• Title/Summary/Keyword: Al-Si

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A study on the fluidity of graphite dispersed Al-Si alloy (흑연(黑鉛)을 분산(分散)시킨 Al-Si 합금(合金)의 유동성(流動性)에 관(關)한 연구(硏究))

  • Kwon, Hyuk-Moo;Shin, Se-Kyoon;Chang, Choong-Kun;Choi, Seung-Pyung
    • Journal of Korea Foundry Society
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    • v.7 no.1
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    • pp.38-44
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    • 1987
  • The spiral fluidity of graphite-dispersed Al-Si alloys has been investigated as a function of contents of Si and graphite, and of particle size of graphite. The dispersion of uncoated graphite is carred out by the vortex process of preheat-treated graphite into molten metal. The fluidity of hyper-eutectic Al-Si alloys is observed to the better than that of hypo-eutectic ones. In the case of graphite-dispersed Al-Si alloys they fluidity increases in hypo-eutectic alloys and decreases in hyper-eutectic ones in comparison with that of the corresponding undispersed alloys. Fluidity decreases with an increase of amount of dispersed graphite particles and inversely proportional to the total surface area of graphite particles.

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Phase Identification of the Interfacial Reaction Product of $SiC_p/Al$ Composite Using Convergent Beam Electron Diffraction Technique (수렴성 빔 전자회절법을 이용한 $SiC_p/Al$ 복합재에서의 계면 생성물의 상분석)

  • Lee, Jung-Ill;Lee, Jae-Chul;Suk, Hyun-Kwang;Lee, Ho-In
    • Applied Microscopy
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    • v.26 no.1
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    • pp.95-104
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    • 1996
  • A comprehensive methodology to characterize the interfacial reaction products of $SiC_p/2024$ Al composites is introduced on the basis of the experimental results obtained using XRD, SEM and TEM. XRD performed on the electrochemically extracted $SiC_p$ and bulk $SiC_p/2024$ Al composite have shown that the interfacial reaction products consist of $Al_{4}C_3$ having hexagonal crystallographic structure, pure eutectic Si having diamond cubic crystallographic structure, and $CuAl_2$, having tetragonal crystalloraphic structure, respectively. According to the images observed by SEM, $Al_{4}C_3$, which has been reported to have needle shape, has a hexagonal platelet-shape and eutectic Si is found to have a dendritic shape. In addition eutectic $CuAl_2$, was observed to form near interface and/or along the grain boundaries. In order to confirm the results obtained by XRD, the primitive cell volume and reciprocal lattice height of such interfacial reaction products were calculated using the data obtained from convergent beam electron diffraction (CBED) patterns, and then compared with theoretical values.

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Characteristics of a-Si:H Multilayer for Contact-type Linear Image Sensor (밀착형 1차원 영상감지소자를 위한 a-Si:H 다층막의 특성)

  • Oh, Sang-Kwang;Kim, Ki-Wan;Choi, Kyu-Man
    • Journal of Sensor Science and Technology
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    • v.1 no.1
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    • pp.5-12
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    • 1992
  • We have fabricated a-Si:H multilayer for contact-type linear image sensor by means of RF glow discharge decomposition method. The ITO/i-a-Si:H/Al structure has relatively high dark current due to indium diffusion and carrier injection from both electrodes, resulting in low photocurrent to dark current. To suppress the dark current and to enhance interface electric field between ITO and i-a-Si:H film we have fabricated ITO/insulator/i-a-S:H/p-a-S:H/Al multilayer film with blocking structure. The photocurrent of ITO/$SiO_{2}(300{\AA})$/i-a-Si:H/p-a-Si:H($1500{\AA}$)/Al multilayer sensor with 5V bias voltage became saturated at about 20nA under $20{\mu}W/cm^{2}$ light intensity, while the dark current was less than 0.1nA. To increase the light generation efficiency we have adopted ITO/$SiO_{x}N_{y}(300{\AA})$/i-a-Si:H/p-a-Si:H($1500{\AA}$)/Al structure, showing photocurrent of 30nA and dark current of 0.08nA with 5V bias voltage. Also the spectral photosensitivity of the multilayer was enhanced for short wavelength visible region of 560nm, compared with that of the a-Si:H monolayer of 630nm. And its photoresponse time was about 0.3msec with the film homogeneity of 5% deviation.

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High-temperature oxidation of Ti3(Al,Si)C2 nano-laminated compounds in air

  • Lee, Hwa-Shin;Lee, Dong-Bok
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2007.11a
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    • pp.147-148
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    • 2007
  • The compound, Ti3(Al,Si)C2, was synthesized by hot pressing a powder mixture of TiCX, Al and Si. Its oxidation at 900 and 1000 oC in air for up to 50 h resulted in the formation of rutile-TiO2, -Al2O3 and amorphous SiO2. During oxidation, Ti diffused outwards to form the outer TiO2 layer, and oxygen was transported inwards to form the inner mixed layer.

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MICROCRYSTALLINE Fe-Si-Al-B THIN RIBBON

  • Sun, Guiqin;Yu, Xiaojun;Zhang, Jikai;Narita, Kenji
    • Journal of the Korean Magnetics Society
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    • v.5 no.5
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    • pp.504-506
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    • 1995
  • By means of adding B into Sendust alloy (Fe-Si-Al) with state of amorphous ribbon, mechnical properties of alloy was improved effectively, and magnetic properties didn't decrease obviously. The optimum adding quantity of B is 0.015-0.03 wt%. The adding of B was thought to give rise to reduction of ordering degree of $Fe_{3}(Si,Al)$ phase of Sedust alloy(Fe-Si-Al-B) and result in improvment of embrittlement of this alloy.

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Effects of Sintering Additives on the Microstructure Development in Silicon Oxynitride Ceramics

  • Kim, Joosun;Chen, I-Wei
    • The Korean Journal of Ceramics
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    • v.6 no.3
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    • pp.224-228
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    • 2000
  • Using a small amount of additives and amorphous Si₂N₂O powders, O-SiAlON ceramics have been hot-pressed and its microstructure and mechanical properties were investigated. Scandium oxide was demonstrated to be an effective densification additive for O-SiAlON. Amorphous Si₂N₂O was densified at relatively low temperatures and a microstructure with acicular grains was developed. Fine grains found in materials obtained from amorphous powders suggest that nucleation and crystallization of O-SiAlOH is relatively easy compared with the Si₃N₄-SiO₂reaction.

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Microstructural Control of Al-Sn Alloy with Addition of Cu and Si (Cu와 Si 첨가에 의한 Al-Sn 합금의 미세조직 제어)

  • Son, Kwang Suk;Park, Tae Eun;Kim, Jin Soo;Kang, Sung Min;Kim, Tae Hwan;Kim, Donggyu
    • Korean Journal of Metals and Materials
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    • v.48 no.3
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    • pp.248-255
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    • 2010
  • The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.