• Proceedings of the Korean Society for Emotion and Sensibility Conference
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• 2001.05a
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• pp.147-155
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• 2001

Nasucon lamp and Russian ones, which are coated with some special materials on the glass bulb, gave good clinical results for a cancer therapy. They are experimentally studied with Automatic Bioelectric Response Recorder on the six placements of the electrodes (two feet, two hands and two foreheads). They reduced the current rather than the control (natural) state. However infrared lamp and Chinese God light did not reduced the value current. Hemoglobin in blood. Brown gas, Ti$_3$SiC$_2$ and Nasucon have planar crystallizing $\pi$-bonding bonding layer and covalent bonding one in sequence commonly and thus the alternating magnetic fields are protected. Nasucon lamp and Russian ones utilized electric bulbs in order to generate alternating magnetic fields and to produce absorbing force.

• Journal of Power System Engineering
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• v.7 no.2
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• pp.73-79
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• 2003

The present study was aimed at analysing the damage of a used gas turbine bucket after 39,500h of total service. Microstructures and cracks of service-induced bucket were observed. The crack might have initiated from the coating in the bucket surface by thermal fatigue and propagated into the GTD111 base metal. Maximum depth of penetration was 2.7 mm(full penetration) at the leading edge. Crack contains a lot of Cr-,Ti-,Al-oxide which will prohibit filling and wetting of insert metal. Depth and propagation direction of crack were accorded with centrifugal force and temperature distribution in turbine bucket. Present result will provide basic data for repair bonding process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.382-383
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• 2006

본 연구에서는 열처리 본딩장비를 실제로 개발하여 Al/Sus와 Al/Al의 두 재료를 서로 본딩 하였다. 열처리 본딩 실험을 하기 위해서 열처리시에 온도분포를 정확히 파악하기 위해서 컴퓨터모의실험으로 같은 재료인 Al/Al과 서로 다른 재료인 Al/Sus의 온도분포를 나타내었다. 본딩된 두 가지의 sample들을 FESEM으로 접합부의 표면조직 상태를 측정하였고 인장력측정 장치로 bonding strength를 측정하였다. 접착제를 사용한 본딩 sample 보다는 더 본딩 결합력이 크다는 것을 확인할 수 있었다.

• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.465-469
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• 1999

In this paper, spacer process for FED (Field Emission Display ) was developed with the glass to glass anodic bonding technology using Al film as an interlayer. Characteristics, current density-time curves and force of the anodic boding were measured on various thickness of Al film; 1000$\AA$, 2000$\AA$, 3000$\AA$, 4000$\AA$ and 500$\AA$. Holders for spacer were fabricated with photosensitive glass and (110) Si wafer by bulk micromachining. Spacers was formed on glass substrate by spacer glass to glass anodic bonding and an evacuated panel was fabricated to prove the potential of application for FED.

• Journal of the Korea Institute of Military Science and Technology
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• v.11 no.1
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• pp.57-65
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• 2008

Superplastic forming/diffusion bonding(SPF/DB) processes with inner contact were analyzed using a 3-D rigid visco-plastic finite element method. A constant-triangular element based on membrane approximation and an incremental theory of plasticity are employed for the formulation. The hierarchical search algorithm for the contact searching has been applied. The algorithms for contact force processing were designed to handle equally well contact between deformable bodies, as well as rigid bodies. The plate of three and four sheets for 3-D SPF/DB model are analyzed using the developed program. The validity for the analysis is verified by comparison between analysis, experiment and results in the literature.

• Journal of the Korean Society of Safety
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• v.24 no.3
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• pp.7-12
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• 2009

The tensile and fatigue experiments were conducted with tensile-peel specimens for investigating on strength of adhesively bonded and mechanical press joints of aluminum sheet used in the field of the automobile industry. The combining epoxy adhesive bonding and mechanical press joining exhibits an increase in joining force as a result of interaction between static forces of the two joining methods. The fatigue strength of pure adhesive joint was measured as 91% of that of the combination of adhesive bond and mechanical press joint, suggesting that the interaction between the bonding and mechanical joining was about 9%.

• The Journal of Korea Robotics Society
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• v.11 no.3
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• pp.140-145
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• 2016

In this paper, we fabricate arrayed-type flexible capacitive touch sensor using liquid metal (LM) droplets (4 mm spatial resolution). Poly-4-vinylphenol (PVP) layer is used as a dielectric layer on the electrode patterned Polyethylene naphthalate (PEN) film. Bonding tests between hydroxyl group (-OH) on the PVP film and polydimethylsiloxane (PDMS) are conducted in a various $O_2$ plasma treatment conditions. Through the tests, we can confirm that non-$O_2$ plasma treated PVP layer and $O_2$ plasma treated PDMS can make a chemical bond. To measure dynamic range of the device, one-cell experiments are conducted and we confirmed that the fabricated device has a large dynamic range (~60 pF).

• The Journal of Korean Academy of Prosthodontics
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• v.18 no.1
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• pp.49-57
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• 1980

The adhesive mechanisms on the metal-ceramic restorations have been reported to be mechanical interlocking, chemical bonding, compressive force, and Van der Waal's force, etc. Of these, the mechanical interlocking and chemical bonding forces are thought to affect the adhesive force between Ni-Cr alloy and porcelain. This study investigates the adhesion of Ni-Cr alloy to porcelain according to surface treatment. For this purpose, the following experiments were made; The compositions of Ni-Cr alloy as cast by emission spectrograph, and the oxides produced on Ni-Cr alloy during degassing at $1850^{\circ}F$ for 30 minutes in air and in vacuum were analyzed by X-ray diffractograph. The metal phases of Ni-Cr alloy were observed according to porcelain-baking cyclic heat treatment by photo microscope and the distribution and the shift of elements of Ni-Cr alloy and porcelain and the failure phases between Ni-Cr alloy and porcelain by scanning electron microscope. The adhesive force between Ni-Cr alloy and porcelain was measured according to surface treatment with oxidization and roughening by Instron Universal Testing Machine. Results were as follows; 1. The metal phases of Ni-Cr alloy as cast and degassing state showed the enlarged and fused core, but when subjected to porcelain-baking cyclic heat treatment, showed a dendrite growing. 2. The kinds of metal oxides produced on Ni-Cr alloy during degassing were found to be NiO and $Cr_2O_3$. 3. The distribution of elements at the interface of Ni-Cr alloy and porcelain in degassing state showed demarcation line, but in roughening state, showed mechanical interlocking phase. 4. The shift of elements at the interface occurred in both states, but the shift amount was found to be larger in roughening than in degassing. 5. The adhesive force between Ni-Cr alloy and porcelain was found to be $3.45{\pm}0.93kg/mm^2$, in degassing and $3.82{\pm}0.99kg/mm^2$, in roughening. 6. The failure phase between Ni-Cr alloy and porcelain showed the mixed type failure.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1018-1021
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.