• 한국기계가공학회지
• /
• 제20권2호
• /
• pp.93-100
• /
• 2021

Copper sheets has been used widely in electric and electron industry fields because they have good electric and heat conduction property of the material. And, in order to bond copper material, a kind of soldering process is generally used. But, because it is difficult to bond by soldering between overlapped thin copper sheets, so, another kind of brazing bonding process can be used in that case. But, because the brazing process needs wide bonding area, it needs heat treatment process in electric furnace. Generally, for spot welding of sheets, a conventional electric Resistance Spot Welding process(RSW) has been used, it has welding characteristics using contact resistance heating induced by electric current flow between sheets. But, because copper sheets has the low electric resistance, it is difficult to weld by electric resistance spot welding. So, in this study, an electric Resistance heated Surface Friction Spot Welding process(RSFSW) is suggested and is testified for the spot welding ability of thin copper sheets. It is known from the experimental results and simulation that the suggested spot welding process will be able to improve the spot welding ability of copper sheets by the combined three kinds of heating generated by surface friction by rotating pin, and conducted from heated steel electrode, and generated by contact resistance of electricity.

• Macromolecular Research
• /
• 제17권7호
• /
• pp.522-527
• /
• 2009

A photocrosslinkable polyphosphazene was used for molecular imprinting. We synthesized polyphosphazene (3) having urea groups for complexation with N-carbobenzyloxyglycin (Z-Gly-OH, template) and chalcone groups for cross-linking reaction. As substituents, 4-hydroxycha1cone (1) and N-(4-hydroxyphenyl)-N'-ethylurea (2) were prepared. Choloro groups of poly(dichlorophosphazene) were replaced by the sequential treatment with sodium salts of compounds 1 and 2, and trifluoroethanol. The template molecule was complexed with the urea groups on the polymer chains via hydrogen bonding. A thin polymer film was prepared by casting a solution of the complex of polymer 3 and the template in dimethylformamide on a quartz cell and irradiated with 365 nm UV light to yield a cross-linked film with a thickness of about $16{\mu}m$. The template molecules in the film were removed by Soxhlet extraction with methanol/acetic acid. The control polymer film was prepared in the same manner for the preparation of the imprinted polymer film, except that the template and triethylamine were omitted. In the rebinding test, the imprinted film exhibited much higher recognition ability for the template than the control polymer. We also investigated the specific recognition ability of the imprinted polymer for the template and its structural analogues. The rebinding tests were conducted using Z-Glu-OH, Z-Asp($O^tBu$)-OH, and Z-Glu-OMe. The imprinted film showed higher specific recognition ability for the template and the lowest response for Z-Asp($O^tBu$)-OH.

• 마케팅과학연구
• /
• 제18권3호
• /
• pp.115-132
• /
• 2008

산업재 거래관계에서 구매자와 공급업체간의 장기 거래관계의 형성은 전형적인 현상이며 그동안 많은 연구들이 이러한 장기관계의 결정 요인과 그로 인한 결과에 관해 다양한 연구들을 수행해 왔다고 할 수 있다. 특히 금속산업은 산업재의 대표적인 산업 분야로 미국 금속산업 시장의 경우 기업당 평균 매출이 최소 10억 달러가 넘는 중요한 시장이라고 볼 수 있다. 본 연구에서는 이러한 중요한 의미를 갖는 미국 금속산업 시장에서 구매기업과 공급기업간의 거래관계를 형성하는 대표적인 요인으로 구조적 결합이라는 개념을 정립하고 이러한 구조적 결합을 결정하는 네가지 주요 변수(기술, 대체안 비교수준, 거래특유자산, 거래 중요성)들을 찾아내 이를 연구모형화하고 각각의 변수에 대한 연구가설을 다음과 같이 설정하였다. H1: 기술수준은 구조적 결합에 정의 영향을 미칠 것이다. H2: 대체안 비교수준은 구조적 결합에 정의 영향을 미칠 것이다. H3: 거래특유자산은 구조적 결합에 정의 영향을 미칠 것이다. H4: 거래의 중요성은 구조적 결합에 정의 영향을 미칠 것이다. H5: 구조적 결합은 몰입의 수준에 정의 영향을 미칠 것이다. 연구 가설의 검증을 위해 미국 금속산업에서 400개 기업을 선정해 설문조사를 실시 하였고 총 139개의 설문지를 회수하여 최종 분석에 사용하였다. 연구 가설과 연구 모형의 검증을 위해 구조방정식 모형과 LISREL을 사용하였고 최종 분석 결과 모든 가설이 체택되었다. 마지막으로 본 연구결과를 통한 마케팅전략적 시사점과 연구가 갖는 한계점에 대하여도 결론 부분에서 토론하였다.

• 한국건축시공학회지
• /
• 제1권2호
• /
• pp.185-190
• /
• 2001

The purpose of this study is the development of practical Dry floor tile unit method that settle the defect of a wet method and designed for resin mat. With use of PE resin which is confirmed the basic property, it is developed that resin mat, joint-sealing compound with fixed form and space management to Dry floor tile unit method. The result of this study is below. 1) To acquire above the 4kgf/$\textrm{cm}^2$ - construction specification criterion, the bonding space that between resin mat and tile has to occupy the 50% of resin mat module space(10,000$\textrm{cm}^2$). 2) Criteria of bonding part plane is below. simpleness of metal form. productivity, uniform quality after injection molding cooling, easy cutting for remain space management, adhesive property, construction ability, transformation of a severed piece under pressure and so on. 3) To get the shape that could protect the interfacial breakdown, it is designed that resin mat and tile are unified after the bond input. 4) Adapted joint-sealing compound is the material of urethane kinds wedge form. Resin mat has the water passageway that could drain the water. 5) To manage the severed piece of tile, the resin mat is likely to divide the half and the quarter and the plastic drainage is developed in the severed piece.

• Bulletin of the Korean Chemical Society
• /
• 제35권8호
• /
• pp.2371-2374
• /
• 2014

A kinetic study is reported on SNAr reaction of 1-fluoro-2,4-dinitrobenzene with a series of primary amines including hydrazine in $H_2O$ at $25.0^{\circ}C$. The plots of $k_{obsd}$ vs. [amine] are linear and pass through the origin, indicating that general-base catalysis by a second amine molecule is absent. The Br${\o}$nsted-type plot exhibits an excellent linear correlation with ${\beta}_{nuc}$ = 0.46 when hydrazine is excluded from the correlation. The reaction has been suggested to proceed through a stepwise mechanism, in which expulsion of the leaving group occurs after the rate-determining step (RDS). Hydrazine is ca. 10 times more reactive than similarly basic glycylglycine (i.e., the ${\alpha}$-effect). A five-membered cyclic intermediate has been suggested for the reaction with hydrazine, in which intramolecular H-bonding interactions would facilitate expulsion of the leaving group. However, the enhanced leaving-group ability is not responsible for the ${\alpha}$-effect shown by hydrazine because expulsion of the leaving group occurs after RDS. Destabilization of the ground-state of hydrazine through the electronic repulsion between the nonbonding electron pairs is responsible for the ${\alpha}$-effect found in the current $S_NAr$ reaction.

• 마이크로전자및패키징학회지
• /
• 제30권3호
• /
• pp.11-19
• /
• 2023

최근 Chat GPT와 같은 인공지능 (Artificial Intelligence, AI) 기술의 급격한 발전에 따라 AI 반도체의 중요성이 강조되고 있다. AI 기술은 빅데이터 처리, 딥 러닝, 알고리즘 등의 요구사항으로 인해 대용량 데이터를 빠르게 처리할 수 있는 능력을 필요로 한다. 그러나 AI 반도체는 대규모 데이터를 처리하는 과정에서 과도한 전력 소비와 데이터 병목현상 문제가 발생한다. 반도체 전공정의 초미세공정이 물리적 한계에 도달함에 따라, AI 반도체의 연산을 위한 최신 패키징 기술이 요구되는 추세이다. 본 고에서는 AI 반도체에 적용가능한 인터포저, TSV, 범핑, Chiplet, 하이브리드 본딩 패키징 기술에 대해서 기술하였다. 이러한 기술들은 AI 반도체의 전력 효율과 연산 속도를 향상시키는데 기여할 것으로 기대된다.

• Korean Chemical Engineering Research
• /
• 제53권6호
• /
• pp.802-807
• /
• 2015

본 논문에서는 글루코스산화제, polyethyleneimine(PEI) 및 탄소나노튜브 간 물리적 흡착으로 제조된 촉매(GOx/PEI/CNT)에 새로운 가교제인 terephthalaldehyde(TPA)를 첨가하여 민감도 및 안정성이 개선된 글루코스 센서 촉매를 합성하여, 감지능 및 안정성 개선효과를 확인하였다. 새로운 가교제를 포함한 바이오 촉매는, 글루코스산화제 및 polyethyeleneimine의 관능기와 TPA의 관능기간 알돌축합반응에 의해 생성되었고, 이를 통해 생성된 새로운 전자전달구조는 글루코스의 산화반응을 촉진시켰다. 이러한 촉매활성은 전기화학적 평가를 통해 정량적으로 평가하였으며 그 결과 $41.1{\mu}Acm^{-2}mM^{-1}$의 글루코스 민감도를 얻을 수 있었다. 또한 가교제와 글루코스산화제 및 polyethyeleneimine 간의 화학반응의 형성에 의해 글루코스 산화제의 외부 손실을 최소화 하여, 센서 안정성 향상에도 크게 기여하였다. 안정성 평가를 한 결과, 3주간의 주기적인 촉매 활성 측정후에 94.6% 활성이 유지됨을 확인하였다.

• Bulletin of the Korean Chemical Society
• /
• 제35권7호
• /
• pp.2081-2085
• /
• 2014

Second-order rate constants ($k_N$) have been measured spectrophotometrically for the reactions of phenyl 2- pyridyl carbonate (6) with a series of cyclic secondary amines in MeCN at $25.0{\pm}0.1^{\circ}C$. The Br${\o}$nsted-type plot for the reaction of 6 is linear with ${\beta}_{nuc}$ = 0.54, which is typical for reactions reported previously to proceed through a concerted mechanism. Substrate 6 is over $10^3$ times more reactive than 2-pyridyl benzoate (5), although the reactions of 6 and 5 proceed through the same mechanism. A combination of steric hindrance, inductive effect and resonance contribution is responsible for the kinetic results. The reactions of 6 and 5 proceed through a cyclic transition state (TS) in which H-bonding interactions increase the nucleofugality of the leaving group (i.e., 2-pyridiniumoxide). The enhanced nucleofugality forces the reactions of 6 and 5 to proceed through a concerted mechanism. In contrast, the corresponding reaction of 4-nitrophenyl 2-pyridyl carbonate (7) proceeds through a stepwise mechanism with quantitative liberation of 4-nitrophenoxide ion as the leaving group, indicating that replacement of the 4-nitrophenoxy group in 7 by the PhO group in 6 changes the reaction mechanism (i.e., from a stepwise mechanism to a concerted pathway) as well as the leaving group (i.e., from 4-nitrophenoxide to 2-pyridiniumoxide). The strong electron-withdrawing ability of the 4-nitrophenoxy group in 7 inhibits formation of a H-bonded cyclic TS. The presence or absence of a H-bonded cyclic TS governs the reaction mechanism (i.e., a concerted or stepwise mechanism) as well as the leaving group (i.e., 2-pyridiniumoxide or 4-nitrophenoxide).

• Restorative Dentistry and Endodontics
• /
• 제36권5호
• /
• pp.385-396
• /
• 2011

연구목적: 본 연구는 치근벽의 전처리 개념과 접착제의 중합방법이 레진계 근관충전제의 치근단 밀폐능에 미치는 영향을 평가하였다. 연구 재료 및 방법: 3가지 다른 접착변수를 조합하여 충전한 Resilon-RealSeal 시스템의 근단미세누출을 색소침투법을 이용하여 통상의 가타퍼쳐 충전과 비교하였다. 실험군은 자가부식형 RealSeal primer와 이중중합형 RealSeal sealer를 이용하여 Resilon 충전한 SEDC군, 산부식없이 Scotchbond Multi-Purpose primer를 적용한 후 접착제는 광중합하고 Resilon을 충전한 NELC군, 및 Scotchbond Multi-Purpose의 접착강화제와 접착제를 total etch/wet bonding과 광중합의 술식을 정확하게 지켜서 Resilon을 충전한 TELC군으로 구분하였다. 대조군(GPCS)에서는 통상의 AH26 plus sealer를 사용하여 가타퍼쳐를 충전 하였다. 결과: 치아장축방향의 색소침투는 TELC군에서 GPCS군과 SEDC군에 비해 유의하게 작았다(Kruskal-Wallis test, p < 0.05). 횡단면의 미세누출 점수도 TELC군이 근첨으로부터 2 - 5 mm의 범위에서 다른 군에 비해 유의하게 낮았다(Kruskal-Wallis test, p < 0.05). 결론: 레진계 근관충전제를 사용 시에는, 자가부식형 전처리제와 이중중합형 sealer보다는, total etch/wet bonding 개념과 적절한 광중합을 도모하는 전처리제 및 접착제의 사용이 치근단 미세누출을 감소시키므로 추천된다.

• 한국조명전기설비학회:학술대회논문집
• /
• 한국조명전기설비학회 2009년도 추계학술대회 논문집
• /
• pp.343-346
• /
• 2009

The grounding system of low voltage power systems is TT grounding system in Korea. In order to follow the international standard, TN grounding system is adopted. However, the performance of grounding systems has not been evaluated. This paper deals with the experimental results of protection ability of grounding system when lightning surge invades to the neutral line of low voltage power system. As a result, the TT grounding system is most frail for the lightning surge and it does not protect the electrical devices. On the other hand, the TN grounding system perfectly protects the electrical equipment and prevents the electric shock for human through the equipotential bonding. In case of TN system with supplement grounding, it is very important to lower the supplement grounding resistance to protect the electrical equipment and electric shock for human.