• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1278-1282
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• 2004

수열처리법으로 nano-sized $CeO_2$ 입자를 $Al_3O_3$ 입자의 표면에 균일하게 코팅하여 $AL_2O_3/O_2$ composite 연마 입자를 제조하었다. 제조된 $Al_2O_3\CeO_2$ composite 입자의 뭍성을 TEM, XRD, zeta potential analyzer 및 particle size analyzer로 측징하였다. $Al_2O_3/CeO_2$ composite 입자와 구성된 슬러리와 비교 시료로서 $Al_2O_3$와 $CeO_2$ 입자를 혼합한 슬러리를 사용하여 thermal oxide film에 대한 연마특성을 평가하였다. 연마슬러리에 포함된 $A1_2O_3/CeO_2$ composite 입자와 $Al_2O_3$와 $CeO_2$ 혼합입자에서 나노 크기의 세리아 입자가 sub-micron 크기의 알루미나 입자의 표면에 균일하게 코팅되므로서 $Al_2O_3$ 단일 성분의 슬러리에 비해 removal rate(RR)는 106 nm/min, WIWNU는 $8\sim9%$, roughness는 $2.6{\AA}$의 향상된 연마 특성을 나타내었다. 알루미나 입자의 불규칙한 형상 때문에 $Al_2O3/CeO_2$ composite 슬러리와 $Al_2O_3$ 와 $CeO_2$ 혼합슬러리의 연마 특성이 비슷한 수준을 나타내었다.

• 한국재료학회지
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• 제26권8호
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• pp.430-437
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• 2016

Aluminum oxide ($Al_2O_3$) thin films were grown by atomic layer deposition (ALD) using a new Al metalorganic precursor, dimethyl aluminum sec-butoxide ($C_{12}H_{30}Al_2O_2$), and water vapor ($H_2O$) as the reactant at deposition temperatures ranging from 150 to $300^{\circ}C$. The ALD process showed typical self-limited film growth with precursor and reactant pulsing time at $250^{\circ}C$; the growth rate was 0.095 nm/cycle, with no incubation cycle. This is relatively lower and more controllable than the growth rate in the typical $ALD-Al_2O_3$ process, which uses trimethyl aluminum (TMA) and shows a growth rate of 0.11 nm/cycle. The as-deposited $ALD-Al_2O_3$ film was amorphous; X-ray diffraction and transmission electron microscopy confirmed that its amorphous state was maintained even after annealing at $1000^{\circ}C$. The refractive index of the $ALD-Al_2O_3$ films ranged from 1.45 to 1.67; these values were dependent on the deposition temperature. X-ray photoelectron spectroscopy showed that the $ALD-Al_2O_3$ films deposited at $250^{\circ}C$ were stoichiometric, with no carbon impurity. The step coverage of the $ALD-Al_2O_3$ film was perfect, at approximately 100%, at the dual trench structure, with an aspect ratio of approximately 6.3 (top opening size of 40 nm). With capacitance-voltage measurements of the $Al/ALD-Al_2O_3/p-Si$ structure, the dielectric constant of the $ALD-Al_2O_3$ films deposited at $250^{\circ}C$ was determined to be ~8.1, with a leakage current density on the order of $10^{-8}A/cm^2$ at 1 V.

• 한국전기전자재료학회논문지
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• 제22권5호
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• pp.397-404
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• 2009

Effects of ceramic filler types and dose on the low temperature sintering and dielectric properties of ceramic/$CaO-Al_2O_3-SiO_2$ (CAS) glass composites were investigated. All of the specimens were sintered at $850{\sim}900^{\circ}C$ for 2 h, which conditions are required by the low-temperature co-firing ceramic (LTCC) technology. Ceramic fillers of $CaCO_3$, $Al_2O_3$, $CaCO_3-Al_2O_3$ mixture, and $CaCO_3-Al_2O_3$ compound ($CaAl_2O_4$), respectively, were used. The addition of $Al_2O_3$ yielded the crystalline phase of alumina, which was associated with the inhibition of sintering, while, $CaCO_3$ resulted in no apparent crystalline phase but the swelling was significant. The additions of $CaCO_3-Al_2O_3$ mixture and $CaAl_2O_4$, respectively, yielded the crystalline phases of alumina and anorthite, and the sintering properties of both composites increased with the increase of filler addition and the sintering temperature. In addition, the $CaAl_2O_4$/CAS glass composite, sintered at $900^{\circ}C$, demonstrated good microwave dielectric properties. In overall, all the investigated fillers of 10 wt% addition, except $CaCO_3$, yielded reasonable sintering (relative density, over 93 %) and low dielectric constant (less than 5.5), demonstrating the feasibility of the investigated composites for the application of the LTCC substrate materials.

• 한국세라믹학회지
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• 제25권4호
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• pp.373-379
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• 1988

$\alpha$-Al2O3-15m/o ZrO2 powder was prepared by a sol-gel method from boehmite and zirconium acetate. The transformation temperature of boehmite to $\alpha$-Al2O3 in the system Al2O3-ZrO2 was increased due to the coupled crystallization. On the other hand, the transformation temperature from boehmite to $\alpha$-Al2O3-15m/o ZrO2 could be prepared at 110$0^{\circ}C$ for 100min. The specific surface area of the product of $\alpha$-Al2O3-15m/o ZrO2 was 13.2$m^2$/g.

• 소성∙가공
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• 제8권3호
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• pp.319-319
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• 1999

From isothermal and cyclic oxidation tests on thermomechanically treated Ti-5%Al, Ti47%Al-4%Cr, and Ti-48%Al-2%Cr-2%Nb alloys at 800, 900, 1000℃ in air, it was found that Ti-48%Al-2%Cr-2%Nb and Ti-47%Al-4%Cr had the best and the worst oxidation resistance, respectively. The oxide scales consisted primarily of TiO₂and Al₂O₃, with and without a small amount of dissolved Cr and 7b ions, depending on the alloy composition. These ions were slightly enriched inside the inner oxide layer, and strongly enriched around the scale-matrix interface. The outer TiO₂-rich layer was formed by the outward diffusion of Ti ions, while the inner (TiO₂+A1₂O₃,) mixed layer was formed by the inward transport of oxygen. The outward movement of Al ions farmed the intermediate Al₂O₃-rich Iayer, above talc prepared alloys.

• 한국세라믹학회지
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• 제39권3호
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• pp.315-320
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• 2002

저농도로 희석된 HF 수용액(6 wt%)을 사용하여 $Al(OH)_3$의 표면을 F/Al의 몰비 0.15에서 처리하고, 처리 전후 표면특성을 관찰하였다. 반응계의 온도 및 pH 변화로부터 $Al(OH)_3$에 대한 HF의 표면반응은 HF와 접촉한 $Al(OH)_3$ 표면부에서 metastable한 ${\alpha}$형의 불화알루미늄$({\alpha}-AlF_3{\cdot}3H_2O)$이 안정한 ${\beta}$형의 불화알루미늄$({\beta}-AlF_3{\cdot}3H_2O)$으로 전이되는 과정으로 진행되며, 다량의 발열을 수반하면서 반응계의 온도상승을 유발하였다. 이러한 ${\beta}-AlF_3{\cdot}3H_2O$의 생성은 표면처리된 분말의 FT-IR 및 X-선 회절분석결과를 통해 확인되었다. ${\beta}-AlF_3{\cdot}3H_2O$의 morphology와 분포상태를 SEM을 통해 관찰한 결과 $Al(OH)_3$ 표면에 $1{\mu}m$ 이하의 미세분말 형태로 피복층을 형성하며 균일하게 분포된 것으로 확인되었다. HF로 처리된 시료의 표면 백색도는 미처리에 비해 약 6.6% 증가되었으며, 이는 $Al(OH)_3$보다 높은 백색도를 지닌 ${\beta}-AlF_3{\cdot}3H_2O$ 피복 효과 때문인 것으로 나타났다.

• 한국표면공학회지
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• 제50권1호
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• pp.35-41
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• 2017

$TiO_2$, $Al_2O_3$, and $TiO_2-Al_2O_3$ nanolaminated films were grown by atomic layer deposition (ALD) on the 316L stainless steel (SS316L) substrates at a temperature of $150^{\circ}C$. The growth kinetics of $ALD-TiO_2$ and $Al_2O_3$ thin films were systematically investigated in order to precisely control the thickness of each layers in the $TiO_2-Al_2O_3$ nanolaminated films using a high-resolution transmission electron microscopy. And, the exact deposition rates of $ALD-TiO_2$ on $Al_2O_3$ surface and $ALD-Al_2O_3$ on $TiO_2$ surface were revealed to be 0.0284 nm/cycle and 0.11 nm/cycle, respectively. At given growth conditions, the microstructures of $TiO_2$, $Al_2O_3$ and $TiO_2-Al_2O_3$ nanolaminated films were amorphous. The potentiodynamic polarization test revealed that the $TiO_2-Al_2O_3$ nanolaminated film coated SS316L had a best corrosion resistance, although all ALDcoated SS316L exhibited a clear improvement of the corrosion resistance compared with a bare SS316L.

• 한국세라믹학회지
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• 제31권8호
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• pp.815-822
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• 1994

Sessile drop studies of molten Al on single crystal sapphire substrate were conducted to understand the wetting behavior and interfacial reaction at Al/Al2O3 interface. To investigate the wetting mechanism, the variation in contact angle was determined with time. The contact angle obtained in this study decreased exponentially with time. This result means that the driving force for wetting is the reduction in interfacial energy between liquid Al and sapphire caused by the interfacial reaction. The closer examination revealed that the reaction was the dissolution of sapphire by molten Al. Ti has been frequently used to improve wetting on ceramic materials. Therefore, the influence of Ti content on the wetting behaviour was investigated in this work. The equilibrium wetting angles of pure Al, Al-0.3 wt%Ti, and Al-1.0 wt%Ti at 100$0^{\circ}C$ were 63$^{\circ}$, 59$^{\circ}$, and 54$^{\circ}$respectively. The difference is considered as the result of the change in interfacial energy caused by the reaction between Ti and sapphire and the interfacial reaction formed the reaction products of varying stoichiometry (TiO, Ti2O3, TiO2 etc.).

• 열처리공학회지
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• 제11권3호
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• pp.168-176
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• 1998

The mechanical properties of mechanically alloyed Al-4wt%Mg alloys dispersed with $MgAl_2O_4$ dispersoilds at room and elevated temperatures were investigated. The powders in steady state during mechanical alloying consisted of Mg-supersatu rated Al solid solution and $Al_4C_3$ which resulted from the reaction of Al with C in process control agent (methanol). The hot-extruded materials consisted of uniformly dispersed fine $MgAl_2O_4$, ${\gamma}-Al_2O_3$, $Al_2O_3$ and matrix with extremly fine substructure. Tensile specimens prepared from the extruded bars were tested at room temperature to $400^{\circ}C$ under different strain rates. The tensile strength of alloys at room temperature ranged from 500 to 594MPa. At elevated temperatures, the tensile strengths and elongations decreased with increasing temperature. Adding 3% $MgAl_2O_4$ to Al-4wt%Mg increased the tensile strength of 50MPa at rowan temperature and 20MPa at $400^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.101-104
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• 2004

In this study AlN/Al thin films were prepared at various conditions, such as $N_2$ gas flow rate $[N_2/(N_2+Ar)]$ from 0.6 to 0.9, a substrate temperature ranging from room temperature to $300^{\circ}C$ and working pressure 1mTorr. We estimated crystallographic characteristics and c-axis preferred orientations of AlN/Al thin films as function of Al electrode surface roughfness. The optimal processing conditions for Al electrode were found at substrate temperature of $300^{\circ}C$, sputtering power of 100W and a working pressure of 2mTorr. In these conditions, we obtained the c-axis preferred orientation of $AlN/Al/SiO_2/Si$ thin film about 4 degree.