• Journal of Welding and Joining
• /
• v.31 no.3
• /
• pp.11-16
• /
• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.

• Journal of Advanced Navigation Technology
• /
• v.23 no.4
• /
• pp.316-321
• /
• 2019

In this paper, by applying the constant current principle we develop an impedance measurement system which can measure the high precision impedance of various electric materials by using microprocessor. This measurement system board has an interface device for acquiring digital data from an external device including an impedance measuring device, and system software is also developed by a firmware program executed on such an embedded board. It can measure the high precision impedance of a specific band with 1/32768 precision by using 15-bit ADC(analog to digital converter) and calculate it to the five digits to the right of the decimal point(fraction part). Data is transmitted through a USB interface of a general computer and a measuring device to manage digital data. An impedance measurement system equipped with a communication function capable of a more general and easy-to-use interface than other equipment is developed and verified.

• The Journal of Advanced Prosthodontics
• /
• v.15 no.1
• /
• pp.22-32
• /
• 2023

PURPOSE. Digital technology has enabled improvements in the fitting accuracy of denture bases via milling techniques. The aim of this study was to evaluate the trueness and precision of digital and analog techniques for manufacturing complete dentures (CDs). MATERIALS AND METHODS. Sixty identical CDs were manufactured using different production protocols. Digital and analog technologies were compared using the reference geometric approach, and the Δ-error values of eight areas of interest (AOI) were calculated. For each AOI, a precise number of measurement points was selected according to sensitivity analyses to compare the Δ-error of trueness and precision between the original model and manufactured prosthesis. Three types of statistical analysis were performed: to calculate the intergroup cumulative difference among the three protocols, the intergroup among the AOIs, and the intragroup difference among AOIs. RESULTS. There was a statistically significant difference between the dentures made using the oversize process and injection molding process (P < .001), but no significant difference between the other two manufacturing methods (P = .1227). There was also a statistically significant difference between the dentures made using the monolithic process and the other two processes for all AOIs (P = .0061), but there was no significant difference between the other two processes (P = 1). Within each group, significant differences among the AOIs were observed. CONCLUSION. The monolithic process yielded better results, in terms of accuracy (trueness and precision), than the other groups, although all three processes led to dentures with Δ-error values well within the clinical tolerance limit.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.3
• /
• pp.149-154
• /
• 2014

A new CMOS analog design methodology using an independently optimized self-cascode (SC) is proposed. This idea is based on the concept of the dual-workfunction-gate MOSFETs, which are equivalent to SC structures. The channel length of the source-side MOSFET is optimized, to give higher transconductance ($g_m$) and output resistance ($r_{out}$). The highest $g_m$ and $r_{out}$ of the SC structures are obtained by independently optimizing the channel length ratio of the SC MOSFETs, which is a critical design parameter. An operational amplifier (OPAMP) with the proposed design methodology using a standard digital $0.18-{\mu}m$ CMOS technology was designed and fabricated, to provide better performance. Independently $g_m$ and $r_{out}$ optimized SC MOSFETs were used in the differential input and output stages, respectively. The measured DC gain of the fabricated OPAMP with the proposed design methodology was approximately 18 dB higher, than that of the conventional OPAMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.479-480
• /
• 2005

The Analog data is impossible to perfect reconstruct original data at a hologram data storage because of noise such as cross talk. So it is necessary that data can be stored by digital signal unavoidably. Therefore this work deals with experiments from this point of view through writing & reading of digital data. We stored 256bit digital data at one point on As-Ge-Se-S chalcogenide thin film and we reconstruct original data of 100% through the specified algorithm such as the histogram equalization, the interactive correction, etc. This result shows that the data is able to reconstruct under relative low diffraction efficiency. As the result, we expect the possibility of chalcogenide thin film for HDDS as the analysis of the effective resolution refer to reconstruction rate and diffraction efficiency.

• Korean Journal of Materials Research
• /
• v.4 no.5
• /
• pp.502-509
• /
• 1994

New damping measurement equipment was designed using the dynamic strain gage and high speed analog to digital signal 12 bit converter and compared it with existing equipment. The damping properties of general material and high damping material were also studied by this machine. The SDC (specific damping capacity) was measured with various heat treatment condition, initial vibration amplitude and internal stress. The vibration amplitude of high damping material is decreased within nearly less than 0.4 second after applying the initial forced vibration. But that of general material is still vibrating at the same time. After furnace-cooling heat treatment, SDCmax of Fe-lGwt.%Cr system was more than 40% and that of Fe-5.5wt.%Al alloy was more than 30% after air-cooling heat treatment. Upon increasing of initial vibration amplitude, it is detected the migration of SDCmax into the region of small vibraton amplitude. Damping capacity is decreased rapidly as the internal stress Increases. Damping measurement equipment in the present study was ahln to give the more accurate results of damping properties in the small vibration amplitude region.

• Journal of the Korean Geosynthetics Society
• /
• v.19 no.4
• /
• pp.11-20
• /
• 2020

This study introduced the compact grouting method that can be used for improving soft ground and restoring buildings with unequal subsidence. The pump used in the traditional compact grouting method is a system that injects one hole each, which reduces the construction efficiency, and the analog injection method manually manages the construction by field workers, making it difficult to manage consistent quality. Pump and quality control system were developed to solve problems in existing construction. Since field supervisor determines amount of injected materials by using analog equipment and controls manually, it is difficult to manage consistent quality of construction. Therefore, the quality control system was developed in order to solve that problem. The quality control system consists of automatic mixing system of injection materials, multiple simultaneous injection pumps, and injection management monitoring system. Performance of the quality control system was verified through on-site testing, and ground improvement performance was verified through quality testing after testing and testing of the compact grouting method. Therefore, it is expected that the integrated quality control system developed will improve the quality assurance and efficiency and stability of construction at sites where construction and quality verification are difficult.

• Journal of Magnetics
• /
• v.12 no.2
• /
• pp.77-80
• /
• 2007

Recently there was a proposal for a spin filter by using the spin superlattice structure. In a certain energy range, the proposed structure exhibits a high spin filtering efficiency close to 100%. Unfortunately such energy range turns out to be narrow. In this paper, we report a method to widen the energy range by using an analogy to optical anti-reflection coating. In optics, it is well known that a stack of alternating layers of two dielectric materials can function as a highly transmissive or reflective filter for wide range of wavelength. Since electrons also have wave character as light, it would be possible to make an electronic analog of an optical filter. We demonstrate that alternating layers of two materials with different g-factors can function as a spin filter that allows electrons to be transmitted only when their spins point towards a certain particular direction. This spin-superlattice-based spin filter operates in wide energy ranges, curing the problem in the previous proposal.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.37 no.5
• /
• pp.465-475
• /
• 2024

Due to changes in the form factor of display panels and touch screen panels in various devices, capacitive touch systems have evolved to address various issues such as low power consumption, noise immunity, and small chip size. Furthermore, some devices have applications that use a stylus. Since the stylus operates similarly to a finger touch, it encounters similar issues. Recent research trends focus on addressing key issues such as noise, which is primarily caused by the self-capacitor formed between the display cathode and the touch screen panel. In this paper, Various research papers discussing methods to eliminate external noise will be reviewed. These advancements enhance noise immunity in touch systems, making it easier to use thinner and more flexible panels. These progress make touch technology more versatile and reliable in various applications.

• Bulletin of the Korean Chemical Society
• /
• v.34 no.4
• /
• pp.1108-1114
• /
• 2013

Photochemical reactions of fluoro- vs. nonfluoro-substituted polymethylenoxy chain linked phthalimide were carried out to explore how electronegative fluorine atoms inside the donor chain influence photocyclization reaction efficiencies and to briefly determine the alkali metal binding properties of the photoproducts. The results of this study show that the fluorine-substituted donor chain linked phthalimide undergoes inefficient photocyclization via single electron transfer (SET)-induced excited state pathways to generate 14-membered cyclic amidol compared to nonfluoro-analog due to low electron donor ability of the terminal oxygen donor site. These results show that photoinduced intramolecular SET processes arising from ${\alpha}$-silyl ether electron donors to phthalimides are largely dependent on the kinds of substituents inside donor chain. Finally, a preliminary study with the cyclic amidols generated in this effort showed that they have weak alkali metal cation binding properties regardless of absence/presence of fluoro-substituents.