• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.6
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• pp.1003-1009
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• 2013

This paper presents a simple procedure to obtain the instantaneous cutting force constants needed to predict milling forces. Cutting force data measured in a series of slot milling tests were used to determine the cutting force constants at different feed rates. The values of the cutting force constants were determined directly at the tool rotation angle that maximized the uncut chip thickness. Then, the instantaneous cutting force constant was obtained as a function of the instantaneous uncut chip thickness. This approach can greatly enhance the accuracy of the mechanistic cutting force model for end milling. In addition, the influences of several cutting parameters on the cutting forces, such as the tool helix angle and axial depth of cut, were discussed.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.487-490
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• 1998

During driving an automobile, drivers push the clutch and transmit gear by their feeling. At the automobile which have the manually operated gear box by using apart designed equipment, for get the semi-auto function, a lot of research to realize the system which have passive transmission and automotive transmission has developed. In this paper, basically using one chip .mu.-comcontrolled the clutch of automobile by means of LPF, F/V converter and TR driver circuit which is designed. In the past, it was controlled the motor by operating relay which is int eh output system to control the clutch. This system some noises is made by on and off the relay, lessen the motor speed and causes many error due to consume the large power on driving the motor. In this paper, to solve these problems the output TR is operated by using one chip .mu.-com decrease the electic power consumption and designed the actuator to control the clutch by measns of vacuum.

• Journal of the korean Society of Automotive Engineers
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• v.14 no.6
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• pp.105-112
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• 1992

The turning tests with sintered carbide tools have been conducted on typical high strength SSW2 railway wheel steel and its machinability were examined in terms of the cutting resistance, the roughness of turning surface, the chip disposal and others. Some results obtained in this paper are as follows: (1) The cutting resistance is not affected by the cutting speed (in this paper these were 23-78 m/min). (2) The roughness of finished surface is found to be largely dependent on cutting conditions and tool geometry. (3) There exists the explicit relates between the tool geometry cutting conditions (cutting speed, feedrate, and depth of cut) and independent variables(cutting resistance, surface roughness) are derived.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• Journal of the korean Society of Automotive Engineers
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• v.9 no.2
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• pp.47-57
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• 1987

The objective of this study is to establish the comprehensive analytical relationship between acoustic emission and fundamental parameters of the orthogonal cutting process. The sources of acoustic emission in the orthogonal metal cutting process was identified as deformation in the shear zone and sliding friction at the chip-tool interface. The validity of this relationship is evaluated by a series of tests varing cutting speed and rake angle for A16063 tube. Strong dependence of the RMS voltage of acoustic emission on cutting speed and rake angle was observed. It was also found that the percentage contribution of AE energy at each zone for the total AE activity is constant in accordance with the change of cutting speed. The relationship between the RMS of acoustic emission and the fundamental cutting parameters was modified in order to be utilized independent of rake angle.

• Transactions on Electrical and Electronic Materials
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• v.11 no.4
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• pp.178-181
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• 2010

An automotive IC voltage regulator which consists of one-chip based on a metal-oxide semiconductor field effect transistor (MOSFET) is investigated experimentally with three types of packaging. The closed type is filled with thermal silicone gel and covered with a plastic lid on the MOSFET. The half-closed type is covered with a plastic case but without thermal silicone gel on the MOSFET. Opened type is no lid without thermal silicone gel. In order to simulate the high temperature condition in engine bay, the operating circuit of the MOSFET is constructed and the surrounding temperature is maintained at $100^{\circ}C$. In the overshoot the maximum was mainly found at the half-closed packaging and the magnitude is dependent on the packaging type and the surrounding temperature. Also the impressed current decreased exponentially during the MOSFET operation.

• ETRI Journal
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• v.41 no.2
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• pp.262-269
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• 2019

This paper introduces a low-cost, high-performance mmWave antenna array module at 77 GHz. Conventional waveguide transitions have been replaced by 3D CPW-microstrip transitions which are much simpler to realize. They are compatible with low-cost substrate fabrication processes, allowing easy integration of ICs in 3D multi-chip modules. An antenna array is designed and implemented using multilayer coupled-fed patch antenna technology. The proposed $16{\times}16$ array antenna has a fractional bandwidth of 8.4% (6.5 GHz) and a 23.6-dBi realized gain at 77 GHz.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.25-31
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• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• Journal of the Korea Convergence Society
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• v.9 no.2
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• pp.1-6
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• 2018

In this study, the investigation results of conducted and radiated emission for DC/DC converter circuit applied in electric vehicles are presented. A frequency spreading circuit was used to improve the EMI characteristics of a power converter designed by using MPQ4433 chip. The frequency spreading circuit using a TLV3201 chip was designed and applied to the power converter. A PCB was fabricated based on the EMI minimization procedures and simulated and measured results were presented for the far-field and near-field conducted and radiated emissions using the fabricated circuit. The measurement were done as CISPR 25 standardized test procedures. It is clearly showed that the EMI characteristics were improved 20% in case frequency spreading was applied. The EMI reduction technique using the frequency spreading proposed in this study was first applied to the design of power converter module for automobile. It is expected that the method presented here can be effectively used for EMI improvement in the future.

• Journal of IKEEE
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• v.25 no.4
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• pp.591-597
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• 2021

This paper proposes an EMC-aware PCB design method to reduce electromagnetic emission, where trace length and teturn path of critical signal are shortened by changing chip location and trace layout on the PCB, while additional filters or decoupling capacitors are not required. In the proposed method, signal velocity is calculated for various signals on the PCB. Critical signal with the fastest signal velocity is determined and its return path is shortened as much as possible by placing chip location and trace routing first. Return path of critical signal should be carefully designed not to have discontinuity. Power plane and ground plane should be carefully designed not to be divided, since these planes are the reference of return path. The proposed method was applied to automotive directional Bluetooth speaker which failed to pass CISPR 32 and CISPR 25 EMC tests. Its PCB was redesigned based on the proposed method and it easily passed the EMC tests. The proposed method is useful to EMC-sensitive electronic equipments.