• 한국통신학회논문지
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• 제25권6B호
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• pp.1127-1135
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• 2000

적응배열안테나 시스템에서 적응과정을 수행하는 Beamformer는 DS-CDMA의 특성상 다중사용자에 의한 신호의 열화 및 처리해야하는 데이터 속도에 영향을 받게 된다. 이러한 문제점들을 고려해서 다양한 방법들이 제안되고 있는데, 본 논문에서는 Beamformer 전단에서 역확산 과정을 수행해 Beamformer가 상대적을 느린 데이터 속도 및 보상된 신호레벨에서 동작하게 되도록 하는 심볼 레벨 시스템과 역확산 과정없이 칩 레벨의 신호를 바로 처리하는 칩 레벨 시스템을 채널 특성이 변화하지 않는 고정 채널과 시변하는 다양한 채널 환경에서 컴퓨터 시뮬레이션하고, 그 성능을 MSE와 빔 패턴 그리고 Beamformer 출력 신호 분포점등을 근거로 분석해 보았다. 고정채널에서는 비슷한 성능을 보인 반면, 시변하는 채널 환경하에서는 칩 레벨 시스템이 심볼레벨 시스템에 비해 전반적으로 더 우수함을 확인할 수 있었다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.360-365
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• 2003

In this paper, we have developed a general purpose motion controller using an FPGA(Field Programmable Gate Array). The multi-PID controllers on a single chip are implemented as a system-on-chip for multi-axis motion control. We also develop a PC GUI for an efficient interface control. Comparing with the commercial motion controller LM 629 it has multi-independent PID controllers so that it has several advantages such as space effectiveness, low cost and lower power consumption. In order to test the performance of the proposed controller, robot finger is controlled. The robot finger has three fingers with 2 joints each. Finger movements show that position tracking was very effective. Another experiment of balancing an inverted pendulum on a cart has been conducted to show the generality of the proposed FPGA PID controller. The controller has well maintained the balance of the pendulum.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• 센서학회지
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• 제14권1호
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• pp.28-32
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• 2005

In this paper, a CMOS integrated detection circuit for capacitive type fingerprint sensor signal processing is described. We designed a detection circuit of charge-sharing sensing scheme. The proposed detection circuit increases the voltage difference between a ridge and valley. The test chip is composed of $160{\times}192$ array sensing cells (12 by $12.7{\;}mm^{2}$). The chip was fabricated on a 0.35 m standard CMOS process. Measured difference voltage between a ridge and valley was 0.95 V.

• 전자통신동향분석
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• 제38권1호
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• pp.46-54
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• 2023

The announcement of the US Environmental Protection Agency that it will stop conducting or funding experimental studies on mammals by 2035 should prioritize ongoing efforts to develop and use alternative toxicity screening methods to animal testing. Toxicity screening is likely to be further developed considering the combination of human-induced pluripotent-stem-cell-derived organ-on-a-chip and multielectrode array (MEA) technologies. We briefly review the current status of MEA technology and MEA-based neuropharmacological drug screening using various cellular model systems. Highlighting the coronavirus disease pandemic, we shortly comment on the importance of early prediction of toxicity by applying artificial intelligence to the development of rapid screening methods.

• 대한전자공학회논문지
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• 제26권11호
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• pp.1880-1885
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• 1989

In this paper, a new approach for systolic array realizing the discrete cosine transform (DCT) based on discrete Fourier transform (DFT) of an input sequence is presented. The proposed array is based on a simple modified DFT(MDFT) version of the Goertzel algorithm combined with Kung's approach and is proved perfectly. This array requires N cells, one multiplier and takes N clock cycles to produce a complete N-point DCT and also is able to process a continuous stream of data sequences. We have analyzed the output signal-to-noise ratio(SNR) and designed the circuit level layout of one-PE chip. The array coefficients are static adn thus stored-product ROM's can be used in place of multipliers to limit cost as eliminate errors due to coefficients quantization.

• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.19-24
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• 2014

This article reviews the recent progress in nanowell array biosensors that use the label-free detection protocol, and are detected in their natural forms. These nanowell array biosensors are fabricated by nanofabrication technologies that should be useful for developing highly sensitive and selective also reproducible biosensors. Moreover, electrochemical method was selected as analysis method that has high sensitivity compared with other analysis. Finally, highly sensitive nanobiosensor was achieved by combining nanofabrication technologies and classical electrochemical method. Many examples are mentioned about the sensing performance of nanowell array biosensors will be evaluated in terms of sensitivity and detection limit compared with other micro-sized electrode without nanowell array.

• ETRI Journal
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• 제41권2호
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• pp.262-269
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• 2019

This paper introduces a low-cost, high-performance mmWave antenna array module at 77 GHz. Conventional waveguide transitions have been replaced by 3D CPW-microstrip transitions which are much simpler to realize. They are compatible with low-cost substrate fabrication processes, allowing easy integration of ICs in 3D multi-chip modules. An antenna array is designed and implemented using multilayer coupled-fed patch antenna technology. The proposed $16{\times}16$ array antenna has a fractional bandwidth of 8.4% (6.5 GHz) and a 23.6-dBi realized gain at 77 GHz.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2449-2452
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• 2007

Hot spots on thin wafers of IC packages are becoming important issues in thermal and electrical engineering fields. To investigate these hot spots, we developed a Diode Temperature Sensor Array (DTSA) that consists of an array of 32 ${\times}$32 diodes (1,024 diodes) in a 8 mm ${\times}$ 8 mm surface area. To know specifically the hot spot temperature which is affected by the chip thickness and a generated power, we made the DTSA chips, which have 21.5 ${\mu}m$, 31 ${\mu}m$, 42 ${\mu}m$, 100 ${\mu}m$, 200 ${\mu}m$, and 400 ${\mu}m$ thickness using the CMP process. And we conducted the experiment using various heater power conditions (0.2 W, 0.3 W, 0.4 W, 0.5 W). In order to validate experimental results, we performed a numerical simulation. Errors between experimental results and numerical data are less than 4%. Finally, we proposed a correlation for the hot spot temperature as a function of the generated power and the wafer thickness based on the results of the experiment. This correlation can give an easy estimate of the hot spot temperature for flip chip packaging when the wafer thickness and the generated power are given.

• 한국전자파학회논문지
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• 제25권1호
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• pp.130-136
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• 2014

본 논문에서는 최근 실리콘 기반의 소자를 이용하여 microwave 대역에서 millimeter wave 대역까지 동작하는 위상 배열 시스템 개발에 관한 연구를 리뷰하고자 한다. 우선 위상 배열 시스템의 중요한 부품인 위상 변위기를 CMOS 공정을 이용한 설계 방법에 대해 논의한다. 그리고 수동형 위상 변위기를 송수신 모듈에 적용하여 한 채널에서 16 채널까지 확장하여 실리콘 칩에 구현을 하였다. 35 GHz 대역에서 동작하는 4 채널 송수신 칩은 200 mW 이하의 저전력 성능을 보여주었다. 또한, 44 GHz 대역에서 16 channel로 확장하여 송신 출력과 선형성을 향상시킬 수 있었다. 능동형 위상 변위기는 Ku band 대역에서 동작하는 2-antenna 4-beam 수신기에 적용하였다. 한 칩에서 4개의 서로 다른 방향의 신호가 존재함으로 신호 간의 커플링을 최소화 하는 방법을 소개하고, 이를 측정을 통해 검증하였다.