• 제목/요약/키워드: Air-inductors

검색결과 25건 처리시간 0.019초

MEMS에 의한 On-chip 고종횡비 Air Core Solenoid 인덕터의 제작 (Fabrication of Micromachined On-chip High Ratio Air Core Solenoid Inductor)

  • ;김경환
    • 한국전기전자재료학회논문지
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    • 제19권8호
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    • pp.780-784
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    • 2006
  • We present high aspect ratio air-core solenoid inductors with $100{\mu}m\;and\;200{\mu}m$ tall via structures on Pyrex wafer. The effect of various parameters such as different number of turns, via heights, pitch distance between turns on inductor's radio frequency (RF) characteristics have been studied. The highest Q factor we obtained from various solenoid inductors is 72.8 at 9.7 GHz, which was produced by a 3-turn inductor.

열적 증착법을 이용한 air-bridge 제작과 그 응용에 관한 연구 (Studies on Air-bridge fabrication using thermal evaporation method and its aplication)

  • 이일형;김성수;윤관기;김상명;이진구
    • 전자공학회논문지A
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    • 제33A권12호
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    • pp.53-58
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    • 1996
  • In this paper, a simple fabrication technique of an air-bridge for interconnection of isolated electrodes of microwave active and passive devices and MMIC's is proposed. The proposed air-bridge proceses are mainly combinations of thermal evaporation, positive photoresist and image reversal processes for easy lift-off of up to 2.0 .mu.m thick metal. According to the resutls of air-birdge processes, it is confirmed that air-gap and thickness of theair-bridge are about 3.5.mu.m, and 2.0.mu.m, respectively. And it is also possible to make the fine air-bridge with widths of 5~60.mu.m and post-intervals of 25~200.mu.m withot collapse. finally, GaAs power MESFET's and rectangular spiral inductors are fabricatd and measured in order to confirm of feasibility of the proposed air-bridge processes. The MAG of the fabricated power MESFET's is 10dB at 10GHz, and the inductance of the (200.mu. * 6 turns) rectangular spiral inductors 4.5 nH inX-band.

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RFIC를 위한 실리콘 기판에서의 고품질 본드와이어 인덕터 구현 (Implementation of High-Q Bondwire Inductors on Silicon RFIC)

  • 최근영;송병욱;김성진;이해영
    • 대한전자공학회논문지TC
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    • 제39권12호
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    • pp.559-565
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    • 2002
  • 현재 RFIC를 위해 실리콘 기판상에 구현되는 인덕터의 Q 값은 12 이하로 알려져있기 때문에, 고성능 회로설계를 위해서는 더욱 높은 Q 값을 갖는 인덕터의 구현이 필수적이다. 본 논문에서는 본드와이어를 이용하여 높은 Q 값을 가지는 두 개의 인덕터를 제안하였고, 동일한 인덕터에 PGS를 적용하여 총 4가지 형태의 인덕터를 구현하였다. 제안된 본드와이어 인덕터는 일반적인 금속선로보다 넓은 단면적 때문에 상대적으로 작은 도체 손실을 갖고, 인덕터의 상당부분이 공기 중에 위치하므로 기생 캐패시턴스 성분을 줄일 수 있다. 해석 및 측정결과 1.5 GHz 에서 기존의 나선형 인덕터보다 상당히 개선된 15이상의 Q 값을 가짐을 확인하였다. 또한 자동 본딩 머신을 사용하여 구현하기 때문에, 동일한 형태의 인덕터를 반복적으로 쉽게 만들 수 있다.

VPI Varnishing Technology Effects on Frequency Characteristics of an Air Core Inductor Used in LISN Circuit Application

  • Kanzi, Khalil;Kanzi, Majid;Nafissi, Hamidreza
    • Journal of international Conference on Electrical Machines and Systems
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    • 제2권1호
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    • pp.57-64
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    • 2013
  • The functional characteristic of LISN circuit, which is used for measurements of conductive noise in mains power line, is basically related to frequency characteristics of passive elements like inductors used in the circuit as well as the frequency response of inductors is highly related to the resins used in the varnishing process. The significant problem in determination of an inductor's frequency characteristic is the intrinsic resistance, inductance and parasitic capacitance. In this triplet, the parasitic capacitance is the major limiting factor of inductor's frequency range. This capacitance depends on inductor design parameters and materials filling the spaces of coil like resin and its coherency after curing process. In this paper, two similar inductors were designed and built. The first inductor was not varnished while the second one was varnished with VPI technology. VPI, or Vacuum, Pressure, Impregnation technology is one of the most reliable methods performing good insulating conditions for electrical circuits and windings based on resins. The measured results show that implying varnishing technology does not significantly affect the frequency response. However, due to mechanical solidity aspects and improved environmental protection, it is better to varnish the inductors.

습식 식각법으로 제조된 박막 인덕터의 임피턴스 특성 (Impedance Properties of Thin Film Inductors by Fabricated Wet Etching Method)

  • 김현식;송재성;오영우
    • E2M - 전기 전자와 첨단 소재
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    • 제10권8호
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    • pp.813-818
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    • 1997
  • In this study the thin film air core and magnetic core inductors consisting of planar coil and/or CoNbZr amorphous magnetic layers on a Si substrate were fabricated as spiral type by using rf magnetron sputtering and wet etching methods. The etchant solution was achieved by iron chloride solution(17.5 mol%) mixed with HF (20 mol%) during 150 sec which etched Cu films and CoNbZr/Cu/CoNbZr multi-layer films. They were about 10${\mu}{\textrm}{m}$ of thickness and 10$\times$10 mm$^2$of size. The properties of thin film magnetic core inductor were 400 nH of Q value at 10 MHz and the resonance frequency was about 300 MHz.

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Fabrication of Micro-inductor and Capacior For RF MEMS Applications

  • Cho, Bek-Hee;Lee, Jae-Ho;Bae, Young-Ho;Cho, Chan-Sub;Lee, Jong-Hyun
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제2권2호
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    • pp.102-110
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    • 2002
  • In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS(microelectro-mechanical systems) application with high performance and various function. In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro-device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS application with high performance and various functions.

전자기기의 전원 노이즈 저감을 위한 EMI 필터 경험적 설계에 관한 연구 (A study on the Empirical Design of EMI Filters for Power Supply Noise Reduction in Electronic Devices)

  • 이윤민;신진섭
    • 한국인터넷방송통신학회논문지
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    • 제23권4호
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    • pp.59-64
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    • 2023
  • 본 논문은 전자기기에 사용되는 전원의 노이즈 저감을 위한 전도성(Conducted) EMI 필터의 경험적 설계를 통하여 제안하였다. 제안된 구조는 A형, B형, C형, D형의 구조를 설계하였으며, 다양한 X-커패스터와, Y-커패스터, Air-인덕터로 LC 네트워크 사용으로 전도성 노이즈 저감을 확인하였다. L1, L2는 10[μH]를 사용하였으며, C1, C2는 4.7[nF]를 사용하였다. 공통모드(Common Mode)용 L3는 13[μH]를 사용하였으며, C5, C6, C7은 10[nF]을 사용하여 설계하였다. 설계된 EMI 필터의 측정된 삽입손실 값은 3.2MHz에서 -74.4[dB], 4MHz에서 -75.4[dB], 13.56MHz에서 -75.3[dB]로 나타났다. 따라서 제안한 EMI 필터는 다양한 전자기기에 사용되는 전원 노이즈 저감에 이용될 것이다.

폐자로형 평면 인덕터의 제조 및 고주파 특성에 관한 연구 (A Study on the Fabrication and High Frequency Characteristics of Close type Magnetic Planar Inductor)

  • 이창호;신동훈;남승의;김형준
    • 한국자기학회지
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    • 제8권4호
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    • pp.241-248
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    • 1998
  • 본 연구에서는 micro magnetic device의 제작과 특성 분석을 위하여 고주파수 대역에서 사용가능한 자성체의 개발과 meander형 마이크로 코일의 가공 기술 확립에 그 목적을 두었다. 자성체로서는 DC magnetron reactive sputtering system에 의해 제조된 초 미세결정구조를 갖는 FeTaC, FeTaN막을 사용하였으며, 그 자기적 특성은 다음과 같다. Bs:13~17kG, Hc:0.1~0.2Oe, $\mu$':2000~4000. 전기 도금법에 의해 제작된 Cu코일은 2$\mu$$\Omega$-cm의 비저항을 나타내었으며, 공심형 5turn 언덕터의 경우에는 50nH의 인덕턴스와 700MHz의 공진 주파수 그리고 200MHz에서 30의 성능 지수를 보였다. 또한 meandergudxo의 폐자로 인덕터에서 인덕턴스는 150nH, 공진 주파수는 100MHz, 그리고 성능지수는 10~30 MHz에서 4의 값을 나타내었다.

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Power Loss Calculation of High Frequency Transformers

  • Choi Geun-Soo;Yoon Shin-Yong;Baek Soo-Hyun;Kim Yong
    • Journal of Electrical Engineering and Technology
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    • 제1권3호
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    • pp.338-342
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    • 2006
  • This paper analyzed the power loss of transformers considering the magnetic component. For this, each winding strategy and the effect of air gap between the ferrite core have been an important variable for optimal parameter calculation. Inductors are very well known design rules to devise, but the performance of the flyback converter as a function of transformer winding strategy has not been fully developed. The transformer analysis tool used was PExpert. The influence of the insulator thickness, effect of the air gap, how the window height and variation of the capacitive value effects the coil and insulator materials are some of parameters that have been analyzed in this work. The parameter analysis is calculated to a high frequency of 48[kHz]. Therefore, the final goal of this paper was to calculate and adjust the parameters according to the method of winding array and air gap minimizing the power loss.

Coupled Inductor Design Method for 2-Phase Interleaved Boost Converters

  • Liang, Dong;Shin, Hwi-Beom
    • Journal of Power Electronics
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    • 제19권2호
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    • pp.344-352
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    • 2019
  • To achieve high efficiency and reliability, multiphase interleaved converters with coupled inductors have been widely applied. In this paper, a coupled inductor design method for 2-phase interleaved boost converters is presented. A new area product equation is derived to select the proper core size. The wire size, number of turns and air gap length are also determined by using the proposed coupled inductor design method. Finally, the validity of the proposed coupled inductor design method is confirmed by simulation and experimental results obtained from a design example.