• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제21권4호
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• pp.388-394
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• 2008

For purpose of anti-static film remaining unchanged in the condition of $160^{\circ}C$, organic solvent, acid and base solution $0.01\sim0.03{\mu}m$ particles of Sb doped tin oxide(ATO) were grafted by 3-Glycidyloxypropyltrimethoxysilane(GPTS) for improving interfere bonding force between ATO and epoxy resin. The particles were dispersed in 2-methoxyethanol with YD-I28(Bisphenol A type epoxy resin, Kukdo chemical) and 1-imidazole as hardener. The anti-static solutions were coated on PI film as thickness of $0.1{\mu}m$. Surface resistivity of anti-static film containing conductive polymer became $10^{12}\Omega/\Box$ after 32 hours in $160^{\circ}C$. The surface resistivity of ATO grafted by GPTS / Epoxy coating layer remained as $10^{7.6}\Omega/\Box$ in $160^{\circ}C$ for 7 days. ATO grafted by GPTS / Epoxy coating layer coated on PI film was dipped in acetone for 7 days. The surface resistivity remained unchanged as $10^{7.6}\Omega/\Box$. The anti-static layer dipped in water solutions containing each KOH 10 wt % and $H_2SO_4$ 2 wt% was ultra-sonicated for 10 minutes per once until 30th. The surface resistance of anti-static layer containing ATO grafted by GPTS remained unchanged.

• Polymer(Korea)
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• 제25권4호
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• pp.512-520
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• 2001

One of the most important factors which affect the mechanical properties of fiber-reinforced composite materials is the interfacial shear strength (IFSS). The IFSS of glass fiber and polycarbonate (PC)/styrene-co-acrylonitrile (SAN) blend system has been measured by the single fiber fragmentation test (SFFT). SAN contents were varied up to 30 wt% and the IFSS increased with the SAN contents. Styrene-co-maleic anhydride (SMA) was used as the compatibilizer and the glass fiber was surface treated with organosilane coupling agents. Addition of small amount of SMA in PC/SAN blend improved the IFSS by chemical bonding between maleic anhydride and silanol. The optimum MA content was 0.4 wt% of total matrix contents. Also, IFSS was greatly affected by the miscibility condition of SAN/SMA blends, which depended on the copolymer composition of SAN and SMA. It was found out that, higher IFSS could be obtained when the SAN/SMA blend was in miscible pairs. In case of SAN/SMA miscible pairs, the IFSS depended on the MA content in total matrix, not on the MA content in SMA.

• Journal of the Korean Wood Science and Technology
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• 제27권3호
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• pp.63-72
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• 1999

For the purpose of improving the wet strength properties of paper, cellulosic fibers were modified by the processes of carbarmoylethylation and N-chlorocarbamoylethylation. Carbamoylethylated cellulose was prepared by the reaction of acrylamide with cellulosic fibers under the alkali catalyst, and N-chlorocarbamoylethylated cellulose was prepared by the addition of sodium hypochlorite into the carbamoylethylated cellulose. In carbamoylethylation reaction, the conditions of NaOH concentration, temperature and acrylamide addition rate were considered to be important factors. An initial reactivity and degree of substitution(DS) in carbamoylethylation of cellulosic fibers were effective according to increasing the addition rates of alkali, acrylamide and the temperature condition of $40^{\circ}C$. The effective wet strength properties by N-chlorocarbamoylethylation of cellulosic fibers were indicated under the conditions of DS 0.06. The wet strength of sheet was improved to 85% at the 100% basis of dry strength. From the photograph of scanning electron microscopy, fiber cuttings on the edge of sheet sample used in tensile strength testing were found in the N-chlorocarbamoylethylated sheet, due to the improvement of fiber bonding strength. The hypochlorite treatment was effective in the recycling of N-chlorocarbamoylethylated sheet, and was reduced the wet strength of sheet to be able to reslush.

• Restorative Dentistry and Endodontics
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• 제37권1호
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• pp.9-15
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• 2012

Objectives: This study evaluated the effect of 2% chlorhexidine digluconate (CHX) with different application times on microtensile bonds strength (MTBS) to dentin in class I cavities and intended to search for ideal application time for a simplified bonding protocol. Materials and Methods: Flat dentinal surfaces with class I cavities ($4mm{\times}4mm{\times}2mm$) in 40 molar teeth were bonded with etch-and-rinse adhesive system, Adper Single Bond 2 (3M ESPE) after: (1) etching only as a control group; (2) etching + CHX 5 sec + rinsing; (3) etching + CHX 15 sec + rinsing; (4) etching + CHX 30 sec + rinsing; and (5) etching + CHX 60 sec + rinsing. Resin composite was builtup with Z-250 (3M ESPE) using a bulk method and polymerized for 40 sec. For each condition, half of the specimens were immediately submitted to MTBS test and the rest of them were assigned to thermocycling of 10,000 cycles between $5^{\circ}C$ and $55^{\circ}C$ before testing. The data were analyzed using two-way ANOVA, at a significance level of 95%. Results: There was no significant difference in bond strength between CHX pretreated group and control group at the immediate testing period. After thermocycling, all groups showed reduced bond strength irrespective of the CHX use. However, groups treated with CHX maintained significantly higher MTBS than control group (p < 0.05). In addition, CHX application time did not have any significant influence on the bond strength among groups treated with CHX. Conclusion: Application of 2% CHX for a short time period (5 sec) after etching with 37% phosphoric acid may be sufficient to preserve dentin bond strength.

• Journal of the Korean Crystal Growth and Crystal Technology
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• 제26권3호
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• pp.109-114
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• 2016

Monodispersed $ZnGa_2O_4$ microspheres were synthesized by a facile two-step process consisting of a solvothermal method and calcination process. The prepared monodispersed $ZnGa_2O_4$ microspheres were aggregated into 3D microstructures by self-assembly with a large number of small $ZnGa_2O_4$ particles generated in nucleation. This nucleation and self-assembly making hierarchical microstructures were depended on the concentration of PEG (polyethylene glycol) due to CAC (critical aggregation concentration) theory. And also we controlled the amount of zinc acetate to make pure $ZnGa_2O_4$ phase. Additionally, to fix the optimized calcination condition, sample was characterized by TG-DTA to prove the thermal property in the calcination process and by FT-IR to identify the changes of functional group bonding between each element of the $ZnGa_2O_4$ precursor and oxide calcined at $900^{\circ}C$ for 1 h.

• The Journal of the Convergence on Culture Technology
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• 제6권1호
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• pp.477-483
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• 2020

The rehabilitation methods used in existing concrete box structures rely on the method of attaching the repair material to the section of the structure with a spray equipment. In the case of ceiling or wall parts, the adhesion force to the repair material may be reduced by the gravity and dead load after construction. In subway structures, vibration causes a problem that reduces the initial adhesion. Supplementary measures are needed as the quality of repair varies depending on the worker's proficiency and construction environment. In this study, mechanical pressurization equipment was developed that can apply a certain pressure after construction of a repairwork to solve problems such as reduction of adhesion of repair materials by gravity and variation of repair quality by labor work. To find out the effect of the pressurized equipment, a chamber similar to the field conditions was constructed to measure the attachment strength different from the pressurized condition, the section, and the environmental conditions. The pressurization differed from the other parts, but the adhesion strength of up to 70% was increased.

• Journal of the Microelectronics and Packaging Society
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• 제9권1호
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of the Microelectronics and Packaging Society
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• 제24권2호
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• pp.69-74
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• 2017

Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

• Bulletin of the Korean Chemical Society
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• 제28권11호
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• pp.1980-1984
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• 2007

An HPLC chiral stationary phase (CSP) which has only two ureide functional groups was prepared starting from (1S,2S)-1,2-diaminocyclohexane. The CSP was successful in the resolution of various N-(3,5- dinitrobenzoyl)-α-amino acids, the separation (α) and the resolution factors (RS) being within the range of 1.11-1.35 and 2.19-5.17, respectively with the use of 20% 2-propanol in hexane containing 0.1% trifluoroacetic acid as a mobile phase. However, ethyl esters of N-(3,5-dinitrobenzoyl)-α-amino acids were not resolved or resolved with only marginal separation and resolution factors on the CSP under the identical mobile phase condition. From these results, the complexation of the carboxylate anions of analytes inside the double-ureide pocket of the CSP was expected to play some important role for the chiral recognition. In contrast, N-(3,5- dinitrobenzoyl)-α-amino acid N-propylamides were resolved on the CSP with reasonable separation and resolution factors. Enantioselective hydrogen bonding interactions between analytes and the CSP were presumed to be responsible for these resolutions.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 한국추진공학회 2017년도 제48회 춘계학술대회논문집
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• pp.168-171
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• 2017

In this study, we observed degradation mechanism of FKM O-ring by X-ray photoelectron spectroscopy(XPS) at atmosphere condition. FKM O-ring had 3.53mm of cross-sectional diameter and 91.67mm of inner diameter. After thermal degradation, oxygen atom concentration of FKM O-ring was increased to 20.39%, and fluorine atom concentration was decreased to 8.29%. We observed that degradation reaction occurred by oxidation reaction. By C1s and F1s peak analysis, we confirmed that oxidation reaction usually occurred at C-F bonding of FKM main chain. Also, carboxyl group(C-OH, C=O, O=C-O) produced by oxidation reaction from O1s peak analysis.