• 한국전기전자재료학회논문지
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• 제14권2호
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• pp.123-129
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• 2001

The optimal high temperature processing conditions for the formation of Ohmic contact of Ti/Al/Pt/Au multiple layers were established for the fabrication of n$^{+}$-GaN/AlGaN/GaN HFET device. Contact resistivity as low as 3.4x10$^{-6}$ ohm-$\textrm{cm}^2$ was achieved by the annealing of the sample at 100$0^{\circ}C$ for 10 sec. using the RTA (Rapid Thermal Annealing) system. The fabricated HFET (Heterostructure Field Effect Transistor) with a structure of n'-GaN/undoped AlGaN/undoped GaN exhibited a low knee voltage of 3.5 V and a maximum source-drain current density of 180 mA/mm at Vg=0V.V.

• 전기전자학회논문지
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• 제24권4호
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• pp.1117-1121
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• 2020

본 연구에서는, 원자막증착법(ALD) 공정으로 증착된 SnO2 촉매를 AlGaN/GaN 이종접합 FET에 적용하여 NO2 가스 검출이 가능한 것을 확인하였다. AlGaN/GaN-on-si 플랫폼에서 제작 된 HFET 센서로 NO2 100 ppm에 대하여 In-situ SiN이 있는 소자와 없는 소자가 각각 100 ℃, 200 ℃에서 10.1% 및 17.7%, 5.5% 및 38%의 감지성능을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.221-225
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• 2001

In the paper, we report on the DC and Thermal effect of the GaN based HFET. A physics-based a model was applied and found to be useful for predicting the DC performance and Thermal effect of the GaN based HFET by Various substrate. The performance of device on the sapphire substrates is found to be significantly improve compared with that of a device with an sapphire substrate. The peak drain current of the device achieved at HFET on the SiC substrate

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권2호
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• pp.107-112
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• 2005

We present an AlGaN/GaN metal-insulator-semiconductor-heterostructure field effect transistor (MIS-HFET) with an $Al_2O_3-HfO_2$ laminated high-k dielectric, deposited by plasma enhanced atomic layer deposition (PEALD). Based on capacitance-voltage measurements, the dielectric constant of the deposited $Al_2O_3-HfO_2$ laminated layer was estimated to be as high as 15. The fabricated MIS-HFET with a gate length of 102 m exhibited a maximum drain current of 500 mA/mm and maximum tr-ansconductance of 125 mS/mm. The gate leakage current was at least 4 orders of magnitude lower than that of the reference HFET. The pulsed current-voltage curve revealed that the $Al_2O_3-HfO_2$ laminated dielectric effectively passivated the surface of the device.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.221-225
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• 2001

In the paper, we report on the DC and Thermal effect of the GaN based HFET. A physics-based a model was applied and found to be useful for predicting the DC performance and Thermal effect of the GaN based HFET by Various substrate. The performance of device on the sapphire substrates is found to be significantly improve compared with that of a device with an sapphire substrate. The peak drain current of the device achieved at HFET on the SiC substrate

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권6호
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• pp.867-872
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• 2016

We have investigated the channel mobility of AlGaN/GaN-on-Si recessed-metal-oxide-semiconductor-heterojunction field-effect transistors (recessed-MOS-HFET) with $SiO_2$ gate oxide. Both field-effect mobility and effective mobility for the recessed-MOS channel region were extracted as a function of the effective transverse electric field. The maximum field effect mobility was $380cm^2/V{\cdot}s$ near the threshold voltage. The effective channel mobility at the on-state bias condition was $115cm^2/V{\cdot}s$ at which the effective transverse electric field was 340 kV/cm. The influence of the recessed-MOS region on the overall channel mobility of AlGaN/GaN recessed-MOS-HFETs was also investigated.

• 한국재료학회지
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• 제13권12호
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• pp.769-774
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• 2003

In this paper, we report on the DC characteristics of the AlGaN/GaN HFETs using physical models on piezoelectric and thermal effects. Employing the models was found to be essential for a realistic prediction of the DC current-voltage characteristics of the AlGaN/GaN HFETs. Though use of the implementation of the physical models, peak drain current, transconductance, pinch-off voltage, and most importantly, the negative slope in the current were accurately predicted. The importance of the heat sink effect was demonstrated by the comparison of the DC characteristics of AlGaN/GaN HFETs fabricated from different substrates including sapphire, Si and SiC. Highest peak current was achieved from the device with SiC by an effective suppression of heat sink effect.

• 대한전자공학회논문지SD
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• 제38권8호
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• pp.13-19
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• 2001

분자선 결정 성장법을 이용하여 성장된 서로 다른 장벽층의 두께를 갖는 $Al_{0.3}Ga_{0.7}N$ heterojunction field effect transistors (HFETs) 를 제작하여 그 특성을 비교, 관찰하였다. $Al_{0.3}Ga_{0.7}N$층의 두께에 따른 특성의 비교로부터 최적의 2 차원 전자개스 (2 dimensional electron gas) 를 가질 수 있는 $Al_{0.3}Ga_{0.7}N$/GaN HFET 소자 구조를 얻을 수 있었다. $L_g=0.6$ ${\mu}m$ 와 $W_g=34\;{\mu}m$ $Al_{0.3}Ga_{0.7}N$/GaN (20 nm/2 mm) HFET에서 Imax ($V_{gs}=1\;V$) 와 $G_{m,maX}$는 각각 1.155 A/mm 및 250ms/${\mu}m$ 이었으며 $F_t=13$ GHz 와 $F_{max}=48$ GHz의 우수한 고주파 특성을 얻을 수 있었고 2 inch 기판상에서 제작된 소자들은 5% 이하의 매우 균일한 DC 특성을 나타내었다. 이와 더불어 게이트-드레인 간의 간격에 따른 소자의 특성을 관찰함으로서 소자의 항복전압과 고주파 특성과의 상관관계를 고찰하였다.

• 전자공학회논문지
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• 제51권2호
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• pp.33-37
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• 2014

본 논문에서는 AlGaN/GaN HFET의 누설전류 특성을 개선하고자 산화갈륨 희생층 공정을 이용한 새로운 패시베이션 공정을 제안하였다. 오믹 전극 형성시 고온 열처리 과정으로 인해 갈륨의 표면 손상이 불가피하다. 표면 손상을 방지하기 위해 보편적으로 선표면처리 공정을 사용하기도 하지만 이러한 방법만으로는 표면 손상을 완전히 없애기 어렵다. 본 연구에서 새롭게 제안된 산화갈륨 희생층을 이용한 공정 방법은 고온 열처리 후 손상된 표면에 $O_2$ 플라즈마 처리를 통해 산화갈륨층을 형성한 뒤, 염화수소를 이용하여 산화갈륨층을 식각한다. 우수한 상태의 표면 상태를 얻을 수 있었으며, 누설전류의 확연한 감소로 subthreshold slope이 개선되었을 뿐만 아니라 최대 드레인 전류 특성도 594 mA/mm에서 634 mA/mm로 증가하였다. 질화갈륨 희생층 공정의 효과를 분석하기 위해 X-선 광전자 분광법을 이용하여 질화갈륨의 표면 변화에 대해 살펴보았다.

• E2M - 전기 전자와 첨단 소재
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• 제14권11호
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• pp.3-10
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• 2001