• Title/Summary/Keyword: Barrier film

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Thin film permeation barrier for OLED using HDP-CVD (HDP-CVD를 이용한 OLED용 수분침투 방지막에 대한 연구)

  • Gim, T.J.;Shin, P.K.;Choi, Y.;Lee, B.J.;Kim, B.S.;Lee, B.S.;Choi, C.R.
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1398-1399
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    • 2006
  • 현재 상용화된 OLED 소자는 최대 단점인 수분 취약성의 원인으로 top emission과 flexible 타입으로 제조되는데 장애가 되고 있다. 따라서 top emission 방식과 flexible한 소자를 실현하기 위해 수분 및 산소 침투를 방지하기 위한 유전체 막의 실험이 진행되고 있는데, 본 실험에서는 기존의 PECVD보다 plasma의 density가 높은 HDP(High Density Plasma)-CVD를 사용해 SiOx 및 SiNx 유전체 film을 증착하였고 MOCON 테스트를 통한 수분침투 방지막으로써의 가능성을 검증하였다.

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Characterization of Superconducting Multi-layer Thin Films (초전도 다층박막의 특성 해석)

  • 이현수;한태희;임성훈;고석철;두호익;한병성
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.243-246
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    • 2000
  • The sputtering systems mainly consist of the three-target holder. The target and substrate were the on-axis type. The MgO and STO substrate were used for the deposition of each layer. The optimum conditions of single-layer thin film were investigated from the SEM images and the XRD patterns. Based on the above conditions, the multi-layer thin films such as YBaCuO/LaGaO/Au/Nb and YBaCuO/Au/Nb were fabricated. The crystalline, the electrical Properties, the energy gap structure and the characteristics of the tunneling barrier on the multi-layer thin film have been investigated and characterized.

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Hydrogenation of ZnO:Al Thin Films Using Hot Filament

  • An, Il-Sin;Kim, Ok-Kyung;Lee, Chang-Hyo;Ahn, You-Shin
    • Journal of Korean Vacuum Science & Technology
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    • v.4 no.3
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    • pp.86-90
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    • 2000
  • ZnO : Al films were prepared through the optimization process of aluminum content and substrate temperature in rf-magnetron sputtering. When hydrogenation was performed on these films using a hot filament method, all films showed improvement in conductivity although more conductive film showed less improvement. When the substrate temperature ($T_H$) was varied from $25^{\circ}C\;to\;300^{\circ}C$ during hydrogenation, the resistivity was reduced more at higher $T_H$ (more than 30% at $T_H=300^{\circ}C$) Thus, two methods were developed to suppress the dehydrogenation in ZnO : Al films : (1) capping with amorphous silicon thin film as a diffusion barrier, and (2) cooling during hydrogenation.

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Magnetoresistance Characteristics due to the Schottky Contact of Zinc Tin Oixide Thin Films (ZTO 박막의 쇼키접합에 기인하는 자기저항특성)

  • Li, XiangJiang;Oh, Teresa
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.4
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    • pp.120-123
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    • 2019
  • The effect of surface plasmon on ZTO thin films was investigated. The phenomenon of depletion occurring in the interface of the ZTO thin film created a potential barrier and the dielectric layer of the depletion formed a non-mass particle called plasmon. ZTO thin film represents n-type semiconductor features, and surface current by plasma has been able to obtain the effect of improving electrical efficiency as a result of high current at positive voltage and low current at negative voltage. It can be seen that the reduction of electric charge due to recombination of electronic hole pairs by heat treatment of compound semiconductors induces higher surface current in semiconductor devices.

A Study on the Electrical Characteristics of Oxide Grown from Phosphorus-Doped Polysilicon (인 도핑 다결정 실리콘 산화막의 전기적 특성에 관한 연구)

  • Yoon, Hyung Sup;Kang, Sang Won;Park, Sin Chong
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.23 no.6
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    • pp.814-819
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    • 1986
  • In this work the electrical conduction and breakdown properties of thermal oxides grown on phosphorus-doped polysilicon have been investigated by using ramped I-V measurements. The oxide films, grown from phosphorus-doped polysilicon deposited at 560\ulcorner, have higher breakdown field(6.8MV/cm) and lower leakage current than those deposited at 625\ulcorner. Also the effective energy barrier height(\ulcorner)calculated from the Fowler-Nordheim curve of polyoxide was 0.76eV for 560\ulcorner deposited film and 0.64eV for 625\ulcorner deposited film.

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Optimization of polymer substrate's surface treatment for improvement of transparent conducting oxide thin film (투명전도막의 특성향상을 위한 기판 표면처리법의 최적화)

  • Choi, Woo-Jin;Kim, Ji-Hoon;Jung, Ki-Young;Darma, Jessie;Choo, Young-Bae;Sung, Youl-Moon;Kwak, Dong-Joo
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1425_1426
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    • 2009
  • In this study, commercially available polyethylene terephthalate(PET), which is widely used as a substrate of flexible electronic devices, was modified by dielectric barrier discharge(DBD) method in an air condition at atmospheric pressure, and aluminium - doped zinc oxide (ZnO:Al) transparent conducting film was deposited on PET substrate by r. f. magnetron sputtering method. Surface analysis and characterization of the plasma-treated PET substrate was carried out using contact angle measurements, X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscopy (AFM). Especially the effect of surface state of PET substrate on some important properties of ZnO:Al transparent conducting film such as electrical and morphological properties and deposition rate of the film, was studied experimentally. The results showed that the contact angle of water on PET film was reduced significantly from $62^{\circ}$ to $43^{\circ}$ by DBD surface treatment at 20 min. of treatment time. The plasma treatment also improved the deposition rate and electrical properties. The deposition rate was increased almost linearly with surface treatment time. The lowest electrical resistivity as low as $4.97{\times}10^{-3}[\Omega-cm]$ and the highest deposition rate of 234[${\AA}m$/min] were obtained in ZnO:Al film with surface treatment time of 5min. and 20min., respectively.

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대기압 플라즈마 표면 처리를 이용한 금속과 폴리이미드 필름의 접촉력 향상에 관한 연구

  • O, Jong-Sik;Park, Jae-Beom;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.264-264
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    • 2011
  • Poly [(N, N'-oxydiphenylene) pyromellitimide], polyimide (PI) film은 기계적 강도가 매우 우수하고 열적, 화학적 안정성이 뛰어난 재료로서 전자제품의 소형화, 경령화, 고성능화를 위한 차세대 flexible electronic device에 적용하기 위하여 많은 연구가 진행되고 있다. 그러나 PI의 특성상, 매우 낮은 표면에너지로 인해 금속과의 접촉력이 좋지 않은 단점을 가지고 있다. 본 연구에서는, 금속박막과 PI film 과의 접촉력을 증가시키기 위해 remote-type modified dielectric barrier discharge (DBD) module을 이용하여 대기압 플라즈마 표면처리를 하였다. 실험에 사용된 gas composition은 각각 $N_2$/ He/ $SF_6$, $N_2$/ He/ $O_2$, $N_2$/ He/ $SF_6$/ $O_2$, $N_2$/ He/ $SF_6$/ $O_2$ 이다. $N_2$/ He/ $SF_6$/ $O_2$ gas composition을 이용하여 PI 표면을 플라즈마 처리한 경우, C=O 결합이 PI film 위에 생성됨으로써, 접촉각이 매우 낮게 형성됨을 관찰할 수 있었다. 이와는 반대로 $N_2$/ He/ $SF_6$ gas composition 을 사용하였을 경우에는 C-Fx 화학적 결합이 생성되기 때문에 가장 높은 접촉각이 형성됨을 관찰할 수 있었다. 특히, $N_2$ (40 slm)/ He (1 slm)/ $SF_6$ (1.2 slm) gas composition에 $O_2$ gas를 0.2 slm부터 1.0 slm까지 변화시켜가며 PI film 표면을 처리한 결과, $O_2$ gas를 0.9 slm 첨가하였을 때, 가장 낮은 $9.3^{\circ}$의 접촉각을 얻을 수 있었다. 이는 0.9 slm의 $O_2$ gas를 첨가하였을 때, 가장 많은 양의 $O_2$ radical이 생성되기 때문에 많은 양의 C=O 결합이 생성되기 때문이다. 최적화된 $N_2$ (40 slm)/ He (1 slm)/ $SF_6$ (1.2 slm)/ $O_2$ (0.9 slm) gas composition 조건에서 Ag film과 PI film과의 접촉력을 관찰할 결과, 111 gf/mm를 얻을 수 있었다.

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Effects of lead metal and annealing methods on low resistance contact formation of polycrystalline CdTe thin film (다결정 CdTe박막의 저저항 접축을 위한 배선금속 및 열처리방법의 효과에 관한 연구)

  • 김현수;이주훈;염근영
    • Electrical & Electronic Materials
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    • v.8 no.5
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    • pp.619-625
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    • 1995
  • Polycrystalline CdTe thin film has been studied for photovoltaic application due to the 1.45 eV band gap energy ideal for solar energy conversion and high absorption coefficient. The formation of low resistance contact to p-CdTe is difficult because of large work function(>5.5eV). Common methods for ohmic contact to p-CdTe are to form a p+ region under the contact by in-diffusion of contact material to reduce the barrier height and modify a p-CdTe surface layer using chemical treatment. In this study, the surface chemical treatment of p CdTe was carried out by H$\_$3/PO$\_$4/+HNO$\_$3/ or K$\_$2/Cr$\_$2/O$\_$7/+H$\_$2/SO$\_$4/ solution to provide a Te-rich surface. And various thin film contact materials such as Cu, Au, and Cu/Au were deposited by E-beam evaporation to form ohmic contact to p-CdTe. After the metallization, post annealing was performed by oven heat treatment at 150.deg. C or by RTA(Rapid Thermal Annealing) at 250-350.deg. C. Surface chemical treatments of p-CdTe thin film improved metal/p-CdTe interface properties and post heat treatment resulted in low contact resistivity to p-CdTe.Of the various contact metal, Cu/Au and Cu show low contact resistance after oven and RTA post-heat treatments, respectively.

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Structural and electrical characteristics of IZO thin films deposited under different ambient gases (분위기 가스에 따른 IZO 박막의 구조적 및 전기적 특성)

  • Lee, Yu-Lim;Lee, Kyu-Mann
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.3
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    • pp.53-58
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    • 2010
  • In this study, we have investigated the effect of the ambient gases on the characteristics of IZO thin films for the OLED (organic light emitting diodes) devices. For this purpose, IZO thin films were deposited by RF magnetron sputtering under various ambient gases (Ar, $Ar+O_2$ and $Ar+H_2$) at $150^{\circ}C$. In order to investigate the influences of the oxygen and hydrogen, the flow rate of oxygen and hydrogen in argon mixing gas has been changed from 0.1sccm to 0.5sccm, respectively. All the samples show amorphous structure regardless of ambient gases. The electrical resistivity of IZO film increased with increasing flow rate of $O_2$ under $Ar+O_2$ while under $Ar+H_2$ atmosphere the electrical resistivity showed minimum value near 0.5sccm of $H_2$. All the films showed the average transmittance over 85% in the visible range. The OLED device was fabricated with different IZO substrates made by configuration of IZO/${\alpha}$-NPD/DPVB/$Alq_3$/LiF/Al to elucidate the performance of IZO substrate. OLED devices with the amorphous-IZO (a-IZO) anode film show better current densityvoltage-luminance characteristics than that of OLED devices with the commercial crystalline-ITO (c-ITO) anode film. It can be explained that very flat surface roughness and high work function of a-IZO anode film lead to more efficient hole injection by reduction of interface barrier height between anode and organic layers. This suggests that a-IZO film is a promising anode materials substituting conventional c-ITO anode in OLED devices.

On Formation of Residual Carbon Layer in CuInSe2 Thin Films Formed via direct Solution Coating Process (직접 용액 코팅법에 의해 제조한 CuInSe2 에 잔존하는 탄소 불순물층 형성에 관한 연구)

  • Ahn, SeJin;Rehan, Shanza;Eo, Young-Joo;Gwak, Jihye;Yoon, Kyunghoon;Cho, Ara
    • Current Photovoltaic Research
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    • v.2 no.1
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    • pp.36-39
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    • 2014
  • Formation mechanism of residual carbon layer, frequently observed in the $CuInSe_2$ (CIS) thin film prepared by direct solution coating routes, was investigated in order to find a way to eliminate it. As a model system, a methanol solution with dissolved Cu and In salts, whose viscosity was adjusted by adding ethylcellulose (EC), was chosen. It was found that a double layer, a top metal ion-derived film and bottom EC-derived layer, formed during an air drying step presumably due to different solubility between metal salts and EC in methanol. Consequently, the top metal ion-derived film acts as a barrier layer inhibiting further thermal decomposition of underlying EC, resulting a formation of bottom carbon residue layer.