• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• Journal of the Korean Ceramic Society
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• v.13 no.3
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• pp.55-62
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• 1976

순수한 닉켈과 금 박막을 (III)규소 단 결정위에 진공 증착시켰다. Ni/Au/Si나 Au/Ni/Si시료를 진공중에서 약 55$0^{\circ}C$로 가열하였을 때 육방정 혹은 변형된 육방정의 미소 결정들이 규소 기질위에 형성되었다. 이들 미소 결정들의 형성과정 및 조성은 X-선 회절법, scanning electron microscopy 및 scanning Auger microprobe 법을 사용하여 결정하였다. 이들 미소 결정은 NiSi2임이 확인되었다. Ni/Au/Si 시료에서는 Au-Si 공융점(37$0^{\circ}C$) 이상으로 온도가 증가됨에 따라 닉켈과 규소가 Au-Si 공융체 속으로 이동한 후 반응하여 NiSi2를 형성하였다. Au/Ni/Si 시료에 있어서의 Au-Si 공융체 형성은 닉켈 박막에 있는 바늘구멍형의 표면 결함과 관련 지을 수 있겠다. 금이 닉켈 박막의 grain boundary를 통하여 Ni/Si 계면으로 확산되어 그 계면을 습윤시킨 다음 Au-Si 공융체를 형성하였다. 이런 Au-Si 공용체는 닉켈과 규소 원자에 대한 높은 확산 매질로서 작용하여 NiSi2 형성을 촉진시켰다. 표면에 평행한 (III)규소면 위의 NiSi2 미소 결정은 유사한 육방정으로 나타났으며, 경사진 미소결정은 부등변 사변형과 유사하였다. Auger 스펙트럼 및 Ni, Au 및 Si에 대한 내층조성(indepth Composition Profiles)은 NiSi2 미소 결정이 Au-Si 공융체의 matrix에 미소 부분으로 나타났음을 보여주었다.

• Journal of Sensor Science and Technology
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• v.28 no.4
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• pp.225-230
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• 2019

$Au@TiO_2$ core-shell decorated rGO nanocomposite (NC) was prepared using a simple solvothermal method followed by heat treatment for gas sensor application. The crystal structure and morphology of the composites were characterized by X-ray powder diffraction and transmission electron microscopy, respectively. The $NO_2$ sensing response of the $Au@TiO_2/rGO$ NC was tested at operating temperatures from $250^{\circ}C$ to $500^{\circ}C$, and was compared with those of the bare rGO and $Au@TiO_2$ core-shell NPs. The $Au@TiO_2/rGO$ NC-based sensor showed a far higher response than the rGO or $Au@TiO_2$ core-shell based sensors, with the maximum response detected when the operating temperature was $400^{\circ}C$. This improved response was due to the high rGO gas absorption capability for $NO_2$ gas and the catalytic effect of $Au@TiO_2$ core-shell NPs in oxidizing $NO_2$ to $NO_3$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.04a
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• pp.203-205
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• 2003

레이저 다이오드를 p-side-down 방식으로 본딩하기 위하여 AuSn 솔더합금을 증착한 후 온도와 압력, 시간을 변화시켜 본딩상태를 조사하였다. CuW위에 adhsion layer와 확산방지층을 각각 $500{\AA}$과 $2000{\AA}$을 증착하였으며 솔더층으로 AuSn을 $2.6{\mu}m$ 증착 하였다. 열처리는 질소 분위기에서 행하였으며, 표면의 거칠기는 AFM으로 측정하였다.

• Proceedings of the Korean Biophysical Society Conference
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• 2003.06a
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• pp.75-75
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• 2003

We report here the results on N-acetyl-N'-dimethylamide of proline (Ac-Pro-NM $e_2$) calculated using the ab initio molecular orbital method with the self-consistent reaction field (SCRF) theory at the HF level with the 6-31+G(d) basis set to investigate the conformational preference of polyproline depending on the cis/trans peptide bonds and down/up puckerings along the backbone torsion angle $\square$ in the gas phase, chloroform, and water. In the gas phase, Ac-Pro-NM $e_2$ has seven local minima of tFd, tFu, cFd, cFu, cAu, tAu, and cAd conformations. In particular, polyproline conformations tFd, tFu, cFd, and cFu are found to be more stable than $\square$-helical conformations cAu, tAu, and cAd. In contrast, Ac-Pro-NHMe has seven local minima of tCd, tCu, cBd, cAu, tAu, cFd, and cFu conformations. Conformations tCd and tCu are found to be most stable, which is ascribed to the intramolecular hydrogen bond between C=O of acetyl group and $N^{~}$ H of N'-methyl amide group. The stability of the cFd conformation (i.e., the polyproline I structure) in chloroform is somewhat increased, relative to that in water, although tFd and tFu conformations (i.e., the polyproline II structure) are dominate both in chloroform and water. The population of backbone conformations feasible in chloroform and water is consistent with the experiments. This work is supported by a Korea Research Foundation Grant (KRF-2002-041-C00129).

• Journal of Biomedical Engineering Research
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• v.15 no.4
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• pp.389-394
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• 1994

The age-hardening behavior and the structural changes in a commercial dental Au-Ag-Cu-Pd alloy were investigated by means of hardness test, optical and scanning electron microscopic observation, energy dispersive spectroscopy and X-ray diffraction study. The drastic reduction in hardness by prolonged aging occurred after a rapid increase in hardness at the initial stage by the isothermal aging at $350^{\circ}C$. This softening was due to the broad precipitates formation of the lamellar structure which was composed of the f.c.t. AuCu I ordered f.c.t. phase containing Pd and the f.c.c. Ag-rich $\alpha$1 solid solution f.c.c.phase containing Au.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.143-143
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• 2000

MEIS를 이용하여 Cu3Au(100)에서 단원자층 분해능을 얻기 위한 연구를 하였다. 우선 수소이온을 이용한 첫째층과 셋째 Au층의 분리 시도는 extremely glancing exit angle 등 극한의 산란조건에서도 성공하지 못하였다. 깊이 분해능을 정해주는 electronic 에너지 손실을 극대화기 위해 수소이온 대신 질소 이온을 사용하여 에너지 스펙트럼을 측정해 본 결과, 표면 Au 층과 표면 셋째 Au 층을 구분할 수 있었다, <110>으로 정렬된 조건에서는 셋째 층의 Au 원자들이 완전히 shadow cone 내부에 존재하여 관측되지 않지만 9.75$^{\circ}$tilt한 경우 셋째 층의 Au 원자들이 shadow cone 바깥으로 나오게 되어 첫째 층과 셋째 층이 확실히 분리되어 측정되었다. 이 연구에서 MEIS로 단원자층의 분해능을 얻는데 성공하였다. 이러한 단원자층 분해능으로 시료의 온도변화에 따른 표면 첫째 층의 Au 의 조성변화를 관찰하였고 이를 전산 모사 하였다. 이 결과 벌크 전이 온도인 39$0^{\circ}C$이하에서 표면 첫째 층 Au의 조성이 감소하는 것을 관찰하였고 이러한 감소는 45$0^{\circ}C$근처까지 계속되었으며, 다시 온도를 실온으로 낮추면 본래의 질서화된 상태로 되돌아감을 확인하였다. 그리고 이를 전산 모사 한 결과, 표면 첫째 층의 Au가 표면 둘째 층으로 이동해 감을 알 수 있었다.

• Current Photovoltaic Research
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• v.1 no.1
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• pp.63-68
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• 2013

We investigated the effects of Au eutectic reaction on Si thin film growth by hot wire chemical vapor deposition. Small SiC and Si nano-particles fabricated through a wet etching process were coated and biased at 50 V on micro-textured Si p-n junction solar cells. Au thin film of 10 nm and a Si thin film of 100 nm were then deposited by an electron beam evaporator and hot wire chemical vapor deposition, respectively. The Si and SiC nano-particles and the Au thin film were structurally embedded in Si thin films. However, the Au thin film grew and eventually protruded from the Si thin film in the form of Au silicide nano-balls. This is attributed to the low eutectic bonding temperature ($363^{\circ}C$) of Au with Si, and the process was performed with a substrate that was pre-heated at a temperature of $450^{\circ}C$ during HWCVD. The nano-balls and structures showed various formations depending on the deposited metals and Si surface. Furthermore, the samples of Au nano-balls showed low reflectance due to surface plasmon and quantum confinement effects in a spectra range of short wavelength spectra range.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.219-219
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• 2012

The formation and thermal desorption behaviors of octanethiol (OT) SAMs on single crystalline Au (111) and polycrystalline Au, Ag, and Cu substrates were examined by X-ray photoelectron microscopy (XPS), thermal desorption spectroscopy (TDS), and contact angle (CA) measurements. XPS and CA measurements revealed that the adsorption of octanethiol (OT) molecules on these metals led to the formation of chemisorbed self-assembled monolayers (SAMs). Three main desorption fragments for dioctyl disulfide (C8SSC8+, dimer), octanethiolate (C8S+), and octanethiol (C8SH+) were monitored using TDS to understand the effects of surface morphology and the nature of metal substrates on the thermal desorption behavior of alkanethiols. TDS measurements showed that a sharp dimer peak with a very strong intensity on single crystalline Au (111) surface was dominantly observed at 370 K, whereas a broad peak on the polycrystalline Au surface was observed at 405 K. On the other hand, desorption behaviors of octanethiolates and octanethiols were quite similar. We concluded that substrate morphology strongly affects the dimerization process of alkanethiolates on Au surfaces. We also found that desorption intensity of the dimer is in the order of Au＞＞Ag＞Cu, suggesting that the dimerization process occurs efficiently when the sulfur-metal bond has a more covalent character (Au) rather than an ionic character (Ag and Cu).