within the porcelain furnace of 1,000$^{\circ}C$ with four tests such as air, vacuum, air for 5 minutes and vacuum for 5 minutes in order to examine an oxide behavior of alloy surface generated by the adding of Nb to be controlled at a rate of 0, 1, 3 and 5. Oxide film was observed form of the fired specimens with scanning electron microscope (SEM), and at the same time it measured Electron Probe Micro Analyzer (EPMA). The result of this study were as follows: 1. Cr oxide film and Nb oxide film were observed from the surface of specimen to be controlled at a rate of Nb 1%. 2. Nb oxide film was observed from the interface of specimens to be controlled at a rate of Nb 1% and 3%. 3. The stability of oxide films that treated in air were more stable than treated under vacuum.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.1
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• pp.31-43
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• 1993

Thermal behavior and $O_{2}$ plasma effects on residue and penetrated impurities formed by reactive ion etching (RIE) in CHF$_{3}$/C$_{2}$F$_{6}$ have been investigated using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS) techniques. Decomposition of polymer residue film begins between 200-300.deg. C, and above 400.deg. C carbon compound as graphite mainly forms by in-situ resistive heating. It reveals that thermal decomposition of residue can be completed by rapid thermal anneal above 800.deg. C under nitrogen atmosphere and out-diffusion of penetrated impurities is observed. The residue layer has been removed with $O_{2}$ plasma exposure of etched silicon and its chemical bonding states have been changed into F-O, C-O etc.. And $O_{2}$ plasma exposure results in the decrease of penetrated impurities.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.95-100
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• 2006

The GaAs-on-insulator (GOI) wafer fabrication technique has been developed by using ion-cut process, based on hydrogen ion implantation and wafer direct bonding techniques. The hydrogen ion implantation condition for the ion-cut process in GaAs and the associated implantation mechanism have been investigated in this paper. Depth distribution of hydrogen atoms and the corresponding lattice disorder in (100) GaAs wafers produced by 40 keV hydrogen ion implantation were studied by SIMS and RBS/channeling analysis, respectively. In addition, the formation of platelets in the as-implanted GaAs and their microscopic evolution with annealing in the damaged layer was also studied by cross-sectional TEM analysis. The influence of the ion fluence, the implantation temperature and subsequent annealing on blistering and/or flaking was studied, and the optimum conditions for achieving blistering/splitting only after post-implantation annealing were determined. It was found that the new optimum implant temperature window for the GaAs ion-cut lie in $120{\sim}160^{\circ}C$, which is markedly lower than the previously reported window probably due to the inaccuracy in temperature measurement in most of the other implanters.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.13-20
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• 2008

This paper describes the methods of spacer-fabrication for wafer-level CIS(CMOS Image Sensor) assembly. We propose three methods using SU-8, PDMS and Si-interposer for the spacer-fabrication. For SU-8 spacer, novel wafer rotating system is developed and for PDMS(poly-dimethyl siloxane) spacer, new fabrication-method is used to bond with alignment of glass/PDMS/glass structure. And for Si-interposer, DFR(Dry Film Resist) is used as adhesive layer. The spacer using Si-interposer has the strongest bonding strength and the strength is 32.3MPa with shear.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2246-2251
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• 2000

Adhesive bonding repair methods has been used for a number of decades for construction of damaged structures. In order to evaluate the life of cracked aging aircraft structures, the repair technique which uses adhesively bonded boron/epoxy composite patches is being widely considered as a cost-effective and reliable method. But, this repair method contains many shortcomings. One of these shortcomings, debonding is major issue. When the adhesive shear stress increases, debonding is caused at the end of patch and plate interface. And this debonding is another defect except cracks propagation. In this paper, we assess safety at the cracked AI-plate repaired by Br/Epoxy composite patch. Firstly, from the view of fracture mechanics, reduction of stress intensity factors is determined by the variety of patch feature. Secondly, using the elastic analysis and finite element analysis, the distribution of adhesive shear stresses is acquired. Finally, The problem of how to optimize the geometric configurations of the patch has been discussed.