• Title/Summary/Keyword: Amorphous Silicon

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Development of Amorphous Silicon Based Digital Radiography System (비정질 실리콘 디지털 방사선 촬영기의 개발)

  • Lee, H.K.;Suh, T.S.;Choe, B.Y.;Shin, K.S.;Kim, H.K.
    • Proceedings of the KOSOMBE Conference
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    • v.1998 no.11
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    • pp.94-95
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    • 1998
  • We developed a digital x-ray medical imaging system using commercially available amorphous silicon image sensor plate. The image readout could be accomplished within 3.5 sec after radiation exposure and be displayed on a monitor through computer interface. This system needs not the conventional x-ray films and film processors, and also provides digital radiographic images. This system is the fastest digital radiography system developed so far, and expected to replace many of the conventional x-ray film systems or digital radiography systems.

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Laser Induced Crystallizatioo of Amorphous Si Films on Glass Substrates (유리 기판을 이용한 비정질 실라콘 박막의 결정화)

  • Kim, P.K.;Moon, S.J.;Jeong, S.H.
    • Laser Solutions
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    • v.13 no.1
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    • pp.6-10
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    • 2010
  • Crystallization of 100 nm thick amorphous silicon (a-Si) films on glass substrates was carried out by using a double laser irradiation method. Depending on a-Si deposition method or glass types, the quality of crystallized silicon film varies significantly. For a-Si films deposited with high concentration of impurities, large grains or high crystallinity can not be achieved. Crystallization with different a-Si deposition methods confirmed that for the polycrystallization of a-Si films on glass substrates, controlling the impurity density during substrate preparation is critical.

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Stability of Amorphous Silicon Thin-Film Transistor using Planarized Gate

  • Choi, Young-Jin;Woo, In-Keun;Lim, Byung-Cheon;Jang, Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.15-16
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    • 2000
  • The gate bias stress effect of the hydrogenated amorphous silicon (a-Si:H) thin-film transistors (TFTs) with a $SiN_x/BCB$ gate insulator have been studied. The gate planarization was carried out by spin-coating of BCB (benzocyclobutene) on Cr gates. The BCB exhibits charge trappings during a high gate bias, but the stability of the TFT is the same as conventional one when it is between -25 V and +25 V. The charge trap density in the BCB increases with its thickness.

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Sodalime-sodalime Electrostatic Bonding using Amorphous Silicon Interlayer and Its Application to FEA Packging (비정질 실리콘 박막을 이용한 Sodalime-Sodalime 정전 열 접합 및 FEA Packaging 응용)

  • Ju, Byeong-Kwon;Lee, Duck-Jung;Choi, Woo-Beom;Kim, Young-Cho;Lee, Nam-Yang;Oh, Myung-Hwan
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.9
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    • pp.656-661
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    • 1999
  • As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

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The effects of TCO/p-layer Interface on Amorphous Silicon Solar Cell (비정질 실리콘 태양전지에서 TCO/p층 계면 특성의 영향)

  • Ji, I.H.;Suh, S.T.;Choi, B.S.;Hong, S.M.
    • Solar Energy
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    • v.8 no.1
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    • pp.68-73
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    • 1988
  • In the glass/TCO/p-i-n a-Si/Al type of amorphous silicon solar cell, the effects on solar cell efficiency and metastability for the various kinds of TCO analyzed by SAM and ESCA, which was used to measure the diffusion profiles of In and Sn and the Fermi energy shifts in the TCO/p interface respectively. Indium which diffused into a-Si p-layer did not have any significant effects on the Fermi level shift of p-layer when the content of $B_2H_6/SiH_4$ in p-layer was at 1 gas%. The cell fabricated on $SnO_2$ turned out to have the best cell photovoltaic characteristics. ITO fabricated by electron beam deposition system, which was shown to have the greatest rate of diffusion of Indium in ITO/p interface produced the worst metastability among the cells tested.

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Analysis for Series Resistance of Amorphous Silicon Thin Film Transistor (비정질 실리코 박막 트랜지스터의 직렬 저항에 관한 분석)

  • Kim, Youn-Sang;Lee, Seong-Kyu;Han, Min-Koo
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.43 no.6
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    • pp.951-957
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    • 1994
  • We present a new model for the series resistance of inverted-staggered amorphous silicon (a-Si) thin film transistors (TFT's) by employing the current spreading under the source and the drain contacts as well as the space charge limited current model. The calculated results based on our model have been in good agreements with the measured data over a wide range of applied voltage, gate-to-source and gate-to-drain overlap length, channel length, and operating temperature. Our model shows that the contribution of the series resistances to the current-voltage (I-V) characteristics of the a-Si TFT in the linear regime is more significant at low drain and high gate voltages, for short channel and small overlap length, and at low operating temperature, which have been verified successfully by the experimental measurements.

Characterization of Air and SO2 Gas Corrosion of Silicon Carbide Nanofibers (탄화규소 나노섬유의 고온 대기 및 SO2 가스분위기에서의 부식물성)

  • Kim, Min-Jung;Lee, Dong-Bok
    • Journal of the Korean institute of surface engineering
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    • v.43 no.1
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    • pp.36-40
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    • 2010
  • The SiO vapor that was generated from a mixture of Si and $SiO_2$ was reacted at $1350^{\circ}C$ for 2 h under vacuum with carbon nanofibers to produce SiC nanofibers having an average diameter of 100~200 nm. In order to understand the gas corrosion behavior, SiC nanofibers were exposed to air up to $1000^{\circ}C$. SiC oxidized to amorphous $SiO_2$, but its oxidation resistance was inferior unlike bulk SiC, because of high surface area of nanofibers. When SiC nanofibers were exposed to Ar-1% $SO_2$ atmosphere, SiC oxidized to amorphous $SiO_2$, without forming $SiS_2$, owing to the thermodynamic stability of $SiO_2$.

Theoretical Model and Experimental Results of PECVD Amorphous Silicon Deposition Process (PECVD 비정질 실리콘 증착 반응의 이론적 모델과 실험결과)

  • 김진홍;남철우;김성일;김용태
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.27 no.7
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    • pp.1049-1058
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    • 1990
  • Mathematical modeling equations of a parallel plate type reactor were obtained in the PECVD process in preparing hydrogenated amorphous silicon. Velocity profiles, temperature profiles and concentration profiles in the reactor were calculated from the model. The theoretical approach was attempted to obtain the deposition rate and film uniformity at different operating conditions by calculating RF discharge parameters and establishing the reaction mechanisms of a-Si:H thin film. The modelling equations are solved by a finite difference method with control volume balance. The mean electrom energy in discharge was applied to model simulation parameter. The magnitudes of the predicted deposition rate are in good aggrement with those of experiment. The results of computer simulation shows that uniform deposition profiles can.

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Thermal and Structural Design, and Absorption Layer Fabrication of Microbolometer (Microbolometer의 열적.구조적 설계 및 흡수층 공정)

  • Han, Myung-Soo;Park, Young-Sik;An, Su-Chang;Kang, Tai-Young;Lim, Sung-Soo;Lee, Hong-Ki
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.391-392
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    • 2008
  • A surface micromachined uncooled microbolometer based on the amorphous silicon was designed and fabricated. We designed the microbolometer with a pixel size of $35\times35$, $44\times44{\mu}m^2$ and a fill factor of about 70 % by considering such important factors as the thermal conductance, thermal time constant, the temperature coefficient of resistance, and device resistance. Finally, we successfully fabricated the microbolometer by using surface MEMS technology, and the properties of bolometer have been measured as such that TCR and absorptance can be achieved above -2.5%/K and about 90% with titanium layer, respectively.

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A Novel Reactive Sputtered Passivation for Large Size TFT-LCD

  • Kim, Hong-Sik;Lim, Joo-Soo;Hong, Hyun-Seok;Kwack, Hee-Yong;Ahn, Sung-Hoon;Yu, Sang-Jeon;Shin, Jong-Keun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.594-596
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    • 2009
  • Amorphous silicon nitride (a-SiNx) passivation film as a passivation layer of TFT-LCDs was deposited by AC-reactive sputtering at low temperature. As a result, the electrical characteristics and reliability of TFT with novel passivation showed the same level as the conventional TFT. Finally, we have developed 47"Full HD IPS TFT-LCDs with sputtered amorphous silicon nitride. It is suitable for low temperature based applications such as OTFT and Flexible display.

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