• Title/Summary/Keyword: AlN layer

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DFabrication of $GdAlO_3$ Buffer Layers by Sol-Gel Processing (졸-겔법에 의한 $GdAlO_3$ 버퍼층의 제조)

  • Bang, Jae-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.5
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    • pp.801-804
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    • 2006
  • [ $GdAlO_3(GAO)$ ] buffer layer for $YBa_2Cu_3O_{7-{\delta}}(YBCO)$ coated superconductor wire was fabricated by sol-gel processing. Precursor solution was prepared by dissolving 1:1 stoichiometric quantaties of gadolinium nitrate hexahydrate and aluminum nitrate nonahydrate in methanol. The solution was spin-coated on $SrTiO_3(STO)$(100) single crystal substrates and heated at $1000^{\circ}C$ for 2h in wet $N_2-5%\; H_2$, atmosphere. A SEM(scanning electron microscopy) observation of the surface morphology of the GAO layer has shown that it has a faceted morphology indicating epitaxy. It was shown from x-ray diffraction(XRB) that GAO buffer layer was highly c-axis oriented epitaxial thin film with both good out-of-plane($FWHM=0.29^{\circ}$ for the (002) reflection) and in-plane ($FWHM=1.10^{\circ}$ for the {112} reflection) alignment.

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Effects of hydrogen gas addition on insulator thin film of Al/AlN/GaAs MIS system fabricated by sputtering method (스퍼터링법으로 저작한 Al/AlN/GaAs MIS 구조에서 절연박막에 수소가스첨가가 미치는 영향)

  • Kwon, Jung-Youl;Kim, Min-Suk;Kim, Jee-Gyun;Lee, Hwan-Chul;Lee, Heon-Yong
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1925-1927
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    • 1999
  • At the study, it has fabricated Al/AlN/GaAs MIS capacitor using DC reactive sputtering method. To applicate GaAs semiconductor in a MIS devices, investigated capability of AIN thin film by the insulator layer. Also it has investigated inversion of C-V characteristics by addition of the hydrogen(hydrogen concentration: 5%) and it has investigated that leakage current has $10^{-8}A/cm^2$ for 1 MV/cm breakdown electric field of I-V characteristics.

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EXPERIMENTAL INVESTIGATION OF FRETTING BEHAVIOR OF TiAlN COATED NUCLEAR FUEL ROD CLADDING MATERIALS

  • Kim, T.H.;Kim, S.S.
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.185-186
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    • 2002
  • Fretting of fuel rod cladding material, Zircaloy-4 tube, in PWR nuclear power plants must be reduced and avoided. Nowadays the introduction of surface treatments or coatings is expected to be an ideal solution to fretting damage since fretting is closely related to wear. corrosion and fatigue. Therefore. in this study the fretting wear experiment was performed using TiAlN coated Zircaloy-4 tube as the fuel rod cladding and uncoated Zircaloy-4 as on of grids, especially concentrating on the sliding component. Fretting wear resistance of TiAlN coated Zircaloy-4 tubes was improved compared with that of TiN coated tubes and uncoated tubes and fretting wear mechanisms were brittle fracture and plastic flow at lower slip amplitude but severe oxidation and spallation of oxidative layer at higher ship amplitude.

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Nitrogen Monoxide Gas Sensing Characteristics of Transparent p-type Semiconductor CuAlO2 Thin Films (투명한 p형 반도체 CuAlO2 박막의 일산화질소 가스 감지 특성)

  • Park, Soo-Jeong;Kim, Hyojin;Kim, Dojin
    • Korean Journal of Materials Research
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    • v.23 no.9
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    • pp.477-482
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    • 2013
  • We investigated the detection properties of nitrogen monoxide (NO) gas using transparent p-type $CuAlO_2$ thin film gas sensors. The $CuAlO_2$ film was fabricated on an indium tin oxide (ITO)/glass substrate by pulsed laser deposition (PLD), and then the transparent p-type $CuAlO_2$ active layer was formed by annealing. Structural and optical characterizations revealed that the transparent p-type $CuAlO_2$ layer with a thickness of around 200 nm had a non-crystalline structure, showing a quite flat surface and a high transparency above 65 % in the range of visible light. From the NO gas sensing measurements, it was found that the transparent p-type $CuAlO_2$ thin film gas sensors exhibited the maximum sensitivity to NO gas in dry air at an operating temperature of $180^{\circ}C$. We also found that these $CuAlO_2$ thin film gas sensors showed reversible and reliable electrical resistance-response to NO gas in the operating temperature range. These results indicate that the transparent p-type semiconductor $CuAlO_2$ thin films are very promising for application as sensing materials for gas sensors, in particular, various types of transparent p-n junction gas sensors. Also, these transparent p-type semiconductor $CuAlO_2$ thin films could be combined with an n-type oxide semiconductor to fabricate p-n heterojunction oxide semiconductor gas sensors.

Influence of thickness ratio and substrate bias voltage on mechanical properties of AlCrN/AlCrSiN double-layer coating (두께 비율과 기판 바이어스 전압이 AlCrN/AlCrSiN 이중층 코팅의 기계적 특성에 미치는 영향)

  • Kim, Hoe-Geun;Ra, Jeong-Hyeon;Lee, Sang-Yul;Han, Hui-Deok
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.162-162
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    • 2017
  • AlCrN 코팅은 높은 경도, 낮은 표면 조도 등의 상온에서의 우수한 기계적 특성 이외에 고온에서 안정한 합금상의 형성으로 인하여 우수한 내열성을 보이는 코팅이며, Si을 첨가하여 나노복합구조를 갖는 AlCrSiN 코팅은 고경도 특성을 나타내는 나노결정립과 고내열성을 나타내는 $Si_3N_4$ 비정질이 동시에 존재함으로써 뛰어난 고온 특성까지 보유하여 공구 코팅으로의 적용 가능성이 크다. 본 연구에서는, 가혹화된 공구사용 환경 대응 하는 더욱 우수한 내마모성 및 내열성을 보이는 코팅막을 개발하기 위해 AlCrN/AlCrSiN 이중층 코팅을 합성하였다. 합성된 코팅의 구조 및 물성을 분석하기 위해 field emission scanning electron microscopy(FE-SEM), nano-indentation, atomic force microscopy(AFM) 및 ball-on-disk wear tester를 사용하였다. 내열성을 확인하기 위하여 코팅을 furnace에 넣어 500, 600, 700, 800, 900도에서 30분 동안 annealing한 후에 nano-indentation을 사용하여 경도를 측정을 하였다. 5:5, 7:3, 9:1의 두께 비율로 AlCrN/AlCrSiN 이중층 코팅을 합성하였으며 모든 코팅의 두께는 $3{\mu}m$로 제어되었다. AlCrN 코팅층의 두께가 증가할수록, 이중층 코팅의 경도 및 내마모성은 점차 향상되었지만 코팅의 밀착력은 감소하였다. 일반적으로 AlCrN 코팅은 상대적으로 높은 잔류응력을 갖고 있으므로, AlCrN 층의 두께비율이 증가함에 따라 코팅내의 잔류응력이 높아져 코팅의 경도는 증가하고 밀착특성은 낮아진 것으로 판단된다. AlCrSiN 상부층 공정시 기판 바이어스 전압을 -50 ~ -200V 로 증가시키면서 이중층 코팅을 합성하였다. XRD 분석 결과, 공정 바이어스 전압이 증가함에 따라 AlCrSiN 상부층은 점차 비정질화 되었고, 코팅의 경도와 표면 특성이 향상되는 것을 확인하였다. 이러한 특성 향상은 높은 바이어스 인가가 이온 충돌효과의 증가를 야기시켰으, 이로 인해 치밀한 코팅층 합성에 의한 결과로 판단된다. AlCrN/AlCrSiN 이중층 코팅을 어닐링 한 후 경도 분석 결과, -150, -200V에서 합성한 코팅은 900도 이상에서 26GPa 이상의 높은 경도를 보인 것으로 보아 우수한 내열성을 갖는 것으로 확인 되었다. 이는 AlCrSiN 상부층의 높은 Si 함량 (11at.%) 으로 인한 충분한 $Si_3N_4$ 비정질상의 형성과, 고바이어스 인가로 인한 AlCrN 결정상과 $Si_3N_4$ 비정질상의 고른 분배가 코팅의 내열성을 향상시키는데 기여를 한 결과로 판단된다.

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Heat dissipation of Al2O3 Insulation layer Prepared by Anodizing Process for Metal PCB (Metal PCB에 있어서 양극산화법으로 제작한 Al2O3절연막의 방열특성)

  • Jo, Jae-Seung;Kim, Jeong-Ho;Ko, Sang-Won;Lim, Sil-Mook
    • Journal of the Korean institute of surface engineering
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    • v.48 no.2
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    • pp.33-37
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    • 2015
  • High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

Gate Field Alleviation by graded gate-doping in Normally-off p-GaN/AlGaN/GaN Hetrojunction FETs (상시불통형 p-GaN/AlGaN/GaN 이종접합 트랜지스터의 게이트막 농도 계조화 효과)

  • Cho, Seong-In;Kim, Hyungtak
    • Journal of IKEEE
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    • v.24 no.4
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    • pp.1167-1171
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    • 2020
  • In this work, we proposed a graded gate-doping structure to alleviate an electric field in p-GaN gate layer in order to improve the reliability of normally-off GaN power devices. In a TCAD simulation by Silvaco Atlas, a distribution of the graded p-type doping concentration was optimized to have a threshold voltage and an output current characteristics as same as the reference device with a uniform p-type gate doping. The reduction of an maximum electric field in p-GaN gate layer was observed and it suggests that the gate reliability of p-GaN gate HFETs can be improved.

Characteristics of Electrical Conduction Mechanism of OLED with Various Temperature (유기 발광 다이오드의 온도에 따른 전도특성)

  • Lee, Dong-Gyu;Kim, Tae-Wan;Lee, Joon-Ung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.05a
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    • pp.197-200
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    • 2005
  • We have studied conduction mechanism that is interpreted in terms of space charge limited current (SCLC) region and tunneling region. The OLEDs are based on the molecular compounds, N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-biphenyl-4,4'-diamine (TPD) as a hole transport, tris (8-hydroxyquinolinoline) aluminum(III) $(Alq_3)$ as an electron injection and transport and emitting layer. We manufactured reference structure that has in $ITO/TPD/Alq_3/Al$. Buffer layer effects were compared to reference structure. And we have analyzed out electrical conduction mechanism in $ITO/Alq_3/Al$ device with various temperature.

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Corrosion behaviors of Cp-Ti and Ti-6Al-4V alloys by TiN coating (TiN 코팅된 Ti 및 Ti-6Al-4V합금의 부식거동)

  • Lee, Soon-Hyun;Jung, Yoong-Hun;Choi, Han-Chul;Ko, Yeong-Mu
    • Journal of Technologic Dentistry
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    • v.30 no.1
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    • pp.25-31
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    • 2008
  • Cp-Ti and Ti-6Al-4V alloys commonly used dental implant materials, particularly for orthopaedic and osteosynthesis because of its suitable mechanical properties and excellent biocompatibility. This alloys have excellent corrosion behavior in the clinical environment. The first factor to decide the success of dental implantation is sufficient osseointegration and high corrosion resistance between on implant fixture and its surrounding bone tissue. In this study, in order to increase corrosion resistance and biocompatibility of Cp-Ti and Ti-6Al-4V alloy that surface of manufactured alloy was coated with TiN by RF-magnetron sputtering method. The electrochemical behavior of TiN coated Cp-Ti and Ti-6Al-4V alloy were investigated using potentiodynamic (EG&G Co, PARSTAT 2273. USA) and potentiostatic test (250mV) in 0.9% NaCl solution at 36.5 $\pm$ 1$^{\circ}C$. These results are as follows : 1. From the microstructure analysis, Cp-Ti showed the acicular structure of $\alpha$-phase and Ti-6Al-4V showed the micro-acicular structure of ${\alpha}+{\beta}$ phase. 2. From the potentiodynamic test, Ecorr value of Cp-Ti and Ti-6Al-4V alloys showed -702.48mV and -319.87mV, respectively. Ti-6Al-4V alloy value was higher than Cp-Ti alloy. 3. From the analysis of TiN and coated layer, TIN coated surface showed columnar structure with 800 nm thickness. 4. The corrosion resistance of TiN coated Cp-Ti and Ti-6Al-4V alloys were higher than those of the non-coated Ti alloys in 0.9% NaCl solution from potentiodynamic test, indicating better protective effect. 5. The passivation current density of TiN coated Cp-Ti and Ti-6Al-4V alloys were smaller than that of the noncoated implant fixture in 0.9% NaCl solution, indicating the good protective effect resulting from more compact and homogeneous layer formation.

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Atomic layer deposited $Al_2O_3$ for the surface passivation of crystalline silicon solar cells ($Al_2O_3$ 부동화 막의 태양전지 응용)

  • Kim, Sun Hee;Shin, Jeong Hyun;Lee, Jun Hyeok;Lee, Hong Jae;Kim, Bum Sung;Lee, Don Hee
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.06a
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    • pp.73.1-73.1
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    • 2010
  • 태양광 시장은 세계적인 금융 위기 속에서도 점점 그 규모가 확대되고 있다. 시장의 규모가 확대되고 있음에도 불구하고 금융 위기를 겪으면서 생산자 중심의 시장에서 수요자 중심의 시장으로 바뀌게 되었다. 이에 따라 더 적은 비용으로 높은 출력의 제품만이 경쟁력을 가지게 됨으로써 효율이 더욱 이슈화되었다. 여러 태양전지 중 가장 점유율이 높은 결정질 태양전지는 일반적인 양산 공정만으로 효율을 높이는데 한계가 있으므로 selective emitter, back contact, light induced plating 등의 새로운 공정을 도입하여 효율을 높이려는 경향이 나타나고 있다. 본 연구에서는, ALD 장치를 사용하여 결정질 태양전지의 후면을 passivation 함으로써 효율을 높이는 방법을 모색하였다. 부동화 층으로는 $Al_2O_3$를 사용하였으며 셀을 제조하여 평가하였다. 실험방법은 p-type의 웨이퍼를 이용하여 습식으로 texturing 후 $POCl_3$ 용액으로 p-n junction을 형성하였고 anti-reflection 막인 SiNx는 PECVD를 사용하여 R.I 2.05, 80nm 두께로 증착하였다. 그런 다음 후면의 n+ layer를 제거하기 위하여 SiNx에 영향을 미치지 않는 용액을 사용하여 후면을 식각하였다. BSF 층은 screen printer로 Al paste를 printing하여 형성하였고 Al etching용액으로 여분의 Al제거한 후 ALD 장치를 이용하여 $Al_2O_3$를 증착하였다. 마지막으로 전극을 형성한 후 laser로 isolation하여 효율을 평가하였다.

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