• 제목/요약/키워드: Anodic film

검색결과 302건 처리시간 0.031초

철전극 표면 부동화막의 생성과 초기단계의 변화 (The Early Stages of Formation of the Passivation Film on Iron Electrode. Electrochemical and Automatic Ellipsometry Investigation)

  • 여인형;백운기
    • 대한화학회지
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    • 제28권5호
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    • pp.271-278
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    • 1984
  • 염기성 용액에서 기계적으로 연마한 고순도 철의 전위를 환원 전위로부터 부동화 전위로 급격히 변화시켜서 부동화 막이 전극표면에 형성되게 하면서 철의 반사율 변화와 타원편광반사법(Ellipsometry) 측정을 하였다. 철 표면이 부동화 될때 일어나는 반사광의 편광 파라메터(${\Delta},\;{\psi}$)와 반사율(R) 변화를 자동화된 타원편광반사계로 기록하였고, 이로부터 철을 부동화 상태에 들어가게 하는 표면막의 두께(${\tau}$)와 광학상수(n, k)들의 변화하는 값을 계산할 수 있었다. 광학상수 값들로 나타나는 막의 성질이 시간에 따라 급격한 전이를 하는 것은 관찰되지 않았으며, 비교적 짧은 시간(수초)내에 정상 상태 값에 접근하였다. 효과적으로 부동화를 일으키는 막의 두께는 $14\;{\sim}\;23{\AA}$의 범위에 있었다. 형성된 부동화 막은 용액의 pH가 큰 경우에는 얇고 치밀한 구조를 가진 것으로 보이며, pH가 작은 경우에는 두께는 두껍지만 pH가 큰 경우보다 덜 치밀한 부동화 막이 형성되는 것으로 보였다. 이들 부동화 막은 약간의 흡광성을 가지는 것으로 나타났다.

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스퍼터링법에 의해 증착된 알루미늄 박막의 전기적·구조적 특성에 관한 연구 (The Study of Electrical and Structural Performance of Aluminum Thin Film Deposited by Sputtering Method)

  • 김도영
    • 한국전기전자재료학회논문지
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    • 제33권2호
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    • pp.114-117
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    • 2020
  • In this study, we performed the deposition of Al thin film using a DC magnetron sputtering method. To evaluate electrical and structural properties, the growth conditions were changed in terms of two functions, namely, sputtering power ranging from 41.6 to 216 W and film growth rate ranging from 5.35 to 26.39 nm/min. The growth rate and the microstructure were characterized by a scanning electron microscopy and X-ray diffraction analysis. The plane of crystalline growth showed that the preferential (111) direction and defects due to the grain boundary increased with DC power. The resistivity of the Al film over 50 nm showed a constant value by horizontal grain growth. Our results can be applicable for the preparation of nano-templates for anodic aluminum oxide.

양극산화 티타늄의 생체적합성에 관한 연구 (A Study on the Biocompatibility of Anodized Titanium)

  • 이민호;추용호
    • 대한의용생체공학회:의공학회지
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    • 제14권4호
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    • pp.333-340
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    • 1993
  • The high biocompatibility of titanium is connected with the high corrosion resistance of the surface oxide, its high dielectric constant, and some other specific biochemical properties of the oxide. The corrosion resistance of titanium can be improved with the formation of passive film by anodic oxidation. In other to characterize the titantium oxlde film formed by anodic oxidation, titanium plates were anodized in 0.5M $H_3SO_4$ electrolyte at voltages between 5V and 100v. The oxide film was examined by an X-Ray Diffractometer(XRD) and a Scanning Electron Microscope(SEM). In addition, the corrosion resistance of oxide film was tested by dipping in physiological NaCl,5% HCI,5% $H_3PO_4$ and its biocompatability was evaluated by the fibroblast-like cell culture. The results obtained are as follows : 1. The thickness of surface oxide and micropore are increased with the increase of electrode potential and formed deeply along the grain boundary. 2. The solubilities of titanium in electrolyte solution shows that the anodized titanium has more corrosion resistance than the untreated pure titanium. 3. The biocomatibility of anodized titanium is superior to untreated pure titanium.

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Borate 완충용액에서 철의 산화 반응구조와 산화피막의 전기적 특성 (Electronic Properties of the Oxide Film and Anodic Oxidation Mechanism of Iron in Borate Buffer Solution)

  • 김현철;김연규
    • 대한화학회지
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    • 제56권5호
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    • pp.542-547
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    • 2012
  • Borate 완충용액에서 Fe의 산화 반응 경로와 생성된 산화피막의 전기적 특성을 조사하였다. Fe는 pH에 의존하는 두 가지의 반응 경로에 의하여 산화되었으며 산화된 피막은 Mott-Schottky 식이 적용되는 n-형 반도체 성질을 가지고 있음을 알 수 있었다.

Anodizing science of valve metals

  • Moon, Sungmo
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2017년도 춘계학술대회 논문집
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    • pp.96.1-96.1
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    • 2017
  • This presentation introduces anodizing science of typical valve metals of Al, Mg and Ti, based on the ionic transport through the andic oxide films in various electrolyte compositions. Depending on the electrolyte composition, metal ions and anions can migrate through the andic oxide film without its dielectric breakdown when point defects are present within the anodic oxide films under high applied electric field. On the other hand, if anodic oxide films are broken by local joule heating due to ionic migration, metal ions and anions can migrate through the broken sites and meet together to form new anodic films, known as plasma electrolytic oxidation (PEO) treatment. In this presentation, basics of conventional anodizing and PEO methods are introduced in detail, based on the ionic migration and movement mechanism through anodic oxide films by point defects and by local dielectric breakdown of anodic oxide films.

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Electrochemical Random Signal Analysis during Localized Corrosion of Anodized 1100 Aluminum Alloy in Chloride Environments

  • Sakairi, M.;Shimoyama, Y.;Nagasawa, D.
    • Corrosion Science and Technology
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    • 제7권3호
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    • pp.168-172
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    • 2008
  • A new type of electrochemical random signal (electrochemical noise) analysis technique was applied to localized corrosion of anodic oxide film formed 1100 aluminum alloy in $0.5kmol/m^3$ $H_3BO_4/0.05kmol/m^3$ $Na_2B_4O_7$ with $0.01kmol/m^3$ NaCl. The effect of anodic oxide film structure, barrier type, porous type, and composite type on galvanic corrosion resistance was also examined. Before localized corrosion started, incubation period for pitting corrosion, both current and potential slightly change as initial value with time. The incubation period of porous type anodic oxide specimens are longer than that of barrier type anodic oxide specimens. While pitting corrosion, the current and potential were changed with fluctuations and the potential and the current fluctuations show a good correlation. The records of the current and potential were processed by calculating the power spectrum density (PSD) by the Fast Fourier Transform (FFT) method. The potential and current PSD decrease with increasing frequency, and the slopes are steeper than or equal to minus one (-1). This technique allows observation of electrochemical impedance changes during localized corrosion.

20% 황산 및 8% 황산 + 3% 옥살산에서 AA6061 합금 표면에 형성된 아노다이징 피막의 내전압 특성 (Dielectric breakdown of anodic oxide films formed on AA6061 in 20% H2O4and 8% H2SO4+ 3% C2H2O4 solutions)

  • 박철기;장재확;현윤석;문성모
    • 한국표면공학회지
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    • 제57권1호
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    • pp.8-13
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    • 2024
  • Anodizing of Al6061 alloy was conducted in two different electrolytes of 20% sulfuric acid and 8% sulfuric acid + 3 % oxalic acid solutions at a constant current or decreasing current density conditions, and its dielectric breakdown voltage was measured. The surface morphology of anodic oxide films was observed by TEM and thermal treatment was carried out at 400 ℃ for 2 h to evaluate the resistance of the anodic oxide films to crack initiation. The anodic oxide film formed in 8% sulfuric acid + 3 % oxalic acid solution showed higher dielectric breakdown voltage and better resistance to crack initiation at 400 ℃ than that formed in 20% sulfuric acid solution. The dielectric breakdown voltage increased 6 ~12% by applying decreasing current density comparing with a constant current density.

Anodic Oxide Films Formed on AZ31 Magnesium Alloy by Plasma Electrolytic Oxidation Method in Electrolytes Containing Various NaF Concentrations

  • Moon, Sungmo;Kwon, Duyoung
    • 한국표면공학회지
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    • 제49권3호
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    • pp.225-230
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    • 2016
  • The present work was conducted to investigate the effects of NaF concentration in phosphate and silicate-containing alkaline electrolyte on the morphology, thickness, surface roughness and hardness of anodic oxide films formed on AZ31 Mg alloy by plasma electrolytic oxidation (PEO) method. The PEO films showed flat surface morphology with pores in the absence of NaF in the electrolyte, but nodular features appeared on the PEO film surface prepared in NaF-containing electrolyte. Numerous pores ranging from 1 to $20{\mu}m$ in size were observed in the PEO films and the size of pores decreased with increasing NaF concentration in the electrolyte. Surface roughness and thickness of PEO films showed increases with increasing NaF concentration. Hardness of the PEO films also increased with increasing NaF concentration. It was noticed that hardness of inner part of the PEO films is lower than that of outer part of them, irrespective of the concentration of NaF. The low hardness of PEO films was explained by the presence of a number of small size pores less than $2{\mu}m$ near the PEO film/substrate interface.

Anodic Dissolution Property and Structure of Passive Films on Equiatomic TiNi Intermetallic Compound

  • Lee, Jeong-Ja;Yang, Won-Seog;Hwang, Woon-Suk
    • Corrosion Science and Technology
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    • 제6권6호
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    • pp.311-315
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    • 2007
  • The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

Mold 법에 의해 제작된 FED용 전계에미터어레이의 특성 분석 (Fabrication & Properties of Field Emitter Arrays using the Mold Method for FED Application)

  • 류정탁;조경제;이상윤;김연보
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.347-350
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    • 2001
  • A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

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