• Journal of Welding and Joining
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• 제8권3호
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• pp.31-38
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• 1990

The bonding mechanism and bond strength were investigated for the cold pressure welding of Al to Al, Cu to Cu and Al to Cu by upsetting. A phenomenon of bonding betweenthe metallic components has been observed by a scanning electron microscope and metallurgical microscope. A modified equation for bond strength with respect to the reduction of height shows reasonably a good agreement with the experimental data. When the values of the hardening factor and threshold deformation for the given materials could be determined, the theoretical bond strength can be calculated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.447-450
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• 2001

Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

• 한국콘텐츠학회논문지
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• 제10권10호
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• pp.219-225
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• 2010

티타늄 표면처리방법 중 gold 코팅, TiN 코팅, 그리고 전용결합재를 복합적으로 사용하여 티타늄과 세라믹의 결합강도에 미치는 영향을 분석하고자 하였다. 티타늄과 세라믹의 3점 굽힘 결합강도를 측정한 결과, TiN 코팅과 전용결합재로 처리한 SPTB군이 $72.20({\pm}5.25)MPa$로 가장 높게 나타났으며, 전용결합재로 처리한 SPB군($67.66({\pm}12.10)MPa$), gold 코팅과 전용결합재로 처리한 SPGB군($46.95({\pm}12.48)MPa$), 코팅과 전용결합재로 처리하지 않은 SP군$(43.80({\pm}5.12)MPa)$ 순으로 나타났다. 시편들의 결합강도를 통계 분석한 결과, 전용 결합재로 처리한 SPB군과 TiN코팅과 전용결합재로 처리한 SPTB군이 결합력이 유사하게 나타났으며, 전용결합재로 처리한 군(SPB)이 처리하기 않은 군(SP)에 비하여 결합력이 높게 나타났으며, TiN 코팅한 군(SPTB)이 gold 코팅한 군(SPGB)에 비하여 결합력이 높게 나타난 것으로 관찰되었다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1993년도 가을 학술발표회 논문집
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• pp.35-38
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• 1993

Although bonding material content of the high strength flowing concrete is very important in engineering properties, in rich mix concrete increasing the bonding material content may not follow more good properties. This study is to investigate the influence of the bonding material content affecting on the engineering properties of high strength flowing concrete, and this paper is to analyze the properties of hardened concrete. The results reveal that the strength of concrete having loss bonding material content is higher than that of concrete having more bonding material content, and that in proportion to increasing of concrete strength brittleness factors decrease, and that the static modulus of elasticity in this study is less than that in specification.

• 대한치과보철학회지
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• 제30권1호
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• pp.85-91
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• 1992

The purpose of this study was to evaluate the bonding strength between porcelain laminate and Ni-Cr alloy in the various surface treatments of the bonding faces. For this study the metal surface of specimens were treated : 1) etching only, 2) sandblasting only, and 3) sandblasting and etching. The porcelain laminate were made and bonded to the metal specimens with light curing composite resin cement. Instron testing machine was used to measure their bonding strength : and the result was obtained as follows : 1. The bonding strength of the double treatment of the sandblasting and etching group was higher than that of the single treatment of sandblasting or the etching group. 2. The bonding strength of the sand blasting group was higher than that of the etching group. 3. The debonding were mainly occurred between the Ni-Cr alloy and the composite resin cement.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.370-373
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• 1999

Si direct bonding (SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on- pre treatment conditions in Si wafer direct bonding, The paper resents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, applied pressure and annealing temperature(200~ 100$0^{\circ}C$) after pre-bonding. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively, Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding(Min 2.4kgf/$\textrm{cm}^2$~ Max : 14.kgf/$\textrm{cm}^2$)

• 한국전기전자재료학회논문지
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• 제23권1호
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• pp.29-33
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• 2010

As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2020년도 가을 학술논문 발표대회
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• pp.153-154
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• 2020

This study aims to find out the reason that tile adhesive(type III) for ceramic tile does not harden under some conditions especially high humidity even though long curing time. Bonding strength of adhesive between substrate and ceramic tile is evaluated depending on bonding conditions such as substrate kind(concrete, board), bonding material (tile adhesive, tile cement) and curing condition(humidity 50, 70%). Based on the results, this study aimed to establish the quality of tile adhesion strength under the relevant conditions.

• 대한치과기공학회지
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• 제39권3호
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• pp.153-159
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• 2017

Purpose: In this study, a corresponding porcelain coating material was applied to dental Co-Cr metal among PFM. Methods: The bonding strength of the fired specimens was measured by a three-point flexural rigidity test. SEM/EDS was used to observe the surface component of specimens. Results: First, All groups were higher than the minimum bonding strength of 25 MPa specified in ISO 9693 for dental metal-ceramics specimens. Second, The bonding strength of control group(WO) is 44.64 MPa. Experimental group DM was 35.45 MPa and DP was 31.82 MPa(P<0.05). Tukey's HSD tests results have shown that the bonding strength in control group(WO) is higher than that of experimental group(DM, DP). Third, In the case of metal - porcelain bonding strength, the application of opaque porcelain and firing were higher than those of the group treated with degassing process. Conclusion: The bonding strength was higher when the powder opaque porcelain was applied than the paste opaque porcelain.

• 한국안전학회지
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• 제7권3호
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• pp.99-107
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• 1992

Weld bonding can be applied as a combined method of spot welding and adhesive to have more advantages than those. Weld bonding has many merits that enlarge the fatigue strength of spot Welding and also improve the creep of adhesive. But it has not beer proved well in the various environmental conditions. In this study, weld bonding test for fatigue properties and tensile strength is presented under such various coditions as temperatures, humidity, and etc.