• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.83-83
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• 1999

본 연구에서는 Auger Elecrtron Spectroscopy (AES) 장비를 이용하여 Silicone Wafer 표면에 BF 이온을 주입시킨 후 Dopping 농도 및 Implantation 에너지에 따른 Si KLL Peak의 변화를 관찰하였다. 또한 PVD Ti 계열 화학물의 시료에 대하여 Peak의 Shape 변화를 관찰하였다. 1)Dopping 농도 및 Implantation 에너지에 따른 Si KLL Peak의 변화 관찰 일반적으로 Silicone 기판에 Arsenic(3가)을 Dopping 하였을 경우, Si KLL Peak의 Kinetic Energy 값은 순수 Si Peak보다 더 작은 값으로 Shift 하며, Boron (5가)을 Dopping하였을 경우에는 더 큰 값으로 Shift 한다. 이론적으로 N-type Si의 에너지 차이는 약 1.0eV로 보고되어 있으며, AES를 이용하여 실험적으로 측정된 값은 약 0.6eV정도로 알려져 있다. 이러한 차이는 Dopping 농도에 따라 Valance Band의 에너지 값이 변화하기 때문이라고 알려져 있다. 본 연구에서는 BF2를 Si에 이온 주입하여 입사 에너지 및 dose 량에 따른 Si KLL Peak의 변화를 관찰하였다. 그림1과 같이 Si KLL Peak는 Implantation Energy가 작을수록 Kinetic Energy가 높은 곳으로 Shift 한다. 이는 LOw Energy로 이온 주입하면, Projected Range (Rp)가 High Energy로 이온 주입할 때보다 작기 때문이며, 이 결과를 Secondary Ion Mass Spectroscopy (SIMS) 및 TRIM simulation을 이용하여 확인하였다. 또한 표면에서의 전자 Density의 변화와 Implantation energy와의 관계를 시료의 표면에서 반사되어 나오는 전자의 에너지 손실(Reflected Electron Energy Loss Spectroscopy:REELS)을 통하여 고찰하였다. 2) PVD Ti 계열화합물의 시료에 대한 peak의 shape 가 변화하며, TiL3M23V (Ti2) 및 TiL3M23M23 (Til) Peak의 Intensity Ratio가 변화한다. 따라서 본 연구에서는 그림 2와 같이 Ti 결합 화합물에서의 Ti Auger Peak의 특성 에너지 값과 Peak Shape를 관찰하여, AES를 이용하여 Ti 계열의 화합물에 대한 Chemical state 분석의 가능성을 평가하였다.

• Journal of the Korean Vacuum Society
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• v.11 no.3
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• pp.171-175
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• 2002

The change in work function was studied on Indium-Tin-Oxide(ITO) surface after O-plasma treatment using $\gamma$-Focused ion Beam($\gamma$-FIB). As the surface of ITO experienced more O-plasma treatment, both the surface resistivity and the work function got higher. Auger Electron Spectroscopy identified the increase of oxygen as well as the decrease of Sn. The rise of work function and surface resistivity is considered to be due to the change in oxygen and Sn on the surface of ITO.

• Journal of the Korean Vacuum Society
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• v.2 no.2
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• pp.145-151
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• 1993

Ultra High Vacuum chamber for surface analysis and a series of AES-LEED controllers for LEED optics was designed and constructed. Electron energy resolution of LEED optics was tested. On the basis of the layer by layer mode, thickness of evaporated Ni on Pt(111) was calculated from the Auger signal ratio.

• Journal of Korean Ophthalmic Optics Society
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• v.11 no.2
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• pp.115-119
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• 2006

Electromagnetic shielding, transparent ITO coating layers have deposited on ocular lens substrate by magnetron sputtering. We investigated the effect induced by the substrate temperature on coating layer. The characteristics of the coating layers were analyzed using surface profiler, four-point probe, XRD, spectrophotometer and Auger Electron spectroscopy. As substrate temperature became higher, carrier concentration was increased and transmittance in the visible region was increased, too.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2001.10a
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• pp.656-659
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• 2001

Recently, as device techniques are advancing and its size become smaller, the hot carriers transport analysis has more important. Impact ionization(I.I.) effect is electron-hole pair generation process by the dispersion of hot carrier in the contrast with Auger process. Complete I.I. model is essential to simulate and analysis the device transport characteristics. In the study, we will try to analysis I.I. models using Monte Carlo simulator, TCAD and Micro-Tec and present more accurate I.I. model.

• Journal of IKEEE
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• v.6 no.2 s.11
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• pp.119-127
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• 2002

An algorithm for analyzing the characteristics of the power BJT using numerical analysis method is proposed. The Fermi-Dirac statistics is used to calculate the carrier concentration in highly doped region. Philips Unified mobility model, SRH model and Auger model is used to calculate the recombination current of base region. To verify the accuracy of the proposed method, the collector current of BANDIS is compared with the measured data in the condition of the base current increased from $1.0[{\mu}A]\;to\;3.5[{\mu}A]$. The collector current of BANDIS show a maximum relative error within 8.9% compared with the measured data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.403-403
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• 2008

This article reports changes in the mechanical properties of chromium steel after nitrogen implantation at high temperature. The samples are implanted with 120keV N-ion at doses ranging from $1\times1080$ to $4\times1080ions/cm^2$ and at substrate temperature ranging from 25 to $400^{\circ}C$. Nano-hardness and AES(Auger electrons spectroscopy) were measured from nitrogen ion implanted layer. The sliding wear and impact wear properties of the implanted samples were also measured. The results revealed that the hardness and mechanical properties of ion implanted samples depend strongly on the ion doses and implantation temperature. The hardness of the nitrogen implanted sample with 120keV, $4\times10^{18}ions/cm^2$, $335^{\circ}C$ was measured to be approximately 20 GPa, which is approximately 5 times higher than that of un-implanted sample (H=3.8 GPa). Also, the sliding wear and impact wear properties of nitrogen implanted samples were greatly improved. Detailed experiment results will be presented.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.581-584
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• 1998

TiN thin films were grown on (100) Si substrate by atomic layer epitaxy at 130 - $240^{\circ}C$ using TEMAT and NH3 as precursors. Reactants were injected into the reactor in sequence of TEMAT precursor vapor pulse, N2 purging gas pulse, NH3 gas pulse and N2 purging gas pulse so that gas-phase reactions could be removed. The films were characterized by means of x-ray diffraction(XRD), 4-point probe, atomic force microscopy(AFM) and auger electron spectroscopy(AES).

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.2
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• pp.71-82
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• 1984

A programme, called BIPOLE, for the numerical analysis of twotimensional n-p-n bipolar transistors was developed. It has included the SRH and Auger recolnbination processes, the mobility dependence on the impurity density and the electric field, and the band-gap narrowing effect. The finite difference equations of the fundamental semiconductor equations are formulated using Newton's method for Poisson's equation and the divergence theorem for the hole and electron continuity equations without physical restrictions. The matrix of the linearized equations is sparse, symmetric M-matrix. For the solution of the linearized equations ICCG method and Gummel's algorithm have been employed. The programme BIPOLE has been applied to various kinds of the steady-state problems of n-p-n transistors. For the examples of applications the variations of common emitter current gain, emitter and diffusion capacitances, and input and output characteristics are calculated. Three-dimensional representations of some D.C. physical quantities such as potential and charge carrier distributions were displayed. This programme will be used for the nome,rical analysis of the distortion phenom ana of two-dimensional n-p-n transistors. The BIPOLE programme is available for everyone.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.2
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• pp.14-19
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• 2011

We have fabricated GaN Schottky barrier diode (SBD) for high-voltage applications on Si substrate. The leakage current and the electrical characteristics of GaN SBD are investigated by annealing metal-semiconductor junctions. Ohmic junctions of Ti/Al/Mo/Au and Schottky junctions of Ni/Au are used in the fabrication. A test structure is proposed to measured buffer leakage current through a mesa structure. When annealing temperature is increased from $700^{\circ}C$ to $800^{\circ}C$, measured buffer leakage current is also increased from 87 nA to 780 nA at the width of 100 ${\mu}m$. The diffusion of Au, Ti, Mo, O into GaN buffer layer increases the leakage current and that is verified by Auger electron spectroscopy. Experimental results show that the low leakage current and the high breakdown voltage of GaN SBD are achieved by annealing metal-semiconductor junctions.