• The Journal of the Korea institute of electronic communication sciences
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• v.4 no.4
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• pp.247-252
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• 2009

This paper presents an Integer-N phase-locked loop (PLL) frequency synthesizer using a novel prescaler based on a charge pump and clock triggering circuit. A quadrature VCO has been designed for the 900MHz UHF RFID application. In this circuit, a voltage-controlled oscillator(VCO), a novel Prescaler, phase frequency detector(PFD), charge pump(CP), and analog lock detector(ALD) have been integrated with 0.35-${\mu}m$CMOS process. The integer divider has been developed with a verilog-HDL module, and the PLL mixed mode simulation has been performed with Spectre-Verilog co-simulator. The sweep range of VCO is designed from 828 to 960 MHz and the VCO generates four phase quadrature signals. The simulation results show that the phase noise of VCO is -102dBc/Hz at 100 KHz offset frequency, and the maximum lock-in time is about 4us with 32MHz step change (from 896 to 928 MHz).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.1
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• pp.44-54
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• 2001

In this paper, a novel test method is proposed to detect the hard and soft fault in analog circuits. The proposed test method makes use of the offset voltage, which is one of the op-amps characteristics. During the test mode, CUT is modified to unit gain op-amps with feedback loop. When the input of the op-amp is grounded, a good circuit has a small offset voltage, but a faulty circuit has a large offset voltage. Faults in the op-amp which cause the offset voltage exceeding predefined range of tolerance can be detected. In the proposed method, no test vector is required to be applied. Therefore the test vector generation problem is eliminated and the test time and cost is reduced. In this note, the validity of the proposed test method has been verified through the example of the dual slope A/D converter. The HSPICE simulations results affirm that the presented method assures a high fault coverage.

• The KIPS Transactions:PartA
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• v.12A no.6 s.96
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• pp.531-538
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• 2005

In the high performance Analog Information Processing Systems(AIPS), gain boosting or additional gain stage is required when the gain is not sufficient with one stage amplification. This work shows that high gain is neatly obtained by enhancing the gain using the negative resistance element. Compared to the conventional techniques, the proposed scheme enjoys full output swing, small circuit area and power consumption, and the applications to various configurations of amplifiers. The negative resistance element is placed between the differential output nodes when used in the Op-Amp. The HSPICE simulation indicates that enhancement of more than 40 dB is readily obtained in this simple configuration when the negative resistance element is implemented in the form of cross-coupled CMOS inverters.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.15 no.5
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• pp.335-342
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• 2022

In this paper, a single-bit 3rd-order feedforward delta sigma modulator is proposed for audio applications. The proposed modulator is based on a class-C inverter for low voltage and power applications. For the high-precision requirement, the class-C inverter with regulated cascode structure increases its DC gain and acts as a low-voltage subthreshold amplifier. The proposed Class-C inverter-based modulator is designed and simulated in 180-nm CMOS process. With no performance loss and a low supply voltage compatibility, the proposed class-C inverter-based switched-capacitor modulator achieves high power efficiency. This design achieves an signal-to-noise-and-distortion ratio (SNDR) of 93.9 dB, an signal-to-noise ratio (SNR) of 108 dB, an spurious-free dynamic range (SFDR) of 102 dB, and a dynamic range (DR) of 102 dB at a signal bandwidth of 20 kHz and a sampling frequency of 4 MHz, while only using 280 μW of power consumption from a 0.8-V power supply.

• ETRI Journal
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• v.26 no.6
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• pp.575-582
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• 2004

Fully-depleted silicon-on-insulator (FD-SOI) devices with a 15 nm SOI layer thickness and 60 nm gate lengths for analog applications have been investigated. The Si selective epitaxial growth (SEG) process was well optimized. Both the single- raised (SR) and double-raised (DR) source/drain (S/D) processes have been studied to reduce parasitic series resistance and improve device performance. For the DR S/D process, the saturation currents of both NMOS and PMOS are improved by 8 and 18%, respectively, compared with the SR S/D process. The self-heating effect is evaluated for both body contact and body floating SOI devices. The body contact transistor shows a reduced self-heating ratio, compared with the body floating transistor. The static noise margin of an SOI device with a $1.1\;{\mu}m^2$ 6T-SRAM cell is 190 mV, and the ring oscillator speed is improved by 25 % compared with bulk devices. The DR S/D process shows a higher open loop voltage gain than the SR S/D process. A 15 nm ultra-thin body (UTB) SOI device with a DR S/D process shows the same level of noise characteristics at both the body contact and body floating transistors. Also, we observed that noise characteristics of a 15 nm UTB SOI device are comparable to those of bulk Si devices.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.378-386
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• 2017

A return-to-zero (RZ) digital-to-analog converter (DAC) with a tri-state switching scheme is proposed in this paper. The proposed scheme provides a triple weight output for RZ operation by using a conventional differential current switch and simple pseudo-differential F/Fs. The RZ function is realized with only two additional transistors in each F/F cell, which results in a power dissipation increase of less than 5%. To verify the performance of the proposed method, a 10-bit RZ DAC is fabricated using standard 180-nm CMOS technology. Measured results show that the worst SFDR performances are 60 dBc and 55 dBc in the 1st and 2nd Nyquist bands, respectively, when operating at 650 MHz clock frequency. The total power consumption is 64 mW, and the active area occupies $0.25mm^2$.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.39 no.4
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• pp.25-35
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• 2002

This work describes an 8b 200MHz time-interleaved subranging analog-to-digital converter (ADC) based on a single-poly digital CMOS process. Two fine ADCs for lower digital bits of the proposed ADC employ a time-sharing double-channel architecture to increase system speed and a new reference voltage switching scheme to reduce settling time of the reference voltages and chip area. The proposed intermeshed resistor string, which generates reference voltages for fine ADCs, improves linearity and settling time of the reference voltages simultaneously. The proposed sample- and-hold amplifier(SHA) is based on a highly linear common-drain amplifier and passive differential circuits to minimize power consumption and chip area with 8b accuracy and employs input dynamic common mode feedback circuits for high dynamic performance at a 200MHz sampling rate. A new encoding circuit in a coarse ADC simplifies the signal processing between the coarse ADC and two successive fine ADCs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.760-770
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• 2016

A 12-bit 750 kS/s Dual-Sampling Successive Approximation Register Analog-to-Digital Converter (SAR ADC) technique with reduced Capacitive DAC (CDAC) is presented in this paper. By adopting the Adaptive Power Control (APC) technique for the two-stage latched type comparator and using bootstrap switch, power consumption can be reduced and overall system efficiency can be optimized. Bootstrapped switches also are used to enhance the sampling linearity at a high input frequency. The proposed SAR ADC reduces the average switching energy compared with conventional SAR ADC by adopting reduced the Most Significant Bit (MSB) cycling step with Dual-Sampling of the analog signal. This technique holds the signal at both comparator input asymmetrically in sample mode. Therefore, the MSB can be calculated without consuming any switching energy. The prototype SAR ADC was implemented in $0.18-{\mu}m$ CMOS technology and occupies $0.728mm^2$. The measurement results show the proposed ADC achieves an Effective Number-of-Bits (ENOB) of 10.73 at a sampling frequency of 750 kS/s and clock frequency of 25 MHz. It consumes only 0.13 mW from a 5.0-V supply and achieves the INL and DNL of +2.78/-2.45 LSB and +0.36/-0.73 LSB respectively, SINAD of 66.35 dB, and a Figures-of-Merit (FoM) of a 102 fJ/conversion-step.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.800-807
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• 2006

To enhance the conversion speed more fast, we separate the determination process of MSB and LSB with the two independent ADC circuits of the Incremental Sigma Delta ADC. After the 1st Incremental Sigma Delta ADC conversion finished, the 2nd Incremental Sigma Delta ADC conversion start while the 1st Incremental Sigma Delta ADC work on the next input. By determining the MSB and the LSB independently, the ADC conversion speed is improved by two times better than the conventional Extended Counting Incremental Sigma Delta ADC. In processing the 2nd Incremental Sigma Delta ADC, the inverting sample/hold circuit inverts the input the 2nd Incremental Sigma Delta ADC, which is the output of switched capacitor integrator within the 1st Incremental Sigma Delta ADC block. The increased active area is relatively small by the added analog circuit, because the digital circuit area is more large than analog. In this paper, a 14 bit Extended Counting Incremental Sigma-Delta ADC is implemented in $0.25{\mu}m$ CMOS process with a single 2.5 V supply voltage. The conversion speed is about 150 Ksamples/sec at a clock rate of 25 MHz. The 1 MSB is 0.02 V. The active area is $0.50\;x\;0.35mm^{2}$. The averaged power consumption is 1.7 mW.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.245-252
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• 2003

We designed a silicon pressure sensor interface circuit with digital calibration capability. The interface circuit is composed of an analog section and a digital section. The analog section amplifies the weak signal from the sensor and the digital section handles the calibration function and communication function between the chip and outside microcontroller that controls the calibration. The digital section is composed of I2C serial interface, memory, trimming register and controller. The I2C serial interface is optimized to suit the need of on-chip silicon microsensor in terms of number of IO pins and silicon area. The major part of the design is to build a controller circuit that implements the optimized I2C protocol. The designed chip was fabricated through IDEC's MPW. We also made a test board and the test result showed that the chip performs the digital calibration function very well as expected.