• Title/Summary/Keyword: Bonded line

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Finite Element Analysis for the Optimal Shape of the High Voltage Insulator for Power Transmission Lines (송전선로용 고전압 절연체의 최적 형상에 대한 유한요소 해석)

  • Kim, Taeyong;Sanyal, Simpy;Rabelo, Matheus;Yi, Junsin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.1
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    • pp.66-71
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    • 2022
  • The insulator used for the transmission line is a device that is bonded with a cap, pin, ceramic, and cement to withstand insulation capacity and mechanical load. The insulator design can help to reduce the dispersion of the electric field; thus, the optimization of today's design, especially as demanded power grows, is critical. The designs of four manufacturers were used to perform a comparative analysis. Under dry circumstances of the new product, an electric field distribution study was done with no pollutants attached. Manufacturer D's design has the best voltage uniformity of 24.33% and the arc length of 500 mm or more. Manufacturer C's design has an equalizing voltage of more than 2% higher than that of other manufacturers. The importance of the design of the insulator and the number of connections according to the installation conditions is very efficient for transmission lines that will increase in the future.

Electroabsorption modulator-integrated distributed Bragg reflector laser diode for C-band WDM-based networks

  • Oh-Kee Kwon;Chul-Wook Lee;Ki-Soo Kim
    • ETRI Journal
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    • v.45 no.1
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    • pp.163-170
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    • 2023
  • We report an electroabsorption modulator (EAM)-integrated distributed Bragg reflector laser diode (DBR-LD) capable of supporting a high data rate and a wide wavelength tuning. The DBR-LD contains two tuning elements, plasma and heater tunings, both of which are implemented in the DBR section, which have blue-shift and red-shift in the Bragg wavelength through a current injection, respectively. The light created from the DBR-LD is intensity-modulated through the EAM voltage, which is integrated monolithically with the DBRLD using a butt-joint coupling method. The fabricated chip shows a threshold current of approximately 8 mA, tuning range of greater than 30 nm, and static extinction ratio of higher than 20 dB while maintaining a side mode suppression ratio of greater than 40 dB under a window of 1550 nm. To evaluate its modulation properties, the chip was bonded onto a mount including a radiofrequency line and a load resistor showing clear eye openings at data rates of 25 Gb/s nonreturn-to-zero and 50 Gb/s pulse amplitude modulation 4-level, respectively.

V-band CPW 3-dB Directional Coupler using Tandem Structure (Tandem구조를 이용한 V-band용 CPW 3-dB 방향성 결합기)

  • Moon Sung-Woon;Han Min;Baek Tae-Jong;Kim Sam-Dong;Rhee Jin-Koo
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.42 no.7 s.337
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    • pp.41-48
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    • 2005
  • We design and fabricate 3-dB tandem directional coupler using the coplanar waveguide structure which is applicable to balanced amplifiers and mixers for 60 GHz wireless local area network system. The coupler comprises the multiple-sectional parallel-coupled lines to facilitate the fabrication process, and enable smaller device size and higher directivity than those of the conventional 3-dB coupler employing the edge-coupled line. In this study, we adopt the structure of two-sectional parallel-coupled lines of which each single-coupled line has a coupling coefficient of -8.34 dB and airbridge structure to monolithically materialize the uniplanar coupler structure instead of using the conventional multilayer or bonded structure. The airbridge structure also supports to minimize the parasitic components and maintain desirable device performance in V-band (50$\~$75 GHz). The measured results from the fabricated couplers show couplings of 3.S$\~$4 dB and phase differences of 87.5$^{\circ}{\pm}1^{\circ}$ in V-band range and show directivities higher than 30 dB at a frequency of 60 GHz.

V-Band filter using Multilayer MCM-D Technology (MCM-D 공정기술을 이용한 V-BAND FILTER 구현에 관한 연구)

  • Yoo Chan-Sei;Song Sang-Sub;Part Jong-Chul;Kang Nam-Kee;Cha Jong-Bum;Seo Kwang-Seok
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.9 s.351
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    • pp.64-68
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    • 2006
  • Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

Cost Effective Silica-Based 100 G DP-QPSK Coherent Receiver

  • Lee, Seo-Young;Han, Young-Tak;Kim, Jong-Hoi;Joung, Hyun-Do;Choe, Joong-Seon;Youn, Chun-Ju;Ko, Young-Ho;Kwon, Yong-Hwan
    • ETRI Journal
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    • v.38 no.5
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    • pp.981-987
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    • 2016
  • We present a cost-effective dual polarization quadrature phase-shift coherent receiver module using a silica planar lightwave circuit (PLC) hybrid assembly. Two polarization beam splitters and two $90^{\circ}$ optical hybrids are monolithically integrated in one silica PLC chip with an index contrast of $2%-{\Delta}$. Two four-channel spot-size converter integrated waveguide-photodetector (PD) arrays are bonded on PD carriers for transverse-electric/transverse-magnetic polarization, and butt-coupled to a polished facet of the PLC using a simple chip-to-chip bonding method. Instead of a ceramic sub-mount, a low-cost printed circuit board is applied in the module. A stepped CuW block is used to dissipate the heat generated from trans-impedance amplifiers and to vertically align RF transmission lines. The fabricated coherent receiver shows a 3-dB bandwidth of 26 GHz and a common mode rejection ratio of 16 dB at 22 GHz for a local oscillator optical input. A bit error rate of $8.3{\times}10^{-11}$ is achieved at a 112-Gbps back-to-back transmission with off-line digital signal processing.

Effects of Carbide Morphology and Heat Treatment on Abrasion Wear Resistance of Chromium White Cast Irons (합금크롬주철의 탄화물형상 및 열처리가 내마모성에 미치는 영향)

  • Yu, Sung-Kon;Matsubara, Yasuhiro
    • Korean Journal of Materials Research
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    • v.12 no.5
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    • pp.407-413
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    • 2002
  • Eutectic high chromium cast irons containing 17%Cr and 26%Cr were produced for this research by making each of them solidify unidirectionally. Abrasion wear test against SiC or $Al_2$O$_3$bonded paper was carried out using test pieces cut cross-sectionally at several distances from the chill face of castings. The wear resistance was evaluated in connection with the parameters such as eutectic colony size($E_w$), area fraction of boundary region of the colony($S_B$) where comparatively large massive chromium carbides are crystallized and, average diameter of chromium carbides in the boundary region($D_c$). The wear rate($R_w$), which is a gradient of straight line of wear loss versus testing time, was influenced by the type and the particle size of the abrasives. The $R_w$ value against SiC was found to be larger than that against A1$_2$O$_3$under the similar abrasive particle size. In the case of SiC, the $R_w$ value increased with an increase in the particle size. The $R_w$ value also increased as the eutectic colony size decreased, and that of the 17%Cr iron was larger than that of the 26%Cr iron at the same $E_w$ value. Both of the $S_B$ and $D_c$ values were closely related to the $R_w$ value regardless of chromium content of the specimens. The $R_w$ values of the annealed specimens were greater than those of the as-cast specimens because of softened matrix structures. As for the relationship between wear rate and macro-hardness of the specimens, the hardness resulting in the minimum wear rate was found to be at 550 HV30.

Wafer Level Hermetic Sealing Characteristics of RF-MEMS Devices using Non-Conductive Epoxy (비전도성 에폭시를 사용한 RF-MEMS 소자의 웨이퍼 레벨 밀봉 실장 특성)

  • 박윤권;이덕중;박흥우;송인상;김정우;송기무;이윤희;김철주;주병권
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.11-15
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    • 2001
  • In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

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Evaluation of marginal fit of 2 CAD-CAM anatomic contour zirconia crown systems and lithium disilicate glass-ceramic crown

  • Ji, Min-Kyung;Park, Ji-Hee;Park, Sang-Won;Yun, Kwi-Dug;Oh, Gye-Jeong;Lim, Hyun-Pil
    • The Journal of Advanced Prosthodontics
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    • v.7 no.4
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    • pp.271-277
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    • 2015
  • PURPOSE. This study was to evaluate the marginal fit of two CAD-CAM anatomic contour zirconia crown systems compared to lithium disilicate glass-ceramic crowns. MATERIALS AND METHODS. Shoulder and deep chamfer margin were formed on each acrylic resin tooth model of a maxillary first premolar. Two CAD-CAM systems (Prettau$^{(R)}$Zirconia and ZENOSTAR$^{(R)}$ZR translucent) and lithium disilicate glass ceramic (IPS e.max$^{(R)}$press) crowns were made (n=16). Each crown was bonded to stone dies with resin cement (Rely X Unicem). Marginal gap and absolute marginal discrepancy of crowns were measured using a light microscope equipped with a digital camera (Leica DFC295) magnified by a factor of 100. Two-way analysis of variance (ANOVA) and post-hoc Tukey's HSD test were conducted to analyze the significance of crown marginal fit regarding the finish line configuration and the fabrication system. RESULTS. The mean marginal gap of lithium disilicate glass ceramic crowns (IPS e.max$^{(R)}$press) was significantly lower than that of the CAD-CAM anatomic contour zirconia crown system (Prettau$^{(R)}$Zirconia) (P<.05). Both fabrication systems and finish line configurations significantly influenced the absolute marginal discrepancy (P<.05). CONCLUSION. The lithium disilicate glass ceramic crown (IPS e.max$^{(R)}$press) had significantly smaller marginal gap than the CAD-CAM anatomic contour zirconia crown system (Prettau$^{(R)}$Zirconia). In terms of absolute marginal discrepancy, the CAD-CAM anatomic contour zirconia crown system (ZENOSTAR$^{(R)}$ZR translucent) had under-extended margin, whereas the CAD-CAM anatomic contour zirconia crown system (Prettau$^{(R)}$Zirconia) and lithium disilicate glass ceramic crowns (IPS e.max$^{(R)}$press) had overextended margins.

QUANTITATIVE COMPARISON OF PERMEABILITY IN THE ADHESIVE INTERFACE OF FOUR ADHESIVE SYSTEMS (열순환 후 상아질 접착 계면의 수분 투과성 변화에 대한 정량적 분석)

  • Chang, Ju-Hea;Yi, Kee-Wook;Kim, Hae-Young;Lee, In-Bog;Cho, Byeong-Hoon;Son, Ho-Hyun
    • Restorative Dentistry and Endodontics
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    • v.34 no.1
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    • pp.51-60
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    • 2009
  • The purpose of this study was to perform quantitative comparisons of water permeable zones in both the adhesive and the hybrid layer before and after thermo cycling in order to assess the integrity of the bonding interface. Twenty eight flat dentin surfaces were bonded with a light-cured composite resin using one of four commercial adhesives [OptiBond FL (OP), AdheSE (AD), Clearfil SE Bond (CL). and Xeno III (XE)]. These were sectioned into halves and subsequently cut to yield 2-mm thick specimens; one specimen for control and the other subjected to thermocycling for 10,000 cycles. After specimens were immersed in ammoniacal silver nitrate for 24 h and exposed to a photo developing solution for 8 h, the bonded interface was analyzed by scanning electron microscopy (SEM) and wavelength dispersive spectrometry (WDS) at five locations per specimen. Immediately after bonding. the adhesive layer of OP showed the lowest silver uptake, followed by CL, AD. and XE in ascending order (p < 0.0001); the hybrid layer of CL had the lowest silver content among the groups (p = 0.0039). After thermocycling, none of the adhesives manifested a significant increase of silver in either the adhesive or the hybrid layer. SEM demonstrated the characteristic silver penetrated patterns within the interface. It was observed that integrity of bonding was well maintained in OP and CL throughout the thermocycling process. Adhesive-tooth interfaces are vulnerable to hydrolytic degradation and its permeability varies in different adhesive systems, which may be clinically related to the restoration longevity.

A Landscape Interpretation of Island Villages in Korean Southwest Sea (한국 서남해 섬마을의 경관체계해석 -진도군 조도군도, 신안군 비 금, 도초, 우이도 및 흑산군도를 중심으로-)

  • 김한배
    • Journal of the Korean Institute of Landscape Architecture
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    • v.18 no.4
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    • pp.45-71
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    • 1991
  • The landscape systems in Korean island settlements can be recognized as results of ingabitants' ecological adptation to the isolated environment with the limited natural resources. Both the fishery dominant industry in island society and ecological nature of its environments seem to have influenced on inhabitants' environmental cognition as well as the physical landscape of island villages such as its location, spatial pattern in each village, housing form and so on. This study was done mainly by both refering to the related documents and direct observations in case study areas, and results of the study can be summarized as follows. 1. In general, the landscape of an individual island seems to take more innate characteristics of island's own, corresponding to the degree of isolation from mainland. That is, while the landscape of island in neighboring waters takes both inland-like and island-innate landscape character at the same time, the one in the open sea far from land takes more innate landscape character of all island's own in the aspects of village location, land use and housing density etc. 2. The convex landform of most islands brings about more centrifugal village allocation than centripetal allocation in most inland villages. And thus most villages in each island face extremely diverse directions different from the south facing preference in most inland rural villages. 3. Most island villages tend to be located along the ecologically transitional strip between land and sea, so called 'line of life', rather than between hilly slope and flat land as being in most inland village locations. So they are located with marine ecology bounded fishing ground ahead and land ecology bounded agricultural site at the back of them. 4. The settlement pattern of the island fishing villages shows more compact spatial structure than that of inland agricultural villages, due to the absolute limits of usable land resources and the adaptation to the marine environment with severe sea winds and waves or for the easy accessability to the fishing grounds. And also the managerial patterns of public owned sea weed catching ground, which take each family as the unit of usership rather than an individual, seem to make the villagescape more compact and the size of Individual residence smaller than that of inland agricultural village. 5. The folk shrine('Dand') systems, in persrective of villagescape, represent innate environmental cognition of island inhabitants above all other cultural landscape elements in the island. Usually the kinds and the meanings of island's communal shrine and its allocative patternsin island villagescape are composed of set with binary opposition, for example 'Upper shrine(representing 'earth', 'mountain' or 'fire')' and 'Lower Shrine(representing 'sea', 'dragon' or 'water') are those. They are usually located at contrary positions in villagescape each other. That is, they are located at 'the virtical center or visual terminus(Upper shrine at hillside behind the village)' and 'the border or entrance(Lower Shrine at seashore in front of the village)'. Each of these shirines' divinity coincides with each subsystem of island's natural eco-system(earth sphere vs marine sphere) and they also contribute to ecological conservation, bonded with the 'Sacred Forest(usually with another function of windbreak)' or 'Sacred Natural Fountain' nearby them, which are representatives of island's natural resources.

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