• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.23-27
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• 2012

The color of a natural diamond that contains nitrogen impurities can be enhanced by a high pressure high temperature (HPHT) treatment. Type IaAB diamond samples containing nitrogen impurities were executed by HPHT process of 5.6 Gpa, 10 min by varying the annealing temperature at 1600, 1650, and $1700^{\circ}C$. Property characterization was carried out using an optical microscope, FT-IR spectrometer, low-temperature PL spectrometer, and micro Raman spectrometer. By observing optical micrographs, it can be seen that diamond sample began to alter its color to vivid yellow at $1700^{\circ}C$. In the FT-IR spectrum, there were no Type changes of the diamond samples. However, amber centers leading to brown colors lessened after $1700^{\circ}C$ annealing. In the PL spectrum, all the H4 centers became extinct, while there were no changes of yellow color center H3 before or after treatment. In the Raman spectrum, no graphite spots were detected. Consequently, diamond color enhancement can be done by higher than $1700^{\circ}C$ HPHT annealing at 5.6 GPa-10 min.

• Korean Journal of Materials Research
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• v.30 no.12
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• pp.660-665
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• 2020

Silicon heterojunction solar cells can achieve high conversion efficiency with a simple structure. In this study, we investigate the passivation characteristics of VOx thin films as a hole-selective contact layer using ALD (atomic layer deposition). Passivation characteristics improve with iVoc (implied open-circuit voltage) of 662 mV and minority carrier lifetime of 73.9 µs after post-deposition annealing (PDA) at 100 ℃. The improved values are mainly attributed to a decrease in carbon during the VOx thin film process after PDA. However, once it is annealed at temperatures above 250 ℃ the properties are rapidly degraded. X-ray photoelectron spectroscopy is used to analyze the chemical states of the VOx thin film. As the annealing temperature increases, it shows more formation of SiOx at the interface increases. The ratio of V5+ to V4+, which is the oxidation states of vanadium oxide thin films, are 6:4 for both as-deposition and annealing at 100 ℃, and 5:5 for annealing at 300 ℃. The lower the carbon content of the ALD VOx film and the higher the V5+ ratio, the better the passivation characteristics.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.910-915
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• 2011

The microstructures and mechanical properties of roll-bonded STS439/Al1050/STS304 clad materials were investigated after an annealing process at various temperatures. Interfacial layer was developed at the STS439/Al1050 and Al1050/STS304 interfaces at $550^{\circ}C$. STS439/Al1050/STS304 clad metals fractured suddenly in a single step and the fracture decreased with increasing annealing temperatures at $450^{\circ}C$. After annealing at $550^{\circ}C$, samples fractured in three steps with each layer fracturing independently. Interfacial layers formed at $550^{\circ}C$ with a high Vickers microhardness were found to be brittle. During tensile testing, periodic parallel cracks were observed at the interfacial reaction layer. Observed micro-void between Al1050 and the interfacial layer was found to weaken the Al1050/reaction layer interface, leading to the total separation between Al1050 and the reaction layer.

• Nuclear Engineering and Technology
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• v.54 no.3
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• pp.991-996
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• 2022

Microstructures of monolithic high purity SiC and SiC with sintering additives after neutron irradiation to a fluence of 2.0-2.5 × 10²⁴ n/m² (E > 0.1 MeV) at 333-363 K and after post-irradiation annealing up to 1673 K were observed using a transmission electron microscopy. Results showed that no black spot defects or dislocation loops in SiC grains were found after the neutron irradiation for all of the specimens owing to the moderate fluence at low irradiation temperature. Thus, it is confirmed that these specimens were swelled mostly by the formation of point defects. Black spots and small dislocation loops were discovered only after the annealing process in PureBeta-SiC and CVD-SiC, where the swelling almost diminished. Anomalous-shaped YAG grains were found in SiC ceramics containing sintering additives. These grains contained dense black spots defects and might lose crystallinity after the neutron irradiation, while these defects may annihilate by recrystallization during annealing up to 1673 K. Amorphous grain boundary phase was also presented in this ceramic, and a large part of it was crystallized through post-irradiation annealing and could affect their recovery behavior.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.9
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• pp.202-209
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• 2000

In recent years the concern of designing multi-stage gear drives increases with the more application of gear drives in high-speed and high-load. until now however research on the gear drive design has been focused on single gear pairs and the design has been depended on experiences and know-how of designers and carried out commonly by trial and error. We propose the automation of the dimensional design of gears and the configuration design for gear arrangement of two-and three-stage cylindrical gear drives. The dimensional design is divided into two types of design processes to determine the dimensions of gears. The first design process(Process I) uses the total volume of gears to determine gear ratio and uses K factor unit load and aspect ratio to determine gear dimensions. The second one(Process II) makes use of Niemann's formula and center distance to calculate gear ratio and dimensions. Process I and II employ material data from AGMA and ISO standards respectively. The configuration design determines the positions of gears to minimize the volume of gearbox by simulated annealing algorithm. Finally the availability of the design algorithm is validated by the design examples of two-and three-stage gear drives.

• Journal of the Korean Ceramic Society
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• v.49 no.6
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• pp.614-619
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• 2012

We investigated color and graphite layer formation on the surface of Type I tinted brown diamonds exposed for 5 minutes under a high-pressure high-temperature (HPHT) condition in a stable graphite regime. We executed the HPHT processes of Process I, varying the temperature from $1600^{\circ}C$ to $2300^{\circ}C$ under 5.2 GPa pressure for 5 minutes, and Process II, varying the pressure from 4.2 to 5.7 GPa at $2150^{\circ}C$ for 5 minutes. Optical microscopy and micro-Raman spectroscopy were used to check the microstructure and surface layer phase evolution. For Process I, we observed a color change to vivid yellow and greenish yellow and the growth of a graphite layer as the temperature increased. For Process II, the graphite layer thickness increased as the pressure decreased. We also confirmed by 531 nm micro-Raman spectroscopy that all diamonds showed a $1440cm^{-1}$ characteristic peak, which remained even after HPHT annealing. The results implied that HPHT-treated colored diamonds can be distinguished from natural stones by checking for the existence of the $1440cm^{-1}$ peak with 531 nm micro-Raman spectroscopy.

• Electrical & Electronic Materials
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• v.8 no.6
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.1
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• pp.11-16
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• 2016

The conduction behavior and electron concentration change in a-IGZO thin-films according to the RTA (rapid thermal annealing) were studied. The electrical characteristics of TFTs (thin-film-transistors) annealed by different temperatures were measured. The sheet resistance, electron concentration, and oxygen vacancy of a-IGZO film were measured by the four-point-probe-measurement, hall-effect-measurement, and XPS analysis. The RTA process increased the driving current of IGZO TFTs but the VTH shifted to the negative direction at the same time. When the RTA temperature is higher than $250^{\circ}C$, the leakage current at off-state increased significantly. This is attributed to the increase of oxygen vacancy resulting in the increase of electron concentration. We demonstrate that the RTA is a promising process to adjust the VTH of TFT because the RTA process can easily modify the electron concentration and control the conductivity of IGZO film with short process time.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.703-706
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• 2004

This paper deals with the various sealing conditions in a vacuum and the discharge characteristics. The MgO thin film is prepared by e-beam evaporation method. Sealing process was performed in a vacuum at panel temperature of 430 $^{\circ}C$. We find the cracks on the MgO film surface, which results in higher discharge voltage and lower luminous efficiency. The vacuum in-line sealing technology does not require additional annealing process but induces the MgO cracks because of the high temperature sealing cycle in a vacuum. Therefore we modify the vacuum in-line sealing cycle which the MgO cracks are not found and the good characteristics of plasma displays are found in higher sealing pressure at sealing temperature of 430 $^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.105-108
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• 2003

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.