• 제목/요약/키워드: Bisphenol A diglycidyl ether

검색결과 94건 처리시간 0.036초

Epoxy-nanoclay composite 제작과 전기적 특성 (The Fabrication of Epoxy-nanoclay composite and electrical properties)

  • 노현지;이성갑;안병립;원우식;이창공
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 제39회 하계학술대회
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    • pp.1222-1223
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    • 2008
  • Nanocomposites of a epoxy resin are synthesized and evaluated. the present study investigated the effect of nanoclay additives on the properties of diglycidyl ether or bisphenol A(DGEBA) epoxy resin. DGEBA was mixed with 3$\sim$7 wt% organically modified layered silicate, Cloisite 30B for three hours. The average grain size of the specimens decreased with adding Cloisite 30B. The dielectric constant showed between 3.2$\sim$3.5 and the dielectric loss showed between 3.2$\sim$5.7 % in all specimens. Dielectric strength showed a best valu of 20.8 kV/mm at added with Cloisite 30B 5 wt%.

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실란 결합제 처리된 에폭시 수지 복합재료의 계면 특성 (Interface Characteristics of Epoxy Composite Treated with Silane Coupling Agent)

  • 이재영;이홍기;심미자;김상욱
    • 한국재료학회지
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    • 제11권12호
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    • pp.1009-1013
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    • 2001
  • The effects of coupling agent on the interface characteristics between epoxy resin and natural zeolite were studied by SEM, optical microscope and universal testing machine (UTM). Epoxy resin as a matrix was diglycidyl ether of bisphenol A (DGEBA)/4,4'-methylene dianiline (MDA)/malononitrile (MN) system and natural zeolite as an inorganic fillet was produced in Korea. With the increment of zeolite content, tensile strength decreased and it was due to the different elastic moduli of two materials. When external stress was loaded on the composites, the stress concentrated on the weakly bonded interface and crack grew easily. To improve the interface characteristics, the surface of the natural zeolite was treated with the silane coupling agent and it was found that the tensile strength was increased. The morphology of the interface showed that the bonding characteristics were modified by coupling agent.

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고분자-세라믹 나노 컴포지트의 제작과 전기적 특성 (The Fabrication of polymer-nanoclay composite and electric properties)

  • 노현지;이성갑;남성필;안병립;원우식;우형관;박상만
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.257-258
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    • 2009
  • Nanocomposites of a epoxy resin are synthesized and evaluated the present study investigated. The effect of nanoclay additives on the properties of diglycidyl ether or bisphenol A(DGEBA) epoxy resin. DGEBA was mixed with 3~7 wt% organically modified layered silicate, Cloisite 30B for three hours. The average grain size of the specimens decreased with adding Cloisite 30B. The dielectric constant showed between 3.2 ~ 3.5 and the dielectric loss showed between 3.2 ~ 5.7 % in all specimens.

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Amine Terminated Polyetherimide/에폭시 수지 시스템의 경화공정연구와 파괴인성에 관한 연구 (A Study on the Curing Behavior and Toughness of Amine Terminated Polyetherimide/Epoxy Resin System)

  • 김민영;이광기;김원호;황병선;김대식;박종만
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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    • pp.147-150
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    • 2002
  • The cure kinetics of blends of epoxy (DGEBA:diglycidyl ether of bisphenol A)/anhydride (NMA:nadic methyl anhydride) resin with synthesized amino terminated polyetherimide (AT-PEI) were studied using differential scanning calorimetry (DSC) and Dynamic Mechanical Analysizer(DMA) under isothermal condition to determine the reaction parameters and gel-vitrification behavior. The fracture toughness of AT-PEI 20phr/epoxy resin system was improved over 224% and 42.5% more than neat epoxy resin and commercial PEI/Epoxy Resin System.

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DSC 분석에 의한 DGEBA/MDA/GN/HQ계의 경화반응 속도론 (Cure Kinetcs of DGEBA/MDA/GN/HQ System by DSC Analysis)

  • 이재영;심미자;김상욱
    • 공업화학
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    • 제5권5호
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    • pp.904-909
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    • 1994
  • 촉매로 작용하는 HQ의 첨가에 따른 DGEBA/MDA/GN계의 경화반응 속도론 변화를 Kissinger equation과 Fractional life법에 의해 연구하였다. HQ가 첨가된 계가 첨가되지 않은 계보다 활성화 에너지는 약간 감소하였고, pre-exponential factor 값은 30% 정도 증가하였다. 그리고, HQ(1.25phr)가 첨가됨으로 인해 반응속도는 1.8배 정도 증가하였다.

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Thermal Properties and Water Sorption Behaviors of Epoxy and Bismaleimide Composites

  • Seo, Jong-Chul;Jang, Won-Bong;Han, Hak-Soo
    • Macromolecular Research
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    • 제15권1호
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    • pp.10-16
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    • 2007
  • In this work, we prepared epoxy/BMI composites by using N,N'-bismaleimide-4,4'-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4'-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravi-metrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.

Effects of Curing Agent on the Corrosion Protection of Diglycidyl Ether Bisphenol-A Based Epoxy Coating

  • Shon, MinYoung;Kwon, HyukSang
    • Corrosion Science and Technology
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    • 제7권6호
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    • pp.344-349
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    • 2008
  • Epoxy coatings were prepared to give a different corrosion protection by reacting it with two different kinds of curing agent, and then effects of the curing agents on the structure, surface hydrophobic tendency, water transport behavior and hence corrosion protection of epoxy coatings were examined using hygrothermal cyclic test, and impedance analysis. In the results of EIS, the corrosion protection of epoxy coating cured by polyamide shows better than epoxy coating cured by polyamide epoxy adduct. It was well agreed with its water transport behavior and hydrophobic tendency.

DGEBA/MDA/HQ-PGE계의 경화 반응 속도론 (Cure Kinetics of DGEBA/MDA/HQ-PGE System)

  • 송영욱;심미자;김상욱
    • 공업화학
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    • 제7권2호
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    • pp.356-361
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    • 1996
  • 반응성 첨가제로 HQ와 PGE를 합성시킨 HQ-PGE를 사용하여, DGEBA/MDA계의 경화반응이 일어날 때의 속도론을 DSC와 FT-IR을 이용하여 조사하였다. 그리고, Kissinger equation과 Arrhenius equation을 이용하여 활성화 에너지와 pre-exponential factor 값을 구하였다. 계의 활성화 에너지는 HQ-PGE가 첨가되었을 때 감소하였다. 합성 HQ-PGE가 5 phr 첨가되었을 때, DGEBA/MDA계의 활성화 에너지는 FT-IR로 측정하였을 때 7.8 kcal/mol, DSC로 측정하였을 때에 11.3 kcal/mol을 나타내었다. 이 값은 HQ-PGE가 첨가되지 않은 경우보다 각각 30%, 9% 감소된 값이었다. 이 결과들을 통해서 반응성 첨가제로 사용된 HQ-PGE는 본 계에서 촉매의 역할을 함을 알 수 있었다.

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에폭시 수지계 의료용 고분자 재료의 특성 연구 - Kissinger 식과 Ozawa 식에 의한 DGEBA/MDA/PGE-DMU 계의 경화특성 - (Characteristics of Medical Polymer Based on Epoxy Resin System -Cure Characteristics for DGEBA/MDA/PGE- DMU System by Kissinger and Ozawa Equations-)

  • 김장훈;이재영;김상욱;심미자
    • 한국재료학회지
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    • 제11권9호
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    • pp.727-732
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    • 2001
  • The cure kinetics of diglycidyl ether of bisphenol A (DGEBA)/4,4'- methylene dianiline (MDA) system with synthesized phenyl glycidyl ether-dimethylurea (PGE-DMU) was studied by Kissinger and Ozawa equations with DSC analysis in the temperature range of $20~300^{\circ}C$ To investigate the reaction mechanism between epoxy group of PGE and urea group of DMU, FT-lR spectroscopy analysis was used. The epoxide group of PGE reacted with the urea group of DMU and formed a hydroxyl group which acted as a catalyst on the cure reaction of other epoxide and amine groups. The activation energy of DGEBA/MDA system without PGE-DMU was 46.5 kJ/mol and those of the system with 5 and 10 phr of PGE- DMU were 43.4 and 37.0 kJ/mol, respectively. Ozawa method also showed the same tendency.

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Cure and Thermal Degradation Kinetics of Epoxy/Organoclay Nanocomposite

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • 제13권4호
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    • pp.204-207
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    • 2012
  • Epoxy nanocomposite was synthesized through the exfoliation of organoclay in an epoxy matrix, which was composed of diglycidyl ether of bisphenol A (DGEBA), 4,4'-methylene dianiline (MDA) and malononitrile (MN). Organoclay was prepared by treating the montmorillonite with octadecyl trimethyl ammonium bromide (ODTMA). The exfoliation of the organoclay was estimated by wide angle X-ray diffraction (WAXD) analysis. In order to measure the cure rate of DGEBA/MDA (30 phr)/MN (5 phr)/organoclay (3 phr), differential scanning calorimetry (DSC) analysis was performed at various heating rates, and the data were interpreted by Kissinger equation. Thermal degradation kinetics of the epoxy nanocomposite were studied by thermogravimetric analysis (TGA), and the data were introduced to the Ozawa equation. The activation energy for cure reaction was 45.8 kJ/mol, and the activation energy for thermal degradation was 143 kJ/mol.