• 한국전기전자재료학회논문지
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• 제26권12호
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• pp.853-857
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• 2013

We design, develope and test a parallel active polymer pen lithography (PPL) device, which consists of individually addressable elastomeric probe tips. The PPL array chip is fabricated using soft lithography method with polydimethylsiloxane (PDMS) material. Individual probe can be pneumatically actuated via a computer controlled interface. We demonstrate parallel writing with 16 individually addressed pens, with each pen producing a different pattern in the same run. The largest proof-of-concept array fabricated is $4{\times}4$ with a spacing of $250{\mu}m$ in both x and y axes.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1978.1_1979.1
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• 2009

In this paper, we have proposed and demonstrated a tonometry sensor array for measuring arterial pulse pressure. A sensor module consists of 7 piezoresistive pressure sensor array. Wire-bonded connection was provided between silicon chip and lead frame. PDMS(poly-dimethylsiloxane) was coated on the sensor array to protect fragile sensor while faithfully transmitting the pressure of radial artery to the sensor. Tonometric pulse pressure can be measured by this packaged sensor array that provides the pressure value versus the output voltage.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(II)
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• pp.1256-1259
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• 1987

This paper gives a new SRF (Sonic Range Finder) Array formation on the mobile robot. This SRF Array formation obtaine the mobile robot's environmental informations wider and faster than the other systems and detects the obstacles in the robot's path. It is processed and controlled by 8031, on-chip micro-computer. SRF Array sensors are drived by the LM1812 transceiver and selected by the 8-channel channel multiplexer. In this paper, it detects the obstacles in wider range and gives them to the MAIN to design the shortest modify path.

• 센서학회지
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• 제20권6호
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• pp.428-433
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• 2011

We report on the building of a micro sensor array based on typical semiconductor fabrication processes aimed at monitoring selectively a specific gas in ambient of other gases. Chemical sensors can be applied for an electronic nose and/or robots using this technique. Microsensor array was fabricated on the same chip using 0.6${\mu}m$ CMOS technology, and unique gas sensing patterns were obtained by principal component analysis from the array. $SnO_2$/Pt sensor for CO gas showed a high selectivity to buthane gas and humidity. $SnO_2$ sensor for hydrogen gas, however, showed a low selectivity to CO and buthane gas. We can obtain more distinguishable patterns that provide the small sensing deviation(the high seletivity) toward a given analyte in the response space than in the chemical space through the specific parameterization of raw data for chemical image formation.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권7호
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• pp.351-363
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• 2001

This paper presents an experimental investigation on the heat trensfer characteristic of micro pipe (MHP) array with 38 triangular microgrooves. A heat pipe is an effective heat exchanger operating without external power. The heat pipe transfers heat by means of the latent heat of vaporization and two-phase fluid flow driven by the capillary force. The overall size of the MHP array can be put undermeath a microelectonic die and integrated into the electrronic package of a microelectronin device to dissipate the heat from the die. The MHP array is fabricated by micromachining with a silicon wafer and a glass substrate. The MHP was filled with water and sealed. The experimental results show the temperature decrease of 12.1$^{\circ}C$ at the evaporator section for the input power of 5.9 W and the improvement of 28% in the heat transfer rate.

• 전자공학회논문지B
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• 제30B권7호
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• pp.1-13
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• 1993

In this paper, the problems of the conventional special-purpose array processor such as the deficiency of flexibility have been investigated. Then, a new modified methodology has been suggested and applied to obtain the common solution of the three typical App algorithms like SP(Shortest Path), TC(Transitive Closure), and MST(Minimun Spanning Tree) among the various APP algorithms using the similar method to obtain the solution. In the newly proposed APP parallel algorithm, real-time Processing is possible, without the structure enhancement and the functional restriction. In addition, we design 2-demensional bit-parallel low-triangular systolic array processor and the 1-PE in detail. For its evaluation, we consider its computational complexity according to bit-processing method and describe relationship of total chip size and execution time. Therefore, the proposed processor obtains, on which a large data inputs in real-time, 3n-4 execution time which is optimal o(n) time complexity, o(n$^{2}$) space complexity which is the number of total gate and pipeline period rate is one.

• 한국정밀공학회지
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• 제20권5호
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• 한국방송∙미디어공학회:학술대회논문집
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• 한국방송공학회 2013년도 추계학술대회
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• pp.161-164
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• 2013

본 논문에서는 다양한 멀티미디어 코덱을 고속으로 처리하기 위하여 전용하드웨어가 아닌 병렬 어레이 프로세서 기반의 U-Chip(Universal-Chip) 구조를 제안하고 TSMC 80nm 공정을 사용하여 11,865,090개의 게이트 수를 가지는 칩으로 개발하였다. U-Chip은 역양자화(IQ), 역변환(IT), 움직임 보상(MC) 연산을 위한 $4{\times}16$ 개의 프로세싱 유닛으로 구성된 병렬 어레이 프로세서와 문맥적응적 가변길이디코딩(CAVLC)을 위한 비트스트림 프로세서와 인트라 예측(IP), 디블록킹필터(DF) 연산을 위한 순차 프로세서와 DMAC의 데이터 전송 및 각 프로세서를 제어하여 병렬 파이프라인 스케쥴링을 처리하는 시퀀서 프로세서 등으로 구성된다. 1개의 프로세싱 유닛에 1개의 매크로블록 데이터를 맵핑하여 총 64개의 매크로블록을 병렬처리 하였다. 64개 매크로블록의 대용량 데이터 전송 시간과 각 프로세서들의 연산을 동시에 병렬 파이프라인 함으로서 전체 연산 성능을 높일 수 있는 이점이 있다. 병렬 파이프라인 구조의 H.264 디코더 프로그램을 개발하였고 제작된 U-Chip을 통해 $720{\times}480$ 크기의 베이스라인 프로파일 영상에 대하여 코어 192MHz 동작, DDR 메모리 96MHz 동작에서 30fps의 처리율을 가짐을 확인하였다.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2000년도 추계학술발표대회 및 bio-venture fair
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• pp.115-118
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• 2000

미세 가공 기술을 이용하여 제작된 IDA 전극을 활용하여 임피던스 측정방식의 cell chip으로의 응용에 대해 고찰하였다. IDA 전극은 기존의 반도체 공정으로서 손쉽게 제작할 수 있고, 대량 제작시 전극의 재현성 확보가 용이하고 소형화 할 수 있으며 낮은 단가로 제작될 수 있는 장점이 있다. IDA 전극을 채용한 cell chip을 B16-F1 melanoma 세포 배양에 적용한 결과, 세포성장과 임피던스 변화량이 상관성을 보였고, 세포의 성장을 저해하는 약물의 투과시 cell chip의 임피던스 변화 역시 기존의 방법과 유사한 결과를 보여 주었다.