• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.3
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• pp.109-115
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• 2019

The purpose of this study was to analyze and test the flow rate of a 1-inch ball valve used in a thermal power plant. To identify the flow-rate characteristics, numerical analysis was conducted and an experimental apparatus of the valve flow rate coefficient was used to compare the flow coefficient Cv values. To determine the internal pressure distribution, the sites of opening ball valves and flow fields were investigated. In particular, a smaller the valve opening resulted in a more complicated the flow field of the ball. The valve flow characteristic test showed that the Cv value and flow rate increased with increasing valve-opening rate and the secondary function was performed. The pressure drop increased as the valve opening rate decreased. In addition, the experimental results for the flow analysis are similar to the numerical analysis results.

• Particle and aerosol research
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• v.15 no.4
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• pp.173-182
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• 2019

Since airborne viruses have been known to aggravate indoor air quality, studies on the development of anti-viral air filter increase recently. In this study, the pressure drop and anti-viral efficiency of TiO₂ coated ceramic ball filter were evaluated. After the filter being inserted into a commercial room air cleaner, chamber test with aerosolized bacteriophage MS2 was performed. The porosity of TiO₂ coated ceramic ball filter was 0.85, and pressure drop was about 13 Pa for 1 m/s of air velocity. The anti-viral efficiency was about 93% when the reaction time was 25 minutes in a 1 ㎥ chamber.

• Journal of Korean Ophthalmic Optics Society
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• v.16 no.3
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• pp.229-235
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• 2011

Purpose: The present study was performed to evaluate the safety of ophthalmic lenses in domestic market since eyeglasses wearers could be exposed to the negligent accident by damaged ophthalmic lenses. Method: Totally, 160 ophthalmic lenses (NK55, ${n_{d}}$ = 1.56) with the refractive powers of -3D, -6D, +3D, +6D manufactured by 4 companies in domestic market were evaluated using drop ball test. In accordance with FDA standard, steel ball (~16 g) was freely dropped on these ophthalmic lenses from 127 cm high and the surfaces of lenses were observed. Results: From the study, center thicknesses of NK55 ophthalmic lenses manufactured by 4 different companies showed somewhat different numbers even though the lenses had the same refractive index and powers. All convex lenses of +3D, +6D were evaluated as the safe lenses since there was no damage such as crack and broken found on the lens surfaces after drop ball testing. However, some noticeable broken was shown on the surfaces of concave lenses with relatively thinner center thickness. Especially, 59(73.8%) of total 80 concave lenses with the refractive power of -3D and -6D classified as unacceptable lenses to FDA standard. Conclusions: From the results, the negligent accident by damaged ophthalmic lenses should be considered as well as the correction of visual acuity, design and price when customers purchase eyeglasses. Thus, the enforcement regulation like drop ball testing of uncut ophthalmic lens could be suggested to guarantee the safety of ophthalmic lenses in domestic market.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• Tribology and Lubricants
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• v.27 no.3
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• pp.140-146
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• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Journal of Welding and Joining
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• v.5 no.1
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• pp.57-63
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• 1987

A method which can be used for evaluating slag detachability is proposed in this study. The proposed method was intended to get an absolute value for slag detachability, to give consistent value for a given welded joint, and finally to be simple to test. With a test fig made in this study, an impact by dropping a steel ball (13Kg in weight) is applied on the back side of an as-welded plate having a slag layer on the weld bead. Such impact applied forces the slag to drop off from the bead surface. In order to make a quantitative evaluation the amount of slag removed was measured with increasing the number of drops. Using this method six kinds of fluxes were evaluated in terms of the effects of flux type, basicity and weding variables on the slag detachability. As an initial result of this test, it was found that welding heat input affects the detachability significantly. Most importantly the evaluation made using the presently proposed method gives the same order of ranking as that of the actual practice done by a welder.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1552-1557
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• 2004

Characteristics diffusion time of viscoelastic fluids are determined experimental results of terminal velocity by using the falling ball viscometer. The characteristics diffusion time of viscoelastic fluids are determined with help of the sphere device which is installed to return the dropped sphere from the bottom of the test cylinder without disturbing the working fluids. Terminal velocity of th sphere the reason why experimental of characteristics diffusion time that it is have an effect on the time interval of the measuring. Viscous of the fluid the temperature changed in order to have an effect on temperature and terminal velocity of the ball it becomes larger the possibility of knowing. A result of visualization for flow phenomena of around the sphere uses the PIV and the density of the polymer solution which it appears 2000wppm is to a case which is the right and left becomes symmetry to be it will be able to confirm and according to the time interval, to observed velocity vector of same at first drop the sphere.