• 한국결정성장학회지
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• 제24권1호
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• pp.1-7
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• 2014

질화알루미늄(AlN)은 뛰어난 열적, 전기절연성 특성을 갖고 있어 반도체 기판용 재료나 전자 패키징 재료로 주목받고 있다. 질화알루미늄은 소결온도가 높고 불순물로 인한 물성저하 때문에 고순도화 및 나노원료화가 필수적이다. 본 연구에서는 RF 유도결합 열플라즈마를 이용하여 알루미늄 분말로부터 고순도의 질화알루미늄 나노분말을 합성하였다. Sheath gas로 사용된 암모니아의 유량 제어를 통해 고순도의 질화알루미늄 나노분말이 합성되는 조건을 확립하고자 하였으며 합성된 분말은 XRD, SEM, TEM, BET, FTIR, N-O분석을 통해 특성분석을 진행하였다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.89-93
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• 2018

1200V 이상 급의 전기자동차의 파워 모듈에 적용되는 세라믹 기판은 구동 전력으로 고전력이 인가되는 특성상 고열전도도, 고 전기절연성, 저열팽창계수, 급격한 온도 변화에 대한 저항성의 특성이 요구된다. 방열기판에 적용되는 세라믹 중 질화알루미늄과 질화규소는 그 요구를 충족하는 소재로서 고려되고 있다. 이에 따라 본 논문에서는 질화알루미늄과 질화규소의 방열기판 소재로서의 특성을 상용해석프로그램을 통해 비교하였다. 그 결과 질화규소는 질화알루미늄에 대해 각각 동일한 조건의 열을 부여하는 공정을 시물레이션으로 구현했을 때 스트레스와 휨이 덜 발생하여 더 우세한 내충격성, 내stress성을 보였다. 열전도도 측면에서는 질화알루미늄이 방열 소재로서 더 우수한 특성을 지니지만 신뢰성 측면에서는 질화규소가 더 우세함을 시물레이션을 통해 관찰하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.179-180
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• 2012

Aluminum alloys are widely known as non-ferrous metal with light weight and high strength. Consequently, these materials take center stage in the aircraft and automobile industry. The Al7075 aluminum alloy is based on the Al-Zn-Mg-Cu and one of the strongest wrought aluminum alloys. Aluminum nitride has ten times higher thermal conductivity($319W/m{\cdot}K$) than Al2O3 and also has outstanding electric insulation($1{\times}1014{\Omega}{\cdot}cm$). Furthermore, it has high mechanical property (430 MPa) even though its co-efficient of thermal expansion is less than alumina For these reasons, it has great possibilities to be used for not only the field which needs high strength lightweight but also electronic material field because of its suitability to be applied to the insulator film of PCB or wafer of ceramic with high heat conduction. This paper investigates the mechanical properties and corrosion behavior of aluminum alloy Al7075 deposited with aluminum nitride thin films To improve the surface properties of Al7075 with respect to hardness, and resistance to corrosion, aluminum nitride thin films have been deposited by pulsed DC reactive magnetron sputtering. The pulsed DC power provides arc-free deposition of insulating films.

• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.127-137
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• 2004

We have investigated the structures, the energetic, and the nanomechanics of the single-wall boron-, aluminum-, and gallium-nitride nanotubes using atomistic simulations based on the Tersoff-type potential. The Tersoff-type potential for the III-nitride materials has effectively described the properties of the III-nitride nanotubes. Nanomechanics of boron-, aluminum-, and gallium-nitride nanotubes under the compression loading has been investigated and their Young's moduli were calculated.

• 한국정밀공학회지
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• 제30권12호
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• pp.1237-1243
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• 2013

This study has focused on the effect of ultrasonic vibration table in ELID grinding process of aluminum nitride ceramics. Aluminum nitride ceramics has superior physical and chemical properties and widely used in IC, LSI substrate, package and so on. To achieve the high effective machining of brittle and high strength ceramics as like aluminum nitride, machining method combined ELID grinding and ultrasonic vibration has been adopted in this study. From the experimental results, material removal rate, MRR has been increased maximum 36 percent and spindle resistance has been decreased in using ultrasonic table. Surface roughness of ground surface became a little worse in using ultrasonic table but was somewhat improved in feed direction.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1997년도 한국재료학회 춘계학술발표회
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• pp.31-31
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• 1997

• 한국세라믹학회지
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• 제40권8호
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• pp.720-724
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• 2003

Aluminum nitride (AlN) powders were synthesized by using a mixture of an aluminum nitrate or sulfate salt and carbon (mole ratio of $Al^{3+}$ to carbon=L : 30). The AlN was obtained by calcining the mixture under a flow of nitrogen in the temperature range 1100-1$600^{\circ}C$ and then burning out the residual carbon. The process of conversion of the salt to AlN was monitored by XRD and $^{27}$ Al magic-angle spinning (MAS) NMR spectroscopy. The salt decomposed to ${\gamma}$-alumina and then converted to AlN without phase transition from ${\gamma}$-to-$\alpha$-alumina. $^{27}$ Al MAS NMR spectroscopy shows that the formation of AlN commenced at 110$0^{\circ}C$. AlN powders obtained from the sulfate salt were superior to those from the nitrate salt in terms of homogeneity and crystallinity. A very small amount of AlN whiskers was obtained by calcining a mixture of an aluminum sulfate salt and carbon at 115$0^{\circ}C$ for 40 h, and the growth of the whiskers is well explained by the particle-to-particle self-assembly mechanism.

• 한국분말재료학회지
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• 제13권6호
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• pp.432-438
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• 2006

Aluminum nitride (AlN) nanopowders with low degree of agglomeration and uniform particle size were synthesized by carbothermal reduction of alumina and subsequent direct nitridization. Boehmite powder was homogeneously admixed with carbon black nanopowders by ball milling. The powder mixture was treated under ammonia atmosphere to synthesize AlN powder at lour temperature. The effect of process variables such as boehmite/carbon black powder ratio, reaction temperature and reaction time on the synthesis of AlN nanopowder was investigated.

• 한국세라믹학회지
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• 제41권2호
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• pp.118-124
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• 2004

탄소환원질화법에 의해 합성된 질화알루미늄의 물성은 출발물질의 종류, 액상$.$기상 반응물질의 양, 분위기 그리고 합성온도에 따라서 많은 차이를 나타내었다 질화알루미늄 합성을 위하여 Al원으로는 $\alpha$-A1$_2$O$_3$를 사용하였고 환원제로는 카본 블랙을 사용하였으며, 기상반응을 유도하기 위하여 AlF$_3$를 사용하여 고순도 질소분위기에서 실험을 행하였다. 또한 액상반응 시 미세구조상의 변화를 확인하기 위하여 금속 알루미늄을 첨가하여 실험을 행하였다. 질화알루미늄이 생성과 침상형 휘스커상의 형상은 1$600^{\circ}C$의 온도에서 가장 잘 나타났으며 열처리 온도의 상승은 오히려 휘스커상의 형성을 방해하고 있음을 보여주었다. 침상형 휘스커의 합성에 가장 큰 영향을 주는 것은 기상반응을 일으키는 AlF$_3$ 첨가이며, AlF$_3$의 첨가량이 증가함에 따라 침상형 휘스커상을 확인하였다. 액상반응을 위한 금속 알루미늄 첨가는 전체의 15wt%까지는 침상형 휘스커가 증가하고 있음을 나타내었으나 l5wt% 이상으로 첨가하는 경우 오히려 휘스커가 감소하는 것으로 나타났다.

• Electronic Materials Letters
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• 제14권6호
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• pp.784-792
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• 2018

In this letter, a standard deviation based optimization technique has been applied on High Resolution X-ray Diffraction symmetric and asymmetric scan results to accurately determine the Aluminum molar fraction and lattice relaxation of Molecular Beam Epitaxy grown compositionally graded Aluminum Gallium Nitride (AlGaN)/Aluminum Nitride/Gallium Nitride (GaN) heterostructures. Mathews-Blakeslee critical thickness model has been applied in an alternative way to determine the partially relaxed AlGaN epilayer thicknesses. The coupling coefficient determination has been presented in a different perspective involving sample tilt method by off set between the asymmetric planes of GaN and AlGaN. Sample tilt is further increased to determine mosaic tilt ranging between $0.01^{\circ}$ and $0.1^{\circ}$.