• Title/Summary/Keyword: Base plate materials

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A study on monitoring for process time and process properties by measuring vibration signals transmitted to the mold during injection molding (사출성형공정에서 금형에 전달되는 진동 신호 측정을 이용한 성형 단계별 공정시간과 공정특성의 모니터링에 대한 연구)

  • Lee, Jun-han;Kim, Jong-Sun
    • Design & Manufacturing
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    • v.14 no.3
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    • pp.8-16
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    • 2020
  • In this study, the vibration signal of the mold was measured and analyzed to monitoring the process time and characteristics during injection molding. A 5 inch light guide plate mold was used to injection molding and the vibration signal was measured by MPU6050 acceleration sensor module attached the surface of fixed mold base. Conditions except for injection speed and packing pressure were set to the same value and the change of the vibration signal of the mold according to injection speed and packing pressure was analyzed. As a result, the vibration signal had a large change at three points: "Injection start", "V/P switchover", and "Packing end". The time difference between "injection start" and "V/P switchover" means the injection time in the injection molding process, and the time difference between "V/P switchover" and "Packing end" means the packing time. When the injection time and packing time obtained from the vibration signal of the mold are compared with the time recorded in the injection molding machine, the error of the injection time was 2.19±0.69% and the error of the packing time was 1.39±0.83%, which was the same level as the actual value. Additionally, the amplitude at the time of "injection start" increased as the injection speed increased. In "V/P switchover", the amplitude tended to be proportional to the pressure difference between the maximum injection pressure and the packing pressure and the amplitude at the "packing end" tended to the pressure difference between the packing pressure and the back pressure. Therefore, based on the result of this study, the injection time and packing time of each cycle can be monitored by measuring the vibration signal of the mold. Also, it was confirmed that the level and trend of process variables such as the injection speed, maximum injection pressure, and packing pressure can be evaluated as the change of the mold vibration during injection molding.

Surface roughness and $Candida$ $albicans$ adhesion to flexible denture base according to various polishing methods (연마방법에 따른 탄성의치의 표면거칠기와 $Candida$ $albicans$의 부착율 변화)

  • Oh, Ju-Won;Seo, Jae-Min;Ahn, Seung-Keun;Park, Ju-Mi;Kang, Cheol-Kyun;Song, Kwang-Yeob
    • The Journal of Korean Academy of Prosthodontics
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    • v.50 no.2
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    • pp.106-111
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    • 2012
  • Purpose: The purpose of this study was to compare the effect of 3 chairside polishing methods and laboratory polishing methods on surface roughness and $C.$ $albicans$ adhesion of polyamide denture base. Materials and methods: Using contact profilometer, the surface of polyamide specimens ($25{\times}15{\times}2mm$) was studied after conventional polishing without finishing and after chiarside polishing with 2 chiarside polishing kits and chairside-pumice polishing following finishing with tungsten carbide bur. To evaluate the adhesion of $C.$ $albicans$, $C.$ $albicans$ suspension was overlayed on the test specimen. And the specimens were incubated for 2 hours. Imprint culture method was achieved and counted the colony on the agar plate. Polished polyamide were evaluated using a scanning electron microscope. The statistics were conducted using one-way ANOVA and in case of difference, Scheffe test and Tamhane's T2 test were used. Results: Surface roughness (Ra) of surfaces polished with 2 chairside polishing kits had higher than conventional polishing and pumice polishing. The highest roughness value was $0.32{\pm}0.10{\mu}m$, and the lowest was $0.02{\pm}0.00{\mu}m$. The adhesion of $C.$ $albicans$ on the specimens polished with chairside polishing group and pumice polishing group were increased than conventional polishing group ($P$<.01). Conclusion: Conventional laboratory polishing was found to produce the smoothest surface and the lowest adhesion of $C.$ $albicans$. Two groups polished with Chairside polishing kits were similar with respect to surface roughness. Surface of the specimen polished with pumice is significantly smoother than 2 chairside polishing groups, but the result of $C.$ $albicans$ adhesion is that group polished with pumice was similar with 2 chairside polishing groups ($P$>.01).

Folding Analysis of Paper Structure and Estimation of Optimal Collision Conditions for Reversal (종이구조물의 접기해석과 반전을 위한 최적충돌조건의 산정)

  • Gye-Hee Lee
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.36 no.4
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    • pp.213-220
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    • 2023
  • This paper presents a model simulating the folding process and collision dynamics of "ddakji", a traditional Korean game played using paper tiles (which are also referred to as ddakji). The model uses two A4 sheets as the base materials for ddakji. The folding process involves a series of boundary conditions that transform the wing part of the paper structure into a twisted configuration. A rigid plate boundary condition is also adopted for squeezing, establishing the shape and stress state of the game-ready ddakji through dynamic relaxation analysis. The gaming process analysis involves a forced displacement of the striking ddakji to a predetermined collision position. Collision analysis then follows at a given speed, with the objective of overturning the struck ddakji--a winning condition. A genetic algorithm-based optimization analysis identifies the optimal collision conditions that result in the overturning of the struck ddakji. For efficiency, the collision analysis is divided into two stages, with the second stage carried out only if the first stage predicts a possible overturn. The fitness function for the genetic algorithm during the first stage is the direction cosine of the struck ddakji, whereas in the second stage, it is the inverse of the speed, thus targeting the lowest overall collision speed. Consequently, this analysis provides optimal collision conditions for various compression thicknesses.