• 열처리공학회지
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• 제25권5호
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• pp.244-248
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• 2012

ITO/$TiO_2$ films were deposited by RF magnetron sputtering on glass substrates and then the effect of vacuum annealing on the structural, optical and electrical properties of the films was investigated. The structural, optical and electrical properties are strongly related to annealing temperature. The films annealed at $300^{\circ}C$ showed a grain size of 40.9 nm, which was larger than as-deposited amorphous films. The optical transmittance in the visible wavelength region also increased, while the electrical resistivity decreased. The ITO/$TiO_2$ films annealed at $300^{\circ}C$ showed the highest optical transmittance of 81% and also showed the lowest electrical resistivity of $3.05{\times}10^{-4}{\Omega}cm$, in this study.

• 한국세라믹학회지
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• 제37권2호
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• pp.168-173
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• 2000

YMnO3 thin films were prepared on Pt/Ti/SiO2/Si substrate by chemical solution deposition method. The films were crystallized by heat-treatment at 85$0^{\circ}C$ for 1 hour. Effects of an annealing atmosphere(O2, Ar, vacuum) on the crystallization behavior and electridcal properties were investigated. YMnO3 thin films annealed under Ar atmosphere showed a superior crystallinity and a very strong c-aix preferred-orientation which was a polar axis. Leakage current density of the films decreased with lowering oxygen partial pressure of the annealing atmosphere. C-V and P-E ferroelectric hysteresis were observed only in the thin film heat-treated under Ar atmosphere.In order to prepare YMnO3 thin films having both low leakage current and ferroelectricity, the annealing atmsphere should be kept under a proper oxygen partial pressure which was about 1 Pa in this work. Leakage current density at 1 volt, dielectric constant($\varepsilon$r), remanent polarization(Pr), and coercive field(Ec) were 1.7$\times$10-8 A/$\textrm{cm}^2$, 25, 1.08$\mu$C/$\textrm{cm}^2$, and 100 kV/cm, respectively.

• 열처리공학회지
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• 제12권3호
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• pp.231-239
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• 1999

Volume fraction and morphology of retained austenite, tensile properties of TRIP type high strength steel sheet with Fe-C-Si-Mn-Cu chemical composition have been investigated. The retained austenite of granular, bar and film type existing in specimen was obtained after intercritical annealing and austempering. The granular type retained austenite increased with increase of intercritical annealing and austempering temperature. With increase of intercritical annealing temperature, retained austenite and carbon contents increased. Maximum contents of retained austenite was obtained by austempering at $400^{\circ}C$. The maximum tensile strength was obtained by austempering at $450^{\circ}C$ and maximum elongation was obtained at $400^{\circ}C$. T.S${\times}$E.L value increased with increase of retained austenite contents due to the elongation strongly controlled by contents of retained austenite, but tensile strength was affected with various factors such as bainitic structure etc.

• Nuclear Engineering and Technology
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• 제32권1호
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• pp.77-87
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• 2000

It is reported that the toughness and safety margins of the SA106 Gr.C main steam line piping steel is reduced due to dynamic strain aging (DSA) at the reactor operating temperature for Leak-Before-Break (LBB) application. In this study, intercritical annealing in two-phase ($\alpha$+${\gamma}$）region was performed to investigate the possibility of improving the toughness and reducing DSA susceptibility. The manifestations of DSA were still observed in the tensile tests of the annealed specimens. However, the ductility loss caused by DSA was smaller than that in the as-received material. Furthermore, the intercritical annealing was able to increase the Charpy impact toughness by 1.5 times compared to as-received. With the heat treatment, we could obtain microstructural changes such as the cleaner retained ferrite, increased ferrite content and somewhat finer grain size. It is considered that the reduced DSA was induced by cleaner retained ferrite, which in turn resulted in higher impact toughness in addition to the general toughening due to finer grain sizes and increased ferrite content.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.41-45
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• 2016

ITO/GZO double layered thin films were prepared on transparent glass substrates. Ga-doped ZnO(GZO) films were deposited by RF magnetron sputtering using an ZnO:Ga (98: 2 wt%) target. The post deposition annealing process was conducted for 30 minutes at different temperature of 100, 200, 300 and $400^{\circ}C$, respectively. As increase annealing temperature, ITO/GZO double layered thin films show the increment of the prefer orientation of ZnO diffraction peak (002) in the XRD patterns. We obtained Ga-doped ZnO thin films with a lowest resistivity of $1.84{\times}10^{-4}{\Omega}-cm$ at $400^{\circ}C$ and transparency above 80% in visible ranges. The figure of merit obtained in this study means that ITO/GZO double layered thin films which annealed at $400^{\circ}C$ have the highest optoelectrical performance in this study.

• 한국전기전자재료학회논문지
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• 제27권2호
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• pp.132-135
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• 2014

The Sr based ceramic thin films were deposited on Si substrate by RF magnetron sputtering method. And Sr based thin films were annealed at $500{\sim}700^{\circ}C$ using RTA. The surface roughness showed about 2.4 nm in annealed thin film at $600^{\circ}C$. The capacitance density of Sr based thin films were increased with the increase of annealing temperature. The maximum capacitance density of $0.6{\mu}F/cm^2$ was obtained by annealing temperature at $700^{\circ}C$. The voltage dependence of dielectric loss showed about 0.02 in voltage ranges of -10~+10 V. The leakage current density of annealing temperature of $600^{\circ}C$ was the $4.0{\times}10^{-6}\;A/cm^2$ at applied voltage of -5~+5 V.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.194-194
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• 2008

Boron doped ZnO:Al(AZOB) thin films were prepared on glass substrates by dc magnetron sputtering. Influence of the annealing treatment on the electrical and optical properties of AZOB thin films were investigated. The lowest resistivity of $1.6\times10^{-3}\Omega$-cm was obtained at an annealing temperature of $400^{\circ}C$. The average transmittance of the films is over 80% in the visible range. It was also shown that by introducing boron impurity into AZO system improve the uniformity, the resistivity, and thermal stability of ZnO-based conducting thin films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.329-332
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• 1999

In this paper, BST((Bao.&o,dTi0:3) thin films were deposited by the rf magnetron sputtering method on Pt/$SiO_2$/Si substrate. Pt, $RuO_2$, Ag, Cu films for the formation of top electrode were deposited on BST thm films. And then Top Electrodes/BST/Pt capacitors were annealed with rapid thermal annealing(RTA) at various temperature. We have investigated effect of post-annealing on the electrical properties such as dielectric constant and leakage current of the capacitors. It was found that electrical properties of the capacitors were greatly depended on the annealing temperatures as well as the materials of top electrodes. In BST thin films with Pt top electrode was annealed at $700^{\circ}C$. the dielectric constant was measured to the value of 346 at l[kHzl and the leakage current was obtained to the value of $8.76\times10^8$[A/$\textrm{cm}^2$] at the forward bias of 2[V].

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집 디스플레이 광소자 분야
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• pp.127-130
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• 2005

The properties of phosphorus doped ZnO multilayer thin films deposited on (001) sapphire substrates by pulsed laser deposition (PLD) were investigated by using annealing treatment at various annealing temperature after deposition. The phosphorus doped ZnO multilayer was composed of phosphorus doped ZnO layer and two pure ZnO layers on sapphire substrate. The structural. electrical and optical properties of the ZnOthin films were measured by X-ray diffraction (XRD). Hall measurements and photoluminescence (PL). As the annealing temperature optimized. the electrical properties of the ZnO multilayer showed a electron concentration of $1.56{\times}10^{16}/cm^3$, a resistivity of 17.97 ${\Omega}cm$. It was observed the electrical property of the film was changed by dopant activation effect as thermal annealing process

• 한국재료학회지
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• 제15권9호
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• pp.577-584
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• 2005

Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.