• 제목/요약/키워드: Aluminium metal

검색결과 247건 처리시간 0.027초

초고압 압력용기에서 메탈시일의 설계 안전성에 관한 연구 (A Study on the Design Safety of Metal Seals in High Pressure Vessels)

  • 김청균
    • 한국가스학회지
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    • 제9권1호
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    • pp.26-32
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    • 2005
  • 본 논문에서는 고압용기의 밀봉을 위해 사용하는 메탈시일의 설계 안전성에 대한 연구결과를 제시하고 있다. 기본적으로 고압용기의 1차적 밀봉은 메탈시일에 의해 이루어지고, 2차적 밀봉은 탄성체 고무로 제작된 0-링에 의해 가스누출이 차단된다. 유한요소해석 결과에 의하면, 가스누출 차단을 위해 사용한 알루미늄 소재의 밀봉장치는 강재를 사용한 경우보다 우수한 밀봉성을 보여주고 있다. 이것은 알루미늄 소재의 열팽창 특성이 상대적으로 우수하기 때문이다. 메탈시일과 압력용기 구조물에 걸리는 변형과 응력분포는 외부에서 공급된 가스압보다는 용기 내부에서 전달된 온도차에 의해 크게 지배를 받는 것으로 알려져 있다. 따라서 메탈시일의 소재는 통상적으로 $200^{\circ}C$이하로 유지되는 것이 소재의 강도와 밀봉성 측면에서 안전하다.

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자전고온반응에 의한 적층복합재료의 제조공정 (Fabrication Process of Laminated Composites by Self-propagating High-temperature Synthesis Reaction)

  • 김희연;정동석;홍순형
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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    • pp.155-158
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    • 2002
  • Fabrication process of metal/intermetallic laminated composites by using self-propagating high temperature synthesis(SHS) reactions between Ni and Al elemental metal foils have been investigated. Al foils were sandwiched between Ni foils and heated in a vacuum hot press to the melting point of aluminium. SHS reaction kinetics was thermodynamically analyzed through the final volume fraction of the unreacted Al related with the initial thickness ratio of Ni:Al and diffusion bonding stage before SHS reaction. Thermal aging of laminated composites resulted in the formation of functionally gradient series of intermetallic phases. Microstructure showed that the main phases of intermetallics were NiAl and $Ni_3Al$ having higher strength at room and high temperatures. The volume fractions of intermetallic phases were measured as 82.4, 58.6, 38.4% in 1:1, 2:1, 4:1 initial thickness ratio of Ni:Al.

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이중복합봉 정수압 압출시 접합면 거동에 관한 연구 (A Bonding Surface Behavior of Bi-metal Bar through Hydrostatic Extrusion)

  • 박훈재;나경환;조남선;이용신
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1997년도 춘계학술대회논문집
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    • pp.140-143
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    • 1997
  • The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

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금속박막형 압력세서의 제작과 그 특성 (Fabrication of Metal Thin-Film Pressure Sensor and Its Characteristics)

  • 정귀상;최성규;남효덕;이원재;송재성
    • 한국전기전자재료학회논문지
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    • 제14권5호
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    • pp.405-409
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    • 2001
  • This paper describes fabrication and characteristics of metal thin-film pressure sensor for working at high temperature. The proposed pressure consists of a chrom thin-film, patterned on a Wheat stone bridge configuration, sputter-deposited onto thermally oxidized Si membranes with an aluminium interconnection layer. The fabricated pressure sensor presents a low temperature coefficient of resistance, high-sensitivity, low non-linearity and excellent temperature stability. The sensitivity is 1.097∼1.21mV/V$.$kgf/$\textrm{cm}^2$ in the temperature range of 25∼200$^{\circ}C$ and the maximum non-linearity is 0.43%FS.

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용탕단조법에 의한 AC4A/SiCw 복합재료 제조에 관한 연구(III) - 기계적 특성 - (Fabrication of AC4A/SiCw composite by squeeze casting (III) - Mechanical characteristics -)

  • 문경철;이준희;윤의박
    • 열처리공학회지
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    • 제7권3호
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    • pp.160-168
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    • 1994
  • This was studied about mechanical characteristic of AC4A/SiCw 10-30% reinforced composites. Tensile strength of pressed base metal(base metal) with SiCw preform was higher than without pressed base metal(AC4A). If SiCw whisker volume fraction was increased, tensile strength at room temperature was increased. And tensile strength of SiCw 30% was about $35kg/mm^2$. Tensile strength of SiCw 30 % $400^{\circ}C$ at same time aging was the most excellence, about $40kg/mm^2$. The fracture energy value of composite material at three point bending test was higher than AC4A. Dislocation at matrix of composite material was evenly distributed. But dislocation around whisker of composite material was more existed than matrix. The reasom was thought of pile-up around whisker.

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금속복합재료의 열간압출에 관한 금형설계의 최적화기법(I) (Optimization Techniques of Die Disign on Hot Extrusion Process of Metal Matrix Composites)

  • 강충길;김남환;김병민
    • 소성∙가공
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    • 제6권4호
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    • pp.346-356
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    • 1997
  • The fiber orientation distribution and interface bonding in hot extrusion process have an effect on the maechanical properties of metal matrix composites(MMC's). Aluminium alloy matrix composites reinforced with alumina short fibers are fabricated by compocasting method. MMC's billets are extruded at high temperature through conical and curved shaped dies with various extrusion ratios and temperature. This present study was directed to describe the systematic correlation between extrusion die shape and subsequent results such as fiber breakage, fiber orientation and tensile strength to hot extruded MMC's billet. Extrusion load, tensile strength and hardness for variation of extrusion ratios and temperature are investigated to examine mechanical properties of extruded MMC's SEM fractographs of tensile specimens are observed to analyze the fracture mechanism.

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플라즈몬 효과에 의한 실리콘 기판위에 증착된 반도체 박막의 자기저항특성 (Magnetonic Resistance Properties of Semiconductor Thin Films by Plasmon Effect on Fabricated Si(100) Substrate)

  • 오데레사
    • 반도체디스플레이기술학회지
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    • 제18권3호
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    • pp.105-109
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    • 2019
  • Plasmons have conductive properties using the effect of amplifying magnetic and electric fields around metal particles. The collective movement of free electrons in metal particles induces and produces the generation of plasmon. Because the plasmon is concentrated on the surface of the nanoparticles, it is also called the surface plasmon. The polarizing effect of plasma on the surface is similar to the principle of surface currents occurring in insulators. In this study, it was found the conditions under which plasma is produced in SiOC insulators and studied the electrical properties of SiOC insulators that are improved in conductivity by plasmons. Due to the heat treatment temperature of thin film, plasma formation was shown differently, metal particles were used with normal aluminium, SiOC thin films were treated with heat at 60 degrees, conductivity was improved dramatically, and heat treatment at higher temperatures was found to be less conductivity.

금속착물-셀룰로오스 복합 단열재의 난연 효과 연구 (A Study on the Flame Retardant Effect for Metal Complexes-Cellulose Hybrid Insulator)

  • 김홍;강영구
    • 한국안전학회지
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    • 제10권3호
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    • pp.62-67
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    • 1995
  • The combustion characteristics of cellulose Insulation treated with several metal complexes such as Aluminium hydroxide, Cupric sulfate pentahydrate, Magnesium sulfate heptahydrate, Manganese chloride tetrahydrate and Tnisodium phosphate dodecahydrate are studied to evaluate the effectiveness as a potential flame retardant for cellulosic materials. In this study, we found that LOI values of cellulosic materials treated with the metal complexes are generally increased with the increase of their content. At high concentration, CS(24% ) and SP(24% ) show high LOI values, suggesting resistance to flame spread, The materials examined in this study were found to be relatively more resistance to smouldering and flaming combustion in comparision with untreated cellulosic material. The flammability behavior of the materials exhibits combustion process as follows : LOI$\rightarrow$smouldering region$\rightarrow$smouldering-flaming spread region$\rightarrow$flame spread region.

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Ti 및 Ti계 세라믹스에 의한 Al합금의 표면복합합금화 (Formation of Ti and Ti ceramics composite layer on aluminium alloy)

  • 임병수;문정훈;서창제
    • Journal of Welding and Joining
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    • 제13권1호
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    • pp.103-114
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    • 1995
  • Plasma Transferred arc(PTA) hard facing process has been developed to obtain an overlay weld metal having excellent wear resistance. The effect of Ti, TiSi$_{2}$ and TiC powders addition on the surface of Aluminum alloy 5083 has been investigated with PTA process. This paper describes the result of test the performance of the overlay weld metal. The result can be summarized as follows 1. Intermetallic compound is formed on surface of base metal in Ti or TiSi$_{2}$ powder but the reaction with surface of base metal is little seen in TiC powder. 2. In formation of composite layer on aluminum alloy surface by plasma transferred arc welding process, high melting ceramics like TiC powder is excellent. 3. The multipass welding process is available for formation of high density of powder. But the more number of pass, the less effect of powder, it is considered, and limits of number of pass. 4. By increasing area fraction of TiC powder on Al alloy surface, in especially TiC powder the hardness increase more than 40% area fraction and 88% shows about Hv 700.

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금속/copper(II)-phthalocyanine interface에서의 space charge 연구 (Study of space charge of metal/copper(II)-phthalocyanine interface)

  • 박미화;임은주;유현준;이기진;차덕준;이용산
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.526-530
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    • 2004
  • We report the space charge and the surface potential of the interface between metal and CuPc according to isotropic property and different metal by measuring the microwave reflection coefficients $S_{11}$ of copper(II)-phthalocyanine(CuPc) thin films by using a near-field microwave microscope(NSMM) in order to understand. CuPc thin films were prepared on gold and aluminium substrates using a thermal evaporation method. Two kinds of CuPc thin films were prepared. One was deposited on preheated substrate at $150^{\circ}C$ and the other was annealed after deposition by using thermal evaporation methods. The microwave reflection coefficients $S_{11}$ of CuPc thin films were changed by the dependence on the heat treatment conditions. By comparing reflection coefficient $S_{11}$ we measured electrical conductivity of CuPc thin films and studied this results with respect to the surface potential and space charge of the interface between metal and CuPc thin films.

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